Patent application number | Description | Published |
20110075374 | RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided. | 03-31-2011 |
20110240346 | HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. | 10-06-2011 |
20110303437 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element. | 12-15-2011 |
20110303440 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 12-15-2011 |
20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
20120000697 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer. | 01-05-2012 |
20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. | 03-22-2012 |
20120073863 | ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member. | 03-29-2012 |
20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
20130042963 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 02-21-2013 |
20130062744 | POWER MODULE PACKAGE - Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate. | 03-14-2013 |
20140096380 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 04-10-2014 |
Patent application number | Description | Published |
20100314755 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided. | 12-16-2010 |
20110061231 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 03-17-2011 |
20140090245 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 04-03-2014 |
Patent application number | Description | Published |
20090248032 | INSERTING DEVICE OF ARTIFICIAL BLOOD STENT - An artificial blood stent insertion device is disclosed. The front end portion, middle portion and rear end portion of the artificial blood stent | 10-01-2009 |
20100049302 | STENT FOR EXPENDING INTRA LUMINAL - The present invention relates to a stent for intraluminal expansion. The stent for intraluminal expansion comprises an inner stent A, an outer stent B and fixing threads C for fixing these stents as one unit. The outer stent B is inserted over the inner stent A in such a way that the space portions of the inner stent A and the space portions of the outer stent B are alternated with each other, so the outer surface of the inner stent and the inner surface of the outer stent are in close contact with each other, and both ends of the outer stent and inner stent are fixed as one unit by fixing threads C. According to the stent for intraluminal expansion of the present invention, in which form recoverability of each of the inner stent A and the outer stent B is excellent, expansion is easy after it is inserted into the lumen body because the cylindrical film membrane is not fixed by fixing thread C, and the space portions Id of the inner and outer stents are overlapped alternately with each other so that it is possible to effectively prevent cancer cells, etc. from penetrating into the lumen. | 02-25-2010 |
20110029062 | STENT USED IN BLOOD VESSEL - The present invention discloses a stent for a blood vessel. The stent for a blood vessel comprises (i) an artificial blood vessel A made of fabric; (ii) an upper cylindrical stent B made of wires having a body B | 02-03-2011 |
20110125254 | DRUG RELEASING MEMBRANE FOR STENT AND DRUG RELEASING STENT FOR EXPANDING INTRALUMINAL COMPRISING THE SAME - The present invention relates to a drug releasing membrane for stent and a drug releasing stent for intraluminal expansion comprising the same. The drug releasing membrane according to the present invention has a two layer structure consisting of an inner layer M | 05-26-2011 |
Patent application number | Description | Published |
20100311158 | DEVICE AND SYSTEM FOR CULTURING CELLS AND METHOD OF CULTURING CELLS USING THE SAME - The present invention provides a device for culturing cells. The device includes a well and a membrane. The well has an internal space and a membrane actuating control channel. The internal space has an inlet and an outlet. The membrane is provided between the membrane actuating control channel and the internal space such that the membrane actuating control channel is isolated from the internal space. The membrane is elastically varied in shape to form a three-dimensional cell culture space in the internal space. | 12-09-2010 |
20100321045 | Device And System For Measuring Properties Of Cells And Method Of Measuring Properties Of Cells Using The Same - According to a device and system for measuring the properties of cells, there is an advantage in that, since a cell accommodation unit having a volume is provided, the properties of three-dimensional cells can be measured. Further, the present invention is advantageous in that it enables passive measurement of multiple properties which passively measures the electrical, mechanical and/or optical properties of cells, and active measurement of multiple properties which actively applies electrical, mechanical and optical types of stimulation to cells and measures their electrical, mechanical and/or optical reactions, thus measuring the multiple properties of cells with high reliability. | 12-23-2010 |
20100321450 | Droplet Receiver and Method Of Receiving Droplets - Disclosed herein is a droplet receiver. The droplet receiver includes an internal space formed such that its sectional area is reduced towards an input part, thus preventing the rebounding of droplets which enter a droplet receiving part, and includes an intercepting fluid layer so as to isolate the received droplets from the outside, thus preventing droplets received in the droplet receiving part from being contaminated and volatilizing. | 12-23-2010 |
20130082217 | METHOD OF PRODUCING METAL PARTICLES, AND INK COMPOSITION AND PASTE COMPOSITION PRODUCED BY THE SAME - Disclosed is a method of producing metal particles, including preparing a first solution including a silver (Ag) compound and a solvent, heating and stirring the first solution, adding an organophosphorus compound to the first solution and heating the first solution, and forming metal particles capped with a phosphorus (P) compound from the first solution. | 04-04-2013 |
20140043724 | MULTILAYER CERAMIC ELECTRONIC PART AND FABRICATING METHOD THEREOF - There is provided a multilayer ceramic electronic part having high reliability including: a ceramic body including a dielectric layer; internal electrodes formed in the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween; an electrode layer formed on the exterior of the ceramic body and electrically connected to the internal electrodes; a conductive resin layer formed on the electrode layer; and a plating layer formed on the conductive resin layer, wherein the conductive resin layer includes a first conductive resin layer contacting the electrode layer, and a second conductive resin layer formed on the exterior of the first conductive resin layer, contacting the plating layer and having a resin content different from that of the first conductive resin layer. | 02-13-2014 |
Patent application number | Description | Published |
20120043855 | Inertial Sensor - Disclosed herein is an inertial sensor of the present invention. An inertial sensor | 02-23-2012 |
20120297874 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. An inertial sensor | 11-29-2012 |
20130118258 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SME - Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor includes: a flexible part; a mass body movably supported by the flexible part and including a metal; a post supporting the flexible part; piezoelectric elements driving the mass body or sensing displacement of the mass body; and a package enclosing the flexible part, the mass body, and the post, wherein the metal has a melting point lower than the Curie temperature of the piezoelectric elements and higher than that of a solder forming connection parts for a surface mounting technology (SMT) provided on the package. | 05-16-2013 |
20130152687 | INERTIAL SENSOR AND METHOD FOR MEASURING ACCELERATION USING THE SAME - Disclosed herein is an inertial sensor, including: a membrane; a mass body disposed under the membrane; a sensing unit formed on the membrane and including a piezoelectric body; and a spring constant control unit formed to be spaced apart from the sensing unit and including a piezoelectric body. According to the preferred embodiment of the present invention, the DC acceleration (in particular, gravity acceleration) can be measured by using the change in the spring constant without changing the structure of the inertial sensor including the piezoelectric material of the prior art. | 06-20-2013 |
20130167634 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. The inertial sensor | 07-04-2013 |
20130167640 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed is an inertial sensor, including a membrane, a mass body provided underneath a central portion of the membrane, a post provided underneath a peripheral portion of the membrane, and a cap having a peripheral portion bonded to a lower surface of the post using low-temperature silicon direct bonding. A method of manufacturing the inertial sensor is also provided. | 07-04-2013 |
20130169113 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor | 07-04-2013 |