| Patent application number | Description | Published |
|---|
| 20090021923 | Method for Producing Planar Insulating Layers With Breakthroughs at the Correct Position by Means of Laser Cutting and Devices Produced Accordingly - In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips. | 01-22-2009 |
| 20090029035 | Method for Selectively Producting Film Laminates for Packaging and for Insulating Unpackaged Electronic Components and Functional Patterns and Corresponding Device - A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices. | 01-29-2009 |
| 20090109024 | Hardware Protection System For Deep-Drawn Printed Circuit Boards, As Half-Shells - A circuit which is to be protected contains a substrate which includes a recoiling area is surrounded by protruding areas. A hardware protection system is provided as half-shells and includes conductor structures arranged on and/or in the substrate to detect access to the circuit which is protected. | 04-30-2009 |
| 20100133577 | Method for producing electronic component and electronic component - A plurality of chips disposed in a wafer on a passivated main side, having at least one chip contact surface, is provided with an insulation layer. The insulation layer has openings in the area of the at least one chip contact surface of each chip. The chip contact surfaces of each chip are provided with a chip contact surface metallization of a prescribed thickness, and the chips disposed in the water are separated therefrom. | 06-03-2010 |
| 20100187700 | Method and apparatus for manufacturing an electronic module, and electronic module - A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface. | 07-29-2010 |
| 20100208438 | Method for the Production and Contacting of Electronic Components by Means of a Substrate Plate, Particularly a DCB Ceramic Substrate Plate - One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part. | 08-19-2010 |
| 20100289152 | Strip conductor structure for minimizing thermomechanocal loads - A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor. | 11-18-2010 |
| 20110107594 | PLANAR ELECTRICAL POWER ELECTRONIC MODULES FOR HIGH-TEMPERATURE APPLICATIONS, AND CORRESPONDING PRODUCTION METHODS - With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component ( | 05-12-2011 |
