Katy

Katy Chen, Kirkland, WA US

Patent application number	Description	Published
20100093379	UNIVERSAL MOBILE DEVICE MESSAGING - A unified messaging system allows the receipt and sending of different messages across devices is established by creating relationships that leverage the capabilities of different devices. A message server establishes a relationship with a mobile device. Through the relationship, the message server can use the mobile device to send different types of messages that the server computer cannot transmit. A relationship between a client and a server extends this capability to the client. Through these relationships, a client can retrieve mobile device messages as well as generate them. The generated mobile device messages are transmitted to the message server. The message server determines that the received messages are mobile device messages that the server cannot deliver and sends the mobile device messages to the user's mobile device. The mobile device receives the mobile device messages from the message server and transmits the mobile device message to recipient mobile devices.	04-15-2010

Patent application number	Description	Published
20100326848	Clip Scoop - A scoop has a bowl and a handle. The bowl has a bowl edge and a bowl width. The handle has a proximal handle edge connecting to the bowl edge. The handle has a distal handle edge opposite the proximal handle edge. The handle has a handle width. The handle has a clip with a clip base which connects the clip base to the distal handle edge. The clip protrudes from the distal handle edge toward the proximal handle edge. The clip has a free edge opposite the clip base. The handle width is from about 50% to about 100% of the bowl width.	12-30-2010
20100326851	Packaged Product with Scoop - A packaged product has (a) a solid product and (b) a scoop for dosing the solid product, and (c) a flexible package containing the solid product and the scoop therein. The scoop has a bowl and a handle. The bowl has a proximal bowl edge. The handle has a proximal handle edge and a distal handle edge. The proximal handle edge connects to the proximal bowl edge. The scoop bowl has a yield point from about 7 MPa to about 70 MPa.	12-30-2010

Patent application number	Description	Published
20090242999	METHOD FOR ENCAPSULATING A HIGH-K GATE STACK BY FORMING A LINER AT TWO DIFFERENT PROCESS TEMPERATURES - Encapsulation of a gate stack comprising a high-k dielectric material may be accomplished on the basis of a silicon nitride material that is deposited in a sequence of two deposition processes, in which the first process may be performed on the basis of a moderately low process temperature, thereby passivating sensitive surfaces without unduly contaminating the same, while, in a second deposition process, a moderately high process temperature may be used to provide enhanced material characteristics and a reduced overall cycle time compared to conventional ALD or multi-layer deposition techniques.	10-01-2009