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Kazuhiko Yoshida
Kazuhiko Yoshida, Kawagoe-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110107037 | Information Processing Apparatus and Memory Control Method - According to one embodiment, an information processing apparatus includes memory modules, a measuring module, a determination module, and a controller. The measuring module initializes the memory modules when the apparatus has been booted and an operating system of the information processing apparatus has not yet been started, measures a temperature of the memory modules at a time of the initialization, and measures a maximum temperature of each of the memory modules when the operating system is running. The determination module determines a first memory module, which has the least difference between the temperature at the time of the initialization and the maximum temperature at the time when the operating system is running, and a second memory module which has the lowest temperature at the time of the initialization. The controller maps memory addresses allocated to the first memory module in the second memory module, based on the temperatures. | 05-05-2011 |
Kazuhiko Yoshida, Shizuoka JP
| Patent application number | Description | Published |
|---|---|---|
| 20090106980 | Process for Producing Bearing Device for Wheel - A method is directed to a production of a bearing device for a wheel including an inner member ( | 04-30-2009 |
| 20090137326 | Constant velocity joint - A joint outer ring ( | 05-28-2009 |
| 20100016086 | CONSTANT VELOCITY UNIVERSAL JOINT - In the fixed type constant velocity universal joint, the center of each of the guide grooves of the outer joint member is offset to a position of being spaced apart from the joint central plane to the joint opening side by an axial distance (F), and being spaced apart from the joint central axis line to an opposite side in a radial direction with respect to each of the guide grooves by a radial distance (Fr). Further, the center of each of the guide grooves of the inner joint member is offset to a position of being spaced apart from the joint central plane to a joint innermost side by the axial distance (F), and being spaced apart from the joint central axis line to the opposite side in the radial direction with respect to each of the guide grooves by the radial distance (Fr). | 01-21-2010 |
| 20100234115 | Constant velocity universal joint - The present invention provides a compact constant velocity universal joint having high strength, and superior operability and durability. In the constant velocity universal joint of the present invention, an offset angle ø | 09-16-2010 |
| 20100323803 | CONSTANT VELOCITY UNIVERSAL JOINT COMPONENT AND MANUFACTURING METHOD THEREOF - The present invention provides a constant velocity universal joint component and a manufacturing method thereof capable of achieving increased strength without significant procedural changes, and that can contribute to size reduction and weight reduction. In the constant velocity universal joint component of the present invention, a sharp-angled portion | 12-23-2010 |
| 20110065519 | FIXED UNIFORM-MOTION UNIVERSAL JOINT - Provided is a fixed type constant velocity universal joint of an eight-ball undercut-free type, which is capable of achieving an improvement of torque capacity at a high operating angle while ensuring durability at the time of a low operating angle. In the fixed type constant velocity universal joint of the eight-ball undercut-free type, a center of a track groove ( | 03-17-2011 |
| 20110136580 | POWER TRANSMISSION SHAFT, DRIVE SHAFT, AND PROPELLER SHAFT - Provided is a power transmission shaft to achieve enhancement of a static torsional strength of a smooth portion. The power transmission shaft according to the present invention includes a torque-transmission teeth portion ( | 06-09-2011 |
| 20110269555 | OUTER MEMBER OF CONSTANT SPEED UNIVERSAL JOINT - Provided is an outer member of a constant velocity universal joint, which suppresses occurrence of cracking in a joining portion of the constant velocity universal joint and has stable quality. The outer member of the constant velocity universal joint includes: a cup section ( | 11-03-2011 |
Kazuhiko Yoshida, Iwata-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110003645 | CONSTANT VELOCITY UNIVERSAL JOINT - Provided is a constant velocity universal joint having high strength and capable of suppressing deformation caused by quenching at an opening end portion of a track groove of an outer joint member. In an undercut-free constant velocity universal joint in which a track groove ( | 01-06-2011 |
| 20110124420 | CAGE FOR CONSTANT VELOCITY UNIVERSAL JOINT AND CONSTANT VELOCITY UNIVERSAL JOINT - To achieve both cost reduction and strength enhancement of a cage by appropriately managing, at the time of forming pockets through a punch-pressing process in a base material made of medium-carbon steel, a size of a secondary fracture portion formed in a shear surface of the base material. Provided is a cage ( | 05-26-2011 |
