Patent application number | Description | Published |
20100032832 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - In this semiconductor chip | 02-11-2010 |
20100181667 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided. | 07-22-2010 |
20100265683 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip | 10-21-2010 |
20110001233 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOUNTING METHOD - In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding use resin is placed between the semiconductor device and the board, a void portion is placed at a position corresponding to an edge portion of the semiconductor device in the sealing-bonding use resin. Thus, stress loads generated at corner portions of the semiconductor device due to board flexures for differences in thermal expansion and thermal contraction among the individual members caused by heating and cooling steps in mounting process of the semiconductor device, as well as for mechanical loads after the mounting process, can be absorbed by the void portion and thereby reduced, so that breakdown of the semiconductor device mounted structure is prevented. | 01-06-2011 |
20110061913 | METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE - A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin. | 03-17-2011 |
20120298310 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided. | 11-29-2012 |
20130141881 | DISPLAY DEVICE - In a display device ( | 06-06-2013 |
20130306141 | MULTI-JUNCTION COMPOUND SOLAR CELL, MUTLI-JUNCTION COMPOUND SOLAR BATTERY, AND METHOD FOR MANUFACTURING SAME - The purposes of the present invention are: to eliminate an electrode on a top cell of a multi-junction compound solar cell, said electrode blocking solar light; to provide a multi-junction compound solar cell having a structure that is not easily broken in manufacture steps; and to shorten a manufacture lead time of a multi-junction compound solar battery. A multi-junction compound solar cell has: a multi-junction cell laminate having the top cell and a bottom cell; a transparent electrode, which is disposed on the light incoming surface of the top cell; a lower electrode having potential of the bottom cell; and a side-surface electrode, which is disposed on the side surface of the solar cell with an insulating layer therebetween, and is electrically connected to the transparent electrode. In the multi-junction compound solar cell, the side-surface electrode is led out to the lower electrode. | 11-21-2013 |
20140338726 | SOLAR CELL AND METHOD FOR MANUFACTURING SAME - A solar cell includes: a substrate having heat dissipating characteristics; a solar cell bonded to the substrate such that the solar cell is electrically connected on a first conductive line and a second conductive line, which are disposed on a surface of the substrate; a lens, which is bonded to a transparent electrode of the solar cell; a plurality of projections, which maintain a gap between the substrate and the lens; tapered hole sections in the substrate, each of said tapered hole sections having a tapered section of each of the protruding sections fitted therein; and a sealing resin applied to the gap. | 11-20-2014 |
20150083192 | SOLAR CELL AND METHOD FOR MANUFACTURING SAME - This solar cell has: a substrate having a board-like base, and a first conductive line and a second conductive line, which are disposed on the board-like base; a plurality of multi-junction solar cells, each of which has a lower electrode bonded on and electrically connected to the first conductive line, a cell laminate, which is disposed on the lower electrode, and which includes a bottom cell layer and a top cell layer, a transparent electrode disposed on the upper surface of the top cell layer, and a conductor that connects the transparent electrode to the second conductive line; a glass plate, which has upper portions of the transparent electrodes of the multi-junction solar cells bonded to one surface thereof using an adhesive; and collecting lens, which is disposed on the other glass plate surface with a transparent adhesive therebetween. | 03-26-2015 |
Patent application number | Description | Published |
20100243635 | CERAMIC HEATER AND METHOD FOR PRODUCING SAME - A method for producing a ceramic heater includes performing firing at 1,600° C. to 1,750° C. in a state in which front and back surfaces of an inner shaped body | 09-30-2010 |
20120248716 | METHOD FOR PRODUCING ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK - A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing. | 10-04-2012 |
20130256297 | CERAMIC HEATER, HEATER ELECTRODE, AND METHOD FOR MANUFACTURING CERAMIC HEATER - The electrostatic chuck | 10-03-2013 |
20140284320 | CERAMIC HEATER AND METHOD FOR PRODUCING THE SAME - An electrostatic chuck | 09-25-2014 |