| Patent application number | Description | Published |
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| 20090240107 | APPARATUS FOR INTRODUCTION INTO TEST BODY - An apparatus for introduction into a test body includes a functional portion for obtaining information on an inside of a test body; a power source for supplying power for driving the functional portion; and an enclosed container for accommodating the functional portion and the power source. A cross-sectional shape orthogonal to a longitudinal direction of the enclosed container is an elliptical shape to make an outer shape small to alleviate a burden on a test subject during introduction into a body by swallowing or the like for test. | 09-24-2009 |
| 20090244259 | ENDOSCOPE APPARATUS - An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion. | 10-01-2009 |
| 20100085466 | IMAGE PICKUP UNIT, OPTICAL UNIT, AND MANUFACTURING METHOD FOR THE IMAGE PICKUP UNIT - A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units. | 04-08-2010 |
| 20110199473 | SEMICONDUCTOR APPARATUS AND ENDOSCOPE APPARATUS - An image pickup apparatus according to an embodiment includes: an image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device formed on a second principal surface thereof; a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip; a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board; and a bonding wire that electrically connects the external terminal and the connection pad. | 08-18-2011 |
| Patent application number | Description | Published |
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| 20080217743 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - According to a method of manufacturing a semiconductor device, a short-circuit wiring is formed in a region on a wafer including a dicing region, and electrode pads for input and output signals of a plurality of devices disposed in a semiconductor device forming region are electrically short-circuited by the short-circuit wiring, so that occurrence of plasma damage is suppressed even if the wafer is subjected to various plasma processes. When the wafer subjected to the plasma processes is cut along the dicing region to separate a semiconductor device, the electrical short-circuit of the electrode pads by the short-circuit wiring is released, so that the functionally unwanted short-circuit of the devices or the like is appropriately released. | 09-11-2008 |
| 20080217791 | SEMICONDUCTOR DEVICE - In a semiconductor device of the present invention, an electrode pad is formed on a surface of a semiconductor substrate, and in the electrode pad, two different areas: a connection area of through wiring electrically connected to a through wiring; and a pad area for inspection that keeps away from an opening on the surface of a through hole, are set. Accordingly, the electrode pad can be adequately prevented from being damaged due to contact of a probe, providing a high yield and reliability of the semiconductor device. That is, because the through hole is not opened directly below the pad area for inspection with which the probe is in contact upon operation inspection of devices, a mechanical strength of the electrode pad against the probe can be maintained in a high level. | 09-11-2008 |
| 20080233714 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - An object of the present invention is to provide a method for fabricating a semiconductor device to fabricate a semiconductor device. To achieve such an object, the present invention relates to a method for fabricating a semiconductor device composed of a hetero-junction substrate formed of a semiconductor substrate, and a heterogeneous substrate made of a material other than semiconductor bonded to a surface of the semiconductor substrate. A dicing step of cutting the hetero-junction substrate into semiconductor chips comprises a first dicing step of forming grooves having a depth of at least the thickness of the semiconductor substrate on the surface of the semiconductor substrate; and a second dicing step of cutting the entire hetero-junction substrate along the grooves to divide the hetero-junction substrate into a plurality of semiconductor chips. | 09-25-2008 |
| 20090008732 | SEMICONDUCTOR PACKAGE - A chip-size semiconductor package can respond also to a semiconductor device in which an electrode pad pitch is narrow. A semiconductor package comprises a semiconductor substrate which has a first principal plane and a second principal plane, a circuit element formed on the first principal plane, two or more electrode pads connected to the circuit element provided on the first principal plane, two or more external connection terminals provided on the second principal plane, one or more through holes which reach at the second principal plane from the first principal plane, and two or more through wirings which connect the two or more electrode pads and the two or more external connection terminals through the one or more through holes respectively. | 01-08-2009 |