| 20120031211 | Shaft Part Formed With A Rolling Groove - A shaft part is formed with a rolling groove ( | 02-09-2012 |
Kazuhiko Yoshida, Chikuma-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20100264510 | SOI (SILICON ON INSULATOR) STRUCTURE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a SOI structure semiconductor device using a SOI substrate, a lattice distortion layer is formed by implanting Ar ions into a silicon substrate as an active layer. The lattice distortion layer is capable of serving as a gettering site. The dose amount of Ar ions is adjusted in such a manner that tensile stress in the lattice distortion layer is equal to or greater than 11 MPa and equal to or less than 27 MPa. Thus, the lattice distortion layer can prevent occurrence of a leakage current while serving as the gettering site. | 10-21-2010 |
Kazuhiko Yoshida, Aichi-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20100119405 | MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM-ALLOY CAST PRODUCT - A magnesium alloy for casting according to the present invention is characterized in that, when the entirety is taken as 100% by mass, it includes copper (Cu) in an amount of from 1% by mass or more to 5% by mass or less, calcium (Ca) in an amount of from 0.1% by mass or more to 5% by mass or less, silver (Ag) in an amount of from 0.1% by mass or more to 5% by mass or less, and the balance comprising magnesium (Mg) and inevitable impurities. | 05-13-2010 |
| 20100209285 | MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM-ALLOY CAST PRODUCT - A magnesium alloy for casting according to the present invention is characterized in that, when the entirety is taken as 100% by mass, it includes copper (Cu) in an amount of from 1% by mass or more to 5% by mass or less, calcium (Ca) in an amount of from 0.1% by mass or more to 5% by mass or less, tin (Sn) in an amount of from 0.1 or more to 3 or less by mass ratio with respect to the Ca (Sn/Ca); and the balance comprising magnesium (Mg) and inevitable impurities. | 08-19-2010 |
Kazuhiko Yoshida, Chiba JP
| Patent application number | Description | Published |
|---|---|---|
| 20090215969 | Epoxy resin composition - Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid. | 08-27-2009 |
| 20100184923 | EPOXY RESIN COMPOSITION - An epoxy resin composition comprising, containing a solid epoxy resin (A) whose aromatic ring containing ratio is 5-40% obtained by reacting a polyester compound (b) possessing 1.2-1.8 of carboxylic group with a divalent epoxy resin (a) whose epoxy equivalent is 120-350 g/eq and a crosslinking agent (B) as essential components, and since a cured product obtained by curing said composition is superior in heat resistance, humid resistance and cracking resistance, said composition is useful in a field of electron material such as photo semi conductor sealing material, in particular useful for LED sealing. | 07-22-2010 |
Kazuhiko Yoshida, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100019271 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): | 01-28-2010 |
Kazuhiko Yoshida, Chikuma JP
| Patent application number | Description | Published |
|---|---|---|
| 20100022038 | Method for evaluating semiconductor wafer - The present invention provides a method for evaluating a semiconductor wafer, including at least: forming an oxide film on a front surface of a semiconductor wafer; partially removing the oxide film to form windows at two positions; diffusing a dopant having a conductivity type different from a conductivity type of a semiconductor as an evaluation target through the windows at the two positions and forming diffused portions in the semiconductor as the evaluation target to form PN junctions; and performing leakage current measurement and/or DLTS measurement in a part between the two diffused portions to evaluate the semiconductor wafer. As a result, there is provided the method for evaluating a semiconductor wafer that can perform junction leakage current measurement or DLTS measurement to easily evaluate a quality of the inside of the semiconductor wafer. In particular, there can be provided the method that can evaluate not only a PW or an EPW but also the inside of an SOI layer of an SOI wafer. | 01-28-2010 |
Kazuhiko Yoshida, Nagano JP
| Patent application number | Description | Published |
|---|---|---|
| 20080285188 | Composite integrated semiconductor device - A composite integrated semiconductor device. In one embodiment, an input surge/noise absorbing circuit absorbs surge from an input signal, an attenuating circuit attenuates the input signal, and an electrical signal converting circuit converts the input signal to an output signal. The input surge/noise absorbing circuit, the attenuating circuit, and the electrical signal converting circuit together form a unit, and a plurality of these units are arranged in parallel in one semiconductor substrate to form the composite integrated semiconductor device, resulting in a reduction in the number of discrete components mounted on a printed circuit board. | 11-20-2008 |
