Patent application number | Description | Published |
20090095518 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode. | 04-16-2009 |
20090288873 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board is provided. The wiring board includes: a resin substrate having a through-hole therethrough; metal foil patterns formed on the resin substrate; and a first wiring layer formed on the metal foil patterns and on an inner surface of the through-hole, wherein the first wiring layer includes: a first power feeding layer; and a first plated layer laminated on the first power feeding layer; a resin member filled in the through-hole and between adjacent wiring patterns of the first wiring layer, wherein an end surface of the resin member is flush with a surface of the first wiring layer; and a second wiring layer formed on the surface of the first wiring layer and formed to cover an end surface of the through-hole, wherein the second wiring layer includes: a second power feeding layer; and a second plated layer laminated on the second power feeding layer. | 11-26-2009 |
20100139970 | WIRING BOARD HAVING LEAD PIN, AND LEAD PIN - A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion. | 06-10-2010 |
20110283535 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board is provided. The wiring board includes: a resin substrate having a through-hole therethrough; metal foil patterns formed on the resin substrate; and a first wiring layer formed on the metal foil patterns and on an inner surface of the through-hole, wherein the first wiring layer includes: a first power feeding layer; and a first plated layer laminated on the first power feeding layer; a resin member filled in the through-hole and between adjacent wiring patterns of the first wiring layer, wherein an end surface of the resin member is flush with a surface of the first wiring layer; and a second wiring layer formed on the surface of the first wiring layer and formed to cover an end surface of the through-hole, wherein the second wiring layer includes: a second power feeding layer; and a second plated layer laminated on the second power feeding layer. | 11-24-2011 |
20130319740 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively. | 12-05-2013 |
20140182920 | WIRING SUBSTRATE - A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end. | 07-03-2014 |
Patent application number | Description | Published |
20080289750 | Curable Resin Composition, Surface Protection Method, Temporary Fixation Method, and Separation Method - To provide an environmentally-friendly curable resin composition for surface protection, having a high adhesive strength and being capable of forming a protective film which will readily be removed in the film form without adhesive residue in water on a member to be processed, a photocurable adhesive using it, a method for temporarily fixing a member, and a method for removing a protective film. | 11-27-2008 |
20090030107 | ENERGY RAY-CURABLE RESIN COMPOSITION AND ADHESIVE USING SAME - To provide an energy ray-curable resin composition which exhibits equally high adhesive strength to various objects to be bonded, such as glasses, metals and plastics and which has good heat resistance and moisture resistance and is excellent also in rigidity, particularly an energy ray-curable resin composition having a low cure shrinkage and little adhesion strain. | 01-29-2009 |
20090196987 | RESIN COMPOSITION, AND TEMPORARY FIXATION METHOD AND SURFACE PROTECTION METHOD FOR MEMBER TO BE PROCESSED EACH USING THE RESIN COMPOSITION - To provide a resin composition for e.g. a temporary fixing adhesive which has a high adhesive strength and which is readily removable in water, and a temporary fixing method for a member by means thereof. | 08-06-2009 |
20100000670 | ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME - To provide a method for temporarily fixing an optical member suitable for processing of optical members, and an adhesive composition useful for such a method. | 01-07-2010 |
20100012263 | CURABLE COMPOSITION AND METHOD FOR TEMPORAL FIXATION OF STRUCTURAL MEMBER USING THE SAME - To provide a method for temporarily fixing an optical member for processing, and a curable composition useful for such a method. | 01-21-2010 |
20110128023 | PROBE INSPECTING METHOD AND CURABLE RESIN COMPOSITION - Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe. | 06-02-2011 |
20110190414 | ADHESIVE COMPOSITION AND ADHESION METHOD - Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper. | 08-04-2011 |
Patent application number | Description | Published |
20110265934 | ADHERENT COMPOSITION AND METHOD OF TEMPORARILY FIXING MEMBER THEREWITH - Provided are a temporal fixation method in processing of optical members and a resin composition suitable therefore, which uses a composition which is characterized by containing the following (A3), (B3) and (D3), wherein (A3) is a urethane (meth)acrylate; (B3) is one or more (meth)acrylic acid derivative monomers selected from the group consisting of n-(meth)acryloyloxyalkyl hexahydrophthalimides, carboxyl group-containing (meth)acrylates and (meth)acrylic acid derivative monomers represented by the formula (C3): | 11-03-2011 |
20110269868 | CURABLE RESIN COMPOSITION, SURFACE PROTECTION METHOD, TEMPORARY FIXATION METHOD, AND SEPARATION METHOD - To provide an environmentally-friendly curable resin composition for surface protection, having a high adhesive strength and being capable of forming a protective film which will readily be removed in the film form without adhesive residue in water on a member to be processed, a photocurable adhesive using it, a method for temporarily fixing a member, and a method for removing a protective film. | 11-03-2011 |
20120246913 | CURABLE RESIN COMPOSITION, SURFACE PROTECTION METHOD, TEMPORARY FIXATION METHOD, AND SEPARATION METHOD - Provided is a method for protecting the surface of a member to be processed, which comprises providing a protective film made of a photocurable resin composition for surface protection on the surface of the member to be processed, processing the member to be processed, and removing the protective film from the member to be processed, wherein the photocurable resin composition comprises (A) a polyfunctional (meth)acrylate, (B) a monofunctional (meth)acrylate, (C) a resin having a cyclopentadiene skeleton and (D) a photopolymerization initiator, which comprises from 1 to 50 parts by weight of (A), from 5 to 95 by mass of (B) and from 0.1 to 50 parts by mass of (C). | 10-04-2012 |