Patent application number | Description | Published |
20090106980 | Process for Producing Bearing Device for Wheel - A method is directed to a production of a bearing device for a wheel including an inner member ( | 04-30-2009 |
20090137326 | Constant velocity joint - A joint outer ring ( | 05-28-2009 |
20100016086 | CONSTANT VELOCITY UNIVERSAL JOINT - In the fixed type constant velocity universal joint, the center of each of the guide grooves of the outer joint member is offset to a position of being spaced apart from the joint central plane to the joint opening side by an axial distance (F), and being spaced apart from the joint central axis line to an opposite side in a radial direction with respect to each of the guide grooves by a radial distance (Fr). Further, the center of each of the guide grooves of the inner joint member is offset to a position of being spaced apart from the joint central plane to a joint innermost side by the axial distance (F), and being spaced apart from the joint central axis line to the opposite side in the radial direction with respect to each of the guide grooves by the radial distance (Fr). | 01-21-2010 |
20100234115 | Constant velocity universal joint - The present invention provides a compact constant velocity universal joint having high strength, and superior operability and durability. In the constant velocity universal joint of the present invention, an offset angle ø | 09-16-2010 |
20100323803 | CONSTANT VELOCITY UNIVERSAL JOINT COMPONENT AND MANUFACTURING METHOD THEREOF - The present invention provides a constant velocity universal joint component and a manufacturing method thereof capable of achieving increased strength without significant procedural changes, and that can contribute to size reduction and weight reduction. In the constant velocity universal joint component of the present invention, a sharp-angled portion | 12-23-2010 |
20110065519 | FIXED UNIFORM-MOTION UNIVERSAL JOINT - Provided is a fixed type constant velocity universal joint of an eight-ball undercut-free type, which is capable of achieving an improvement of torque capacity at a high operating angle while ensuring durability at the time of a low operating angle. In the fixed type constant velocity universal joint of the eight-ball undercut-free type, a center of a track groove ( | 03-17-2011 |
20110136580 | POWER TRANSMISSION SHAFT, DRIVE SHAFT, AND PROPELLER SHAFT - Provided is a power transmission shaft to achieve enhancement of a static torsional strength of a smooth portion. The power transmission shaft according to the present invention includes a torque-transmission teeth portion ( | 06-09-2011 |
20110269555 | OUTER MEMBER OF CONSTANT SPEED UNIVERSAL JOINT - Provided is an outer member of a constant velocity universal joint, which suppresses occurrence of cracking in a joining portion of the constant velocity universal joint and has stable quality. The outer member of the constant velocity universal joint includes: a cup section ( | 11-03-2011 |
Patent application number | Description | Published |
20110003645 | CONSTANT VELOCITY UNIVERSAL JOINT - Provided is a constant velocity universal joint having high strength and capable of suppressing deformation caused by quenching at an opening end portion of a track groove of an outer joint member. In an undercut-free constant velocity universal joint in which a track groove ( | 01-06-2011 |
20110124420 | CAGE FOR CONSTANT VELOCITY UNIVERSAL JOINT AND CONSTANT VELOCITY UNIVERSAL JOINT - To achieve both cost reduction and strength enhancement of a cage by appropriately managing, at the time of forming pockets through a punch-pressing process in a base material made of medium-carbon steel, a size of a secondary fracture portion formed in a shear surface of the base material. Provided is a cage ( | 05-26-2011 |
20120031211 | Shaft Part Formed With A Rolling Groove - A shaft part is formed with a rolling groove ( | 02-09-2012 |
20120211125 | HOLLOW SHAFT AND CONSTANT VELOCITY UNIVERSAL JOINT - Provided are a hollow shaft capable of increasing a static torsional strength and torsional fatigue strength of a small diameter portion (small diameter portion having a smooth outer peripheral surface) formed near a spline at an end portion of the hollow shaft, and capable of reducing cost, and a constant velocity universal joint using the hollow shaft. A hollow shaft ( | 08-23-2012 |
20120220382 | FIXED TYPE CONSTANT VELOCITY UNIVERSAL JOINT - Provided is an eight-ball fixed type constant velocity universal joint of an undercut free type, which is capable of increasing a torque capacity at high operating angles while securing durability at low operating angles. When a distance between a center of a track groove ( | 08-30-2012 |
20130109483 | FIXED-TYPE CONSTANT VELOCITY UNIVERSAL JOINT | 05-02-2013 |
Patent application number | Description | Published |
20090215969 | Epoxy resin composition - Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid. | 08-27-2009 |
20100184923 | EPOXY RESIN COMPOSITION - An epoxy resin composition comprising, containing a solid epoxy resin (A) whose aromatic ring containing ratio is 5-40% obtained by reacting a polyester compound (b) possessing 1.2-1.8 of carboxylic group with a divalent epoxy resin (a) whose epoxy equivalent is 120-350 g/eq and a crosslinking agent (B) as essential components, and since a cured product obtained by curing said composition is superior in heat resistance, humid resistance and cracking resistance, said composition is useful in a field of electron material such as photo semi conductor sealing material, in particular useful for LED sealing. | 07-22-2010 |
Patent application number | Description | Published |
20080285188 | Composite integrated semiconductor device - A composite integrated semiconductor device. In one embodiment, an input surge/noise absorbing circuit absorbs surge from an input signal, an attenuating circuit attenuates the input signal, and an electrical signal converting circuit converts the input signal to an output signal. The input surge/noise absorbing circuit, the attenuating circuit, and the electrical signal converting circuit together form a unit, and a plurality of these units are arranged in parallel in one semiconductor substrate to form the composite integrated semiconductor device, resulting in a reduction in the number of discrete components mounted on a printed circuit board. | 11-20-2008 |
20090104752 | Method for Producing Soi Wafer - The present invention relates to a method for producing an SOI wafer, having at least a step of a bonding heat treatment for increasing bonding strength by heat-treating a bonded wafer obtained by bonding a base wafer and a bond wafer, in which argon is ion-implanted from a surface of either the base wafer or the bond wafer at a dosage of 1×10 | 04-23-2009 |
20090251135 | Method for Evaluating Soi Wafer - The present invention relates to a method for evaluating the SOI wafer in a method for evaluating an SOI wafer in which a sheet resistance of a buried diffusion layer of an SOI wafer that has at least an SOI layer on an insulator layer and has a buried diffusion layer whose impurity concentration is higher than other region of the SOI layer in an interface area with the insulator layer of the SOI layer is evaluated, the method including the steps of measuring a sheet resistance of the whole SOI layer or the whole SOI wafer, and estimating the sheet resistance of the buried diffusion layer by assuming respective layers that compose the SOI wafer to be resistors connected in parallel and converting the measured result of the sheet resistance measurement. As a result of this, there is provided a method for evaluating the SOI wafer that can directly measure the SOI wafer itself to be the product to thereby evaluate the sheet resistance of the buried diffusion layer thereof, without fabricating a monitor wafer. | 10-08-2009 |
20090280620 | Method for Producing Soi Wafer - The present invention is a method for producing an SOI wafer comprising at least a step of forming an ion-implanted damaged layer by ion-implanting a neutral element electrically inactive in silicon from one surface of the base wafer or the bond wafer, in which ion-implanting in the step of forming the ion-implanted damaged layer is performed at a dosage of 1×10 | 11-12-2009 |