| 20090104752 | Method for Producing Soi Wafer - The present invention relates to a method for producing an SOI wafer, having at least a step of a bonding heat treatment for increasing bonding strength by heat-treating a bonded wafer obtained by bonding a base wafer and a bond wafer, in which argon is ion-implanted from a surface of either the base wafer or the bond wafer at a dosage of 1×10 | 04-23-2009 |
| 20090251135 | Method for Evaluating Soi Wafer - The present invention relates to a method for evaluating the SOI wafer in a method for evaluating an SOI wafer in which a sheet resistance of a buried diffusion layer of an SOI wafer that has at least an SOI layer on an insulator layer and has a buried diffusion layer whose impurity concentration is higher than other region of the SOI layer in an interface area with the insulator layer of the SOI layer is evaluated, the method including the steps of measuring a sheet resistance of the whole SOI layer or the whole SOI wafer, and estimating the sheet resistance of the buried diffusion layer by assuming respective layers that compose the SOI wafer to be resistors connected in parallel and converting the measured result of the sheet resistance measurement. As a result of this, there is provided a method for evaluating the SOI wafer that can directly measure the SOI wafer itself to be the product to thereby evaluate the sheet resistance of the buried diffusion layer thereof, without fabricating a monitor wafer. | 10-08-2009 |
| 20090280620 | Method for Producing Soi Wafer - The present invention is a method for producing an SOI wafer comprising at least a step of forming an ion-implanted damaged layer by ion-implanting a neutral element electrically inactive in silicon from one surface of the base wafer or the bond wafer, in which ion-implanting in the step of forming the ion-implanted damaged layer is performed at a dosage of 1×10 | 11-12-2009 |
Kazuhiko Yoshida, Hokkaido JP
| Patent application number | Description | Published |
|---|---|---|
| 20090177098 | Examination System and Examination Method - The blood flow is examined by making multifractal analysis of a blood flow velocity distribution in a vascular network and detecting a deviation of the blood flow velocity distribution from the multifractal distribution. The blood flow velocity distribution is provided as an image by irradiating laser light to the vascular network, converging, by an imaging lens, scattered laser light rays by blood cells in the blood flowing through blood vessels, detecting, by a photodetector, a speckle pattern produced owing to random interference between the scattered laser light rays and calculating the rate of change with time lapse of each speckle in the speckle pattern. | 07-09-2009 |
Kazuhiko Yoshida, Anjo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120073077 | DUST COLLECTOR - A dust collector for suctioning dust includes: an electric motor for collecting dust; a power supply device that supplies electric power to outside; a parameter detection device that detects a parameter (hereinafter referred to as a “current parameter”) which changes depending on a state of a supplied current supplied by the power supply device; a determination device that determines whether or not a value of the current parameter detected by the parameter detection device satisfies a condition based on a threshold value stored in a first storage unit; and a current supply starting device that starts current supply to the electric motor when it is determined by the determination device that the value of the current parameter satisfies the condition. | 03-29-2012 |
Kazuhiko Yoshida, Fukushima JP
| Patent application number | Description | Published |
|---|---|---|
| 20120082894 | ANODE ACTIVE MATERIAL, SECONDARY BATTERY, ELECTRIC POWER TOOL, ELECTRICAL VEHICLE, AND ELECTRIC POWER STORAGE SYSTEM - A secondary battery includes a cathode, an anode containing an anode active material, and an electrolytic solution. The anode active material contains tin, iron, cobalt, carbon, and titanium as an element. In the anode active material, a carbon content is from 9 mass % to 30 mass % both inclusive, a ratio of cobalt to total of iron and cobalt is from 10 mass % to 80 mass % both inclusive, a ratio of the total of iron and cobalt to total of tin, iron, and cobalt is from 11.3 mass % to 26.3 mass % both inclusive, a titanium content is from 0.5 mass % to 8 mass % both inclusive, and half-width of diffraction peak obtained by X-ray diffraction (peak obtained where diffraction angle of 2θ is from 34 deg to 37 deg both inclusive) is 1 deg or more. | 04-05-2012 |