Patent application number | Description | Published |
20080214094 | METHOD FOR MANUFACTURING SILICON WAFER - A method for manufacturing a silicon wafer comprises a slicing step of a silicon single crystal ingot to obtain sliced wafers, a single-side grinding step to grind only one side of a wafer, and a smoothing step to smooth the other side of the wafer by controlling application of etchant depending on surface profile of the other side of the wafer. According to a method of the present invention a silicon wafer that has high flatness, is removed machine working damage, and is reduced of profile change of chamfer to be minimal can be manufactured. | 09-04-2008 |
20080314951 | Gas Combustion Type Striking Tool - In a gas combustion type striking tool which strikes a fastener supplied in a nose portion into a member to be fastened by burning mixed gas inside a combustion chamber above a striking cylinder in accordance with a pulling operation of a trigger lever to drive a striking piston and a driver by a pressure of the combustion gas thus generated, a topper is disposed so as to be able to protrude into a path of a feed pawl or a feed piston, and a stopper engaging member, which extends downward from the striking cylinder and is movable in a vertical direction, engages with the stopper when the stopper engaging member moves downward, thereby retracting the stopper from the path. | 12-25-2008 |
20080314952 | Driving Piston Maintaining Structure in Gas Nailer - A gas nailer is provided with a driving cylinder | 12-25-2008 |
20090004876 | Method for Etching Single Wafer - An object of the present invention is to provide a method for etching a single wafer, which effectively realizes a high flatness of wafer and an increase in productivity thereof. In a method for etching a single wafer, a single thin disk-like wafer sliced from a silicon single crystal ingot is spun, and a front surface of the wafer is etched with an etching solution supplied thereto. In the method, a plurality of supply nozzles are disposed above and opposite to the front surface of the wafer at different portions in the radial direction of the wafer, respectively; and then one or more conditions selected from the group consisting of temperatures, kinds, and supply flow rates of etching solutions from the plurality of supply nozzles are changed. | 01-01-2009 |
20090032564 | Gas combustion type striking tool - A front portion of a feed cylinder of a feed piston-cylinder mechanism is communicated with a combustion chamber, and a rear portion of the feed cylinder is sealed. A check valve and a spring which constantly biases a feed piston toward a nail feed direction in the forward direction are provided. An opening valve communicating with the rear portion of the feed cylinder is provided. The opening valve is opened after or just before a completion of a returning operation of a striking piston. | 02-05-2009 |
20090042390 | ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME - It is possible to reduce workloads of a both-side simultaneous polishing process or a single-side polishing process, and to achieve both of the maintenance of the wafer flatness and the reduction in wafer front side roughness upon completing a flattening process. A method for manufacturing silicon wafers according to the present invention includes a flattening process | 02-12-2009 |
20090053894 | Method for Manufacturing Epitaxial Wafer - A method for manufacturing an epitaxial wafer that can reduce occurrence of a surface defect or a slip formed on an epitaxial layer is provided. The manufacturing method is characterized by comprising: a smoothing step of controlling application of an etchant to a wafer surface in accordance with a surface shape of a silicon wafer to smooth the wafer surface; and an epitaxial layer forming step of forming an epitaxial layer formed of a silicon single crystal on the surface of the wafer based on epitaxial growth. | 02-26-2009 |
20090057365 | Gas Combustion type driving tool - In a gas combustion type driving tool, on a feed cylinder | 03-05-2009 |
20090071999 | GAS COMBUSTION TYPE DRIVING TOOL - By moving a movable sleeve | 03-19-2009 |
20090117749 | Etching Method of Single Wafer - Local shape collapse of a wafer end portion is suppressed to the minimum level, and a wafer front surface as well as a wafer end portion is uniformly etched while preventing an etchant from flowing to a wafer rear surface. | 05-07-2009 |
20090181546 | Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof - A single-wafer etching apparatus according to the present invention supplies an etchant to an upper surface of a wafer while rotating the wafer, thereby etching the upper surface of the wafer. Further, wafer elevating means moves up and down the wafer, and a lower surface blow mechanism which blows off the etchant flowing down on an edge surface of the wafer toward a radially outer side of the wafer by injection of a gas is fixed and provided without rotating together with the wafer. Furthermore, gap adjusting means controls the wafer elevating means based on detection outputs from gap detecting means for detecting a gap between the wafer and the lower surface blow mechanism, thereby adjusting the gap. The apparatus according to the present invention uniformly etches the edge portion without collapsing a chamfered shape of the edge portion of the wafer, and prevents a glitter from being produced on the edge surface of the wafer. | 07-16-2009 |
20090255973 | GAS COMBUSTION TYPE DRIVING TOOL - When gas is explosively burnt within a combustion chamber | 10-15-2009 |
20100021688 | WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD - A wafer manufacturing method includes after flattening both upper and lower surfaces of a wafer sliced from a single crystal ingot, processing the wafer having damage on both surfaces caused by the flattening, so as to obtain desired damage at least on the lower surface of the wafer, the desired damage having a damage depth ranging from 5 nm-10 μm; forming a polysilicon layer at least on the lower surface of the wafer while the damage on the lower surface of the wafer remains; single-wafer etching the upper surface of the wafer; and final polishing the upper surface of the wafer to have a mirrored surface, after the single-wafer etching. | 01-28-2010 |
20100032467 | GAS COMBUSTION TYPE DRIVING TOOL - A gas combustion type driving tool is provided with two modes including: a contact mode in which a contact arm | 02-11-2010 |
20100151597 | METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR - Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface. | 06-17-2010 |
20100176175 | GAS COMBUSTION-TYPE DRIVING TOOL - In a feed piston/cylinder mechanism | 07-15-2010 |
20100327038 | GAS COMBUSTION TYPE DRIVING TOOL - A gas combustion type driving tool includes a feed piston/cylinder mechanism | 12-30-2010 |
20120160869 | GAS CARTRIDGE - In a gas cartridge, inside of a metal made outer can | 06-28-2012 |