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| 20080238550 | POWER AMPLIFIER AND TRANSMISSION AND RECEPTION SYSTEM - A power amplifier includes: a first multi-finger FET formed on a semiconductor substrate; a second multi-finger FET formed on the semiconductor substrate; a first temperature detector which detects a channel temperature of the first FET; a second temperature detector which detects a channel temperature of the second FET; a third temperature detector which detects a temperature of the semiconductor substrate; a first detection circuit detecting a difference between an output of the first temperature detector and an output of the third temperature detector and converting the difference to thermoelectromotive force; a second detection circuit detecting a difference between an output of the second temperature detector and the output of the third temperature detector and converting the difference to thermoelectromotive force; and a comparator comparing outputs of the first and second detection circuits with each other to turn on one of the first and second switches and turn off the other. | 10-02-2008 |
| 20080258815 | HIGH FREQUENCY POWER AMPLIFIER AND WIRELESS PORTABLE TERMINAL USING THE SAME - An object is to provide a high frequency power amplifier in which lowering of output power during operation is prevented, influence of thermal noise is suppressed, high frequency operation is stable, and long-term reliability is ensured. The high frequency power amplifier includes a plurality of transistors having gate electrodes, source regions and drain regions, the gate electrodes, source regions and drain regions being respectively connected in common, and a plurality of acoustic reflection layers being buried in portions of the semiconductor substrate, the portions being located between adjacent transistors, the acoustic reflection layers being disposed in a direction which is oblique to a length direction of the gate electrode. | 10-23-2008 |
| 20090021140 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate. | 01-22-2009 |
| 20090134430 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate including an element region having a polygonal shape defined by a plurality of edges, and an isolation region surrounding the element region, and a plurality of gate electrodes provided on the substrate, crossing the element region, arranged in parallel with each other, and electrically connected with each other, wherein at least one of the edges does not cross any of the gate electrodes, and is not parallel to the gate electrodes. | 05-28-2009 |
| 20090243725 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first transistor unit including first field effect transistors with first gate electrodes electrically connected together, first sources electrically connected together, and first drains electrically connected together, the first gate electrodes being electrically connected to the first drains, a second transistor unit including second field effect transistors with second gate electrodes electrically connected together, second sources electrically connected together, and second drains electrically connected together, the second gate electrodes being electrically connected to the first gate electrodes, and dummy gate electrodes electrically isolated from the first gate electrodes and the second gate electrodes. The first gate electrodes, the second gate electrodes, and the dummy gate electrodes are arranged parallel to one another, and at least one dummy gate electrode is located between any one of the first gate electrodes and any one of the second gate electrodes. | 10-01-2009 |
| 20110039359 | Light emitting device and method of manufacturing the same - A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate. | 02-17-2011 |
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| 20080206924 | METHOD FOR FABTRICATING SEMICONDUCTOR DEVICE - According to the first aspect of the present invention, a method for fabricating a semiconductor device with a silicon carbide (SiC) film is comprised of a process to grow a silicon carbide film on a substrate; and a process to form a groove in the periphery of a region on the silicon carbide film in which crystal defects are aggregated. | 08-28-2008 |
| 20080233716 | Method for fabricating semiconductor device - The principal objects of the present invention are to provide structure of a semiconductor device capable of reducing a bowing of a wafer, and a method for fabricating the semiconductor device. The present invention is applied to a semiconductor device, which is fabricated with a semiconductor substrate having a silicon carbide (SiC) film. The method includes the steps of: forming the SiC film on a semiconductor wafer; discriminating a deformation condition of the semiconductor wafer; and forming grooves in the SiC film, the grooves having a shape determined in accordance with the deformation condition of the semiconductor wafer. | 09-25-2008 |
| 20080293245 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device has a semiconductor substrate, a first insulating film formed on a surface of the semiconductor substrate, a first recess formed in the first insulating film, a first barrier film formed on an inner surface of the first insulating film except a top peripheral region of the first trench, a first conductive film formed in the first trench, and a covering film formed on an upper surface and a top peripheral region of the first conductive film and an upper surface of the first barrier film. The first conductive film includes copper. | 11-27-2008 |
| 20090184246 | Infrared detector and fabricating method of infrared detector - There is provided an infrared detector including: a silicon substrate provided with a concave portion; an infrared receiver having a polysilicon layer; and a beam that supports the infrared receiver above the concave portion, and extends along a side of the infrared receiver from the infrared receiver to connect with the silicon substrate, the beam having at least two bent portions, wherein at least one of the bent portions of the beam is disposed at a position on a side opposite to the concave portion with the polysilicon layer as a reference point. | 07-23-2009 |
| 20100006962 | Method of manufacturing a porous structure - Disclosed is a method for fabrication of a porous structure that can prevent release of a protective layer from a semiconductor substrate even if a liquid chemical is used during an anodic oxidation process. The method includes forming an oxide layer on an upper face of the semiconductor substrate. The semiconductor substrate has a diffusion layer in its upper face. The method also includes forming a plurality of contact holes at desired positions of the oxide layer. The method also includes forming a wire in each of the contact holes, and forming an opening between wires to expose a surface of the diffusion layer. The method also includes forming a drain on a peripheral circumference of the opening and depositing a protective film over an entire upper part of the substrate. The protective film fills the drain. The method also includes removing most of the protective film from the opening while leaving behind a part of the protective film on the peripheral circumference of the opening and exposing a certain portion of the diffusion layer. The method also includes applying an anodic oxidation process to the exposed diffusion layer using the remaining protective film as a protective layer. | 01-14-2010 |
