| Patent application number | Description | Published |
|---|
| 20080302185 | Microstructure Inspecting Apparatus and Microstructure Inspecting Method - Voltage is applied to a chip TP by a voltage drive unit | 12-11-2008 |
| 20080305434 | Developing Apparatus and Developing Method - A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle. | 12-11-2008 |
| 20090026368 | APPARATUS AND METHOD FOR INSPECTING SAMPLE SURFACE - Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device. | 01-29-2009 |
| 20090045039 | Switch Array - A first wiring layer | 02-19-2009 |
| 20090050802 | METHOD AND APPARATUS FOR INSPECTING SAMPLE SURFACE - Provided is a method and an apparatus for inspecting a sample surface with high accuracy. | 02-26-2009 |
| 20090120677 | WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD - A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space. | 05-14-2009 |
| 20090128171 | Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program - An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided. | 05-21-2009 |
| 20090232631 | SUBSTRATE HOLDING APPARATUS, SUBSTRATE TRANSFERRING ROBOT EQUIPPED WITH THE SAME, AND SEMICONDUCTOR PRODUCTION APPARATUS - A substrate holding apparatus includes a base plate with a two-pronged portion, a holding plate arranged above the base plate, a driving portion provided therebetween, a holding portion formed by a tip end of the two-pronged portion and a tip end of the holding plate, and a guide portion provided at the tip end of the two-pronged portion for guiding a part of the substrate. The driving portion includes an urging means for always urging a basal end side of the holding plate upward, an electric magnetic portion for drawing the holding plate toward the base plate, and a bearing portion arranged at on the tip end side of the base plate. The guide portion has a guide groove which comes into contact with a part of a periphery of the substrate. | 09-17-2009 |
| 20090285998 | PLASMA PROCESSING APPARATUS, ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS, AND ELECTRODE PLATE MANUFACTURING METHOD - A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated. | 11-19-2009 |
| 20100032357 | CHROMATOGRAPHY COLUMN AND MANUFACTURING METHOD OF THE SAME - A high separation efficiency column | 02-11-2010 |
| 20100144147 | SAMPLE HOLDING TOOL, SAMPLE SUCTION DEVICE USING THE SAME AND SAMPLE PROCESSING METHOD USING THE SAME - A sample holding tool is provided with a base plate, a plurality of convex portions formed on the base plate so as to stick out from the upper face thereof; and at least one holding plate having a plurality of curved face portions corresponding to the convex portions, with a lower face concave portion of each of the curved face portions being made in contact with the tip portion of each of the convex portions, so that a sample is supported on the upper face convex portion of each of the curved face portions; thus, since the sample is supported by the curved face portion of the holding plate, the contact area to the sample is made very small so that it becomes possible to greatly reduce pointed peak portions, scratches and the like at contact portions between the sample and the curved face portions. Consequently, generation of particles due to abrasion of the sample can be reduced and the particles are reduced from intruding into scratches and voids and occasionally readhering to the sample. | 06-10-2010 |
| 20100216077 | DEVELOPING APPARATUS AND DEVELOPING METHOD - A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle. | 08-26-2010 |
| 20100315073 | MAGNETIC ENCODER APPARATUS AND MANUFACTURING METHOD THEREFOR - Provided are a magnetic encoder apparatus, which can accurately perform angle detection, wherein at very accurate positions, magnetic field detection elements are mounted on a fixed member, and wherein the positions of the magnetic field detection elements are little changed due to temperature, and a method for manufacturing the magnetic encoder apparatus. | 12-16-2010 |
| 20110008545 | FILM FORMING METHOD, FILM FORMING APPARATUS, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS - There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10 | 01-13-2011 |
| 20110058655 | TARGET FOR X-RAY GENERATION, X-RAY GENERATOR, AND METHOD FOR PRODUCING TARGET FOR X-RAY GENERATION - A target for X-ray generation has a substrate and a target portion. The substrate is comprised of diamond and has a first principal surface and a second principal surface opposed to each other. A bottomed hole is formed from the first principal surface side in the substrate. The target portion is comprised of a metal deposited from a bottom surface of the hole toward the first principal surface. An entire side surface of the target portion is in close contact with an inside surface of the hole. | 03-10-2011 |
| 20110162802 | PLASMA PROCESSING APPARATUS, ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS, AND ELECTRODE PLATE MANUFACTURING METHOD - A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated. | 07-07-2011 |
