Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Katsurayama
Koichi Katsurayama, Nagoya-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20080213142 | MEMBRANE REACTOR FOR SHIFT REACTION - There is disclosed a membrane reactor | 09-04-2008 |
| 20080311014 | PERMSELECTIVE MEMBRANE TYPE REACTOR - There is disclosed a permselective membrane type reactor which efficiently forms hydrogen by use of a water-gas shift reaction and which is excellent in an aspect of manufacturing cost. In a permselective membrane type reactor | 12-18-2008 |
Mamoru Katsurayama, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20120031791 | CASE - A rolled object whose core juts from the respective end portions is housed. End face wall components which support the core so as to horizontally suspend the rolled object and side wall components which connect the end face wall components with each other and cause the end face components to be provided on the respective sides of the rolled object in horizontal directions are provided. Each of the side wall components has a vertically-provided planar wall portion and a jutting portion which is formed horizontally across the wall portion at a vertical central portion of the wall portion and juts to be able to surface-contact a circumferential surface of the rolled object. | 02-09-2012 |
Satoru Katsurayama, Tochigi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100129960 | METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a method for bonding semiconductor wafers of the present invention, a bonding layer containing a flux-active curing agent and a thermosetting resin is interposed between a first semiconductor wafer and a second semiconductor wafer, thereby producing a semiconductor wafer stacked body in which the first and second semiconductor wafers are stacked together, and then the semiconductor wafer stacked body is compressed in a thickness direction thereof while heating it so that the first and second semiconductor wafers are fixed together by melting and solidifying solder bumps while curing the thermosetting resin, thereby producing a semiconductor wafer bonded body in which first connector portions and second connector portions are electrically connected together through solidified products obtained by melting and solidifying the solder bumps. | 05-27-2010 |
Satoru Katsurayama, Shinagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100059872 | Adhesive Tape, Connected Structure and Semiconductor Package - An adhesive tape | 03-11-2010 |
Satoru Katsurayama, Shinagawa-Ku JP
| Patent application number | Description | Published |
|---|---|---|
| 20120156502 | ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa·s, and the adhesive film satisfies the following formula (1) when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss temperature by thermogravimetry of the adhesive film is defined as (b), | 06-21-2012 |