Patent application number | Description | Published |
20080251877 | METHODS FOR FABRICATING COMPLEX MICRO AND NANOSCALE STRUCTURES AND ELECTRONIC DEVICES AND COMPONENTS MADE BY THE SAME - This invention provides processing steps, methods and materials strategies for making patterns of structures for electronic, optical and optoelectronic devices. Processing methods of the present invention are capable of making micro- and nano-scale electronic structures, such as T-gates, gamma gates, and shifted T-gates, having a selected non-uniform cross-sectional geometry. The present invention provides lithographic processing strategies for sub-pixel patterning in a single layer of photoresist useful for making and integrating device components comprising dielectric, conducting, metal or semiconductor structures having non-uniform cross-sectional geometries. Processing methods of the present invention are complementary to conventional microfabrication and nanofabrication platforms, and can be effectively integrated into existing photolithographic, etching and thin film deposition patterning strategies, systems and infrastructure. | 10-16-2008 |
20090023098 | METHOD FOR FABRICATING DUAL DAMASCENE PROFILES USING SUB PIXEL-VOTING LITHOGRAPHY AND DEVICES MADE BY SAME - This invention provides processing steps, methods and materials strategies for making patterns of structures for integrated electronic devices and systems. Processing methods of the present invention are capable of making micro-and nano-scale structures, such as Dual Damascene profiles, recessed features and interconnect structures, having non-uniform cross-sectional geometries useful for establishing electrical contact between device components of an electronic device. The present invention provides device fabrication methods and processing strategies using sub pixel-voting lithographic patterning of a single layer of photoresist useful for fabricating and integrating multilevel interconnect structures for high performance electronic or opto-electronic devices, particularly useful for Very Large Scale Integrated (VLSI) and Ultra large Scale Integrated (ULSI) devices. Processing methods of the present invention are complementary to conventional microfabrication and nanofabrication methods for making integrated electronics, and can be effectively integrated into existing photolithographic, etching, and thin film deposition patterning systems, processes and infrastructure. | 01-22-2009 |
20090239042 | Material Assisted Laser Ablation - This invention provides photoablation—based processing techniques and materials strategies for making, assembling and integrating patterns of materials for the fabrication of electronic, optical and opto-electronic devices. Processing techniques of the present invention enable high resolution and/or large area patterning and integration of porous and/or nano- or micro-structured materials comprising active or passive components of a range of electronic devices, including integrated circuits (IC), microelectronic and macroelectronic systems, microfluidic devices, biomedical devices, sensing devices and device arrays, and nano- and microelectromechanical systems. | 09-24-2009 |
20090296188 | Energy-Efficient Optoelectronic Smart Window - In an aspect, described herein is a dynamically controllable optoelectronic smart window which utilizes a diffraction grating for selective transmission or rejection of a specific region of the electromagnetic spectrum, for example the infrared, near-infrared and/or visible regions. Window embodiments described herein may further utilize a selectively controlled and/or patterned total internal reflection layer to assist with the selective rejection of a specific spectral region while allowing for transmission of another specific spectral region. In another aspect, the present invention provides methods for dynamically controlling the transmission or rejection of solar near-infrared and/or visible radiation. | 12-03-2009 |
20100143848 | PATTERNING METHODS FOR STRETCHABLE STRUCTURES - Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm | 06-10-2010 |
20100255426 | MIRROR ARRAYS FOR MASKLESS PHOTOLITHOGRAPHY AND IMAGE DISPLAY - Micromirrors and micromirror arrays described herein are useful, for example in maskless photolithography systems and methods and projection display devices and methods. According to one aspect, the micromirrors comprise a polymer structural layer and a reflective dielectric multilayer for selective reflection and/or redirection of incoming electromagnetic radiation. According to another aspect, incorporation of a reflective dielectric multilayer allows for use of polymer structural materials in micromirrors and prevents damage to such polymer materials due to excessive heating from absorption of electromagnetic radiation, as the reflective dielectric multilayers are highly reflective and minimize heating of the micromirror components. According to yet a further aspect, top down fabrication methods are described herein for making a micromirror comprising a polymer structural layer and a reflective dielectric multilayer. | 10-07-2010 |
20120307352 | Energy-Efficient Smart Window System - Energy-efficient windows incorporating spectrally selective optical elements capable of providing desirable optical characteristics (transmission, reflection, refraction or diffraction) for different wavelengths are disclosed herein. More specifically, energy-efficient windows incorporating suitably designed diffraction gratings to optimize the efficiency of the utilization of different spectral components of the solar radiation are disclosed. | 12-06-2012 |
20140134404 | METHOD FOR FABRICATING DUAL DAMASCENE PROFILES USING SUB PIXEL-VOTING LITHOGRAPHY AND DEVICES MADE BY SAME - This invention provides processing steps, methods and materials strategies for making patterns of structures for integrated electronic devices and systems. Processing methods of the present invention are capable of making micro- and nano-scale structures, such as Dual Damascene profiles, recessed features and interconnect structures, having non-uniform cross-sectional geometries useful for establishing electrical contact between device components of an electronic device. The present invention provides device fabrication methods and processing strategies using sub pixel-voting lithographic patterning of a single layer of photoresist useful for fabricating and integrating multilevel interconnect structures for high performance electronic or opto-electronic devices, particularly useful for Very Large Scale Integrated (VLSI) and Ultra large Scale Integrated (ULSI) devices. Processing methods of the present invention are complementary to conventional microfabrication and nanofabrication methods for making integrated electronics, and can be effectively integrated into existing photolithographic, etching, and thin film deposition patterning systems, processes and infrastructure. | 05-15-2014 |