Patent application number | Description | Published |
20080266012 | METHOD FOR CONTROLLING HIGH-FREQUENCY RADIATOR - A method for controlling a high-frequency radiator includes the steps of: (a) applying a high-frequency radiation through the solid-state oscillator and the antenna; (b) sensing part of the high-frequency radiation returned from the antenna to the solid-state oscillator; (c) adjusting radiation/propagation conditions for the high-frequency radiation on the basis of the sensed results in the step (b), the high-frequency radiation propagating from the solid-state oscillator to the antenna; and (d) after the step (c), applying the high-frequency radiation through the solid-state oscillator and the antenna to a target object. In the step (c), the oscillation frequency of the solid-state oscillator, the power of the high-frequency radiation applied by the solid-state oscillator, the power supply voltage supplied to the solid-state oscillator, the impedance match between the output impedance of the solid-state oscillator and the impedance of the antenna, or any other condition is changed. | 10-30-2008 |
20090039962 | HIGH FREQUENCY POWER AMPLIFIER AND HIGH FREQUENCY HEATING DEVICE - A high frequency power amplifier includes an amplification element, a harmonic control circuit, an output matching circuit, and a load resistor. A high frequency signal input from an input end is amplified in the amplification element, passes through the harmonic control circuit and the output matching circuit, and is then supplied to the load resistor. The harmonic control circuit includes a first dielectric resonator and a second dielectric resonator. | 02-12-2009 |
20100243645 | SPREAD-SPECTRUM HIGH-FREQUENCY HEATING DEVICE - A variable-frequency oscillator | 09-30-2010 |
20120098598 | HIGH- FREQUENCY POWER AMPLIFIER - A radio frequency power amplifier having a transistor | 04-26-2012 |
20130106519 | RADIO FREQUENCY AMPLIFIER CIRCUIT | 05-02-2013 |
20130176079 | RADIO FREQUENCY POWER AMPLIFIER - A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees. | 07-11-2013 |
20140077345 | SEMICONDUCTOR PACKAGE, METHOD AND MOLD FOR PRODUCING SAME, INPUT AND OUTPUT TERMINALS OF SEMICONDUCTOR PACKAGE - A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface. | 03-20-2014 |
20140191809 | RADIO FREQUENCY AMPLIFIER CIRCUIT - A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal. | 07-10-2014 |
20140239470 | RESIN PACKAGE - A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate. | 08-28-2014 |