Patent application number | Description | Published |
20080203484 | FIELD EFFECT TRANSISTOR ARRANGEMENT AND METHOD OF PRODUCING A FIELD EFFECT TRANSISTOR ARRANGEMENT - A field effect transistor arrangement and a fabrication method thereof. The field effect transistor arrangement includes: a substrate having a first crystal surface orientation; a first layer formed above at least a first portion of the substrate, the first layer having a second crystal surface orientation different from the first crystal surface orientation; a second layer formed above at least a second portion of the substrate and adjacent to the first layer, the second layer having the first crystal surface orientation; a first buried oxide layer formed between the first layer and the substrate; a second buried oxide layer formed between the second layer and the substrate; a first field effect transistor formed in or on the first layer, the first field effect transistor having a first conductivity type; and a second field effect transistor formed in or on the second layer, the second field effect transistor having a second conductivity type different from the first conductivity type. | 08-28-2008 |
20100041185 | METHOD OF PRODUCING A FIELD EFFECT TRANSISTOR ARRANGEMENT - A method of producing a field effect transistor arrangement. A substrate having a first crystal surface orientation is provided. A first layer is formed above a first portion of the substrate, the first layer having a second crystal surface orientation different from the first crystal surface orientation. A second layer is formed on at least a second portion of the substrate and adjacent to the first layer, the second layer having the first crystal surface orientation. A first buried oxide layer is formed between the substrate and the first layer. Micro-cavities are formed in the second layer and oxidizing the micro-cavities, thereby forming a second buried oxide layer between the substrate and the second layer. A first field effect transistor of a first conductivity type is formed in or on the first layer. A second field effect transistor of a second conductivity type is formed in or on the second layer. | 02-18-2010 |
20100084693 | Method of Forming a Semiconductor Device and Semiconductor Device Thereof - According to one embodiment of the present invention, a method of forming a semiconductor device is provided, the method including: forming a substrate; forming a first gate on the substrate; forming a mask layer on the substrate, the mask layer including a first window covering an area within which the first gate is formed so that the first gate divides the substrate exposed by the first window into a first region and a second region; and doping the exposed substrate using rays inclined with respect to the substrate top surface, where the position of the first gate with respect to a border of the first window is chosen such that the inclined doping rays impinge more on the first region than on the second region. | 04-08-2010 |