Kaneto, JP
Keiichi Kaneto, Kitakyushu-Shi JP
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20110101326 | ORGANIC FIELD EFFECT TRANSISTOR - An organic field effect transistor including an organic semiconductor layer constituting a current path between a source electrode and a drain electrode wherein the organic semiconductor layer is made of a conjugated polymer having a depletion layer and a conductivity of the organic semiconductor layer is controlled by using a gate electrode, wherein the depletion layer is formed by joining a reductive material being capable of forming Schottky contact with the organic semiconductor layer made of the conjugated polymer. There can be provided an organic field effect transistor using a conjugated polymer as an organic semiconductor and being capable of maintaining an insulation property. | 05-05-2011 |
Keiichi Kaneto, Fukuoka JP
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20100277011 | ACTUATOR USING MAGNETIC FORCE, AND DRIVE DEVICE AND SENSOR USING THE SAME - To provide an actuator that can flexibly and softly move like muscles, can maintain a stable operation over a long period of time, can generate a strong driving force, has a rapid input response, has a favorable sensitivity, has a high energy conversion efficiency, and can be accurately controlled. | 11-04-2010 |
20120001162 | ORGANIC SEMICONDUCTOR MATERIAL AND ORGANIC THIN-FILM TRANSISTOR - An organic thin-film transistor comprising a gate electrode, a gate insulator layer, an organic semiconductor layer, a source electrode and a drain electrode wherein the organic semiconductor layer consists of the organic semiconductor material having the structure represented by the general formula (1) shown below, and the organic semiconductor layer has crystallinity: | 01-05-2012 |
Kimikazu Kaneto, Aichi JP
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20100193991 | EQUIPMENT FOR MOLDING MOLD WITH MOLDING FLASK AND METHOD FOR MOLDING MOLD WITH MOLDING FLASK - [Problems] To provide equipment for molding a mold with a molding flask, which can easily be used with a mold molding auxiliary tool such as a sleeve on a model plate and, at the same time, can realize high productivity, is less likely to cause the wear of the model plate, and can mold a mold with a molding flask having uniform strength. | 08-05-2010 |
Kimikazu Kaneto, Toyokawa-Shi JP
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20110024071 | Method of producing sand mold - A method of producing a sand mold, comprising: after defining a mold space at least by a pattern plate, a flask, and a squeeze means, and after blow-charging molding sand held in a sand blowing device located above the mold space into the mold space by ejecting a first compressed air near sand ejecting ports of the sand blowing device thereby fluidizing the molding sand near the sand ejecting ports, while supplying a second compressed air to a surface of the molding sand held in the sand blowing device, moving the squeeze means toward the pattern plate, where in the pressure of the first compressed air and the period of time for supplying the first compressed air are adjusted to produce a good sand mold. To determine the period of time for ejecting the first compressed air, the distance of the movement of the squeeze feet toward the pattern plate is measured when the squeeze of the molding sand in the mold space is completed, and the difference between the measured distance and a target distance is calculated. The period is adjusted to be a shorter or lengthened one based on the result of the calculation. | 02-03-2011 |
Masayuki Kaneto, Ibaraki-Shi JP
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20090191410 | Resin joined body - In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m−1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%). | 07-30-2009 |
Masayuki Kaneto, Osaka JP
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20100130886 | CIRCUIT BOARD FOR BODY FLUID COLLECTION - A circuit board for body fluid collection is provided with an insulating layer, a puncture needle supported by the insulating layer and a conductor pattern that integrally has an electrode which is supported by the insulating layer and brings body fluid collected by puncture of the puncture needle into contact with the board, a terminal connected to a device measuring a component of body fluid and wiring for electrically connecting the electrode and the terminal. | 05-27-2010 |
20100292610 | CIRCUIT BOARD FOR BODY FLUID COLLECTION - A circuit board for body fluid collection includes a circuit board portion including an insulating layer and a conductor pattern which is supported by the insulating layer and in which an electrode, a terminal to be connected to a device for measuring the component of a body fluid, and a wire which electrically connects the electrode and the terminal are integrally provided. The circuit board for body fluid collection comprises a puncture needle for extracting the body fluid by performing puncturing, which is formed integrally with the circuit board portion and which is protruded from the circuit board portion, and a guard portion for guarding the tip of the puncture needle, which is arranged in opposition to the puncture needle in the lower flow side in the puncture direction of the puncture needle. | 11-18-2010 |
20100324393 | CIRCUIT BOARD FOR BODY FLUID COLLECTION, AND BIOSENSOR - A circuit board for body fluid collection includes a measurement unit including a puncture needle and an electrode for making contact with the body fluid collected by the puncturing with the puncture needle, wherein the measurement unit is provided in a plural number and disposed radially on a same plane. | 12-23-2010 |
20110071377 | CIRCUIT BOARD FOR BODY FLUID COLLECTION, METHOD FOR PRODUCING THE SAME, METHOD FOR USING THE SAME, AND BIOSENSOR INCLUDING THE CIRCUIT BOARD FOR BODY FLUID COLLECTION - A circuit board for body fluid collection includes a belt-like supporting substrate, and a plurality of measurement units defined in the supporting substrate along the longitudinal direction of the supporting substrate. The measurement units each include a puncture needle formed from the supporting substrate along the longitudinal direction of the supporting substrate by forming an opening in the supporting substrate, an insulating base layer formed on the supporting substrate, and a conductive layer formed on the insulating base layer and including an electrode for making contact with a body fluid collected by puncturing with the puncture needle. | 03-24-2011 |
Nao Kaneto, Tokyo JP
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20090271745 | MAP DISPLAY SYSTEM, MAP DISPLAY DEVICE, MAP DISPLAY METHOD, AND MAP DISTRIBUTION SERVER - A map display system having display means for displaying a map image and object display control means for displaying object images on the map image according to the location of the objects, wherein, when a cursor is moved to a desired object image and operated to select it, information on the object is displayed. The map display system has target object determination means for calculating the distances between the cursor and the individual object images and determining an object of the smallest distance to the cursor. The object display control means re-draws an object image of the target object determined by the target object determination means and displays the result on the uppermost surface of an image displayed. When a large number of object images are displayed on a map image, in areas close to each other, the user can simply recognize a desired object image and can click the object image accurately and reliably. | 10-29-2009 |
Shuji Kaneto, Hiroshima JP
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20090086209 | Method for marking defect and device therefor - A defect marking device includes a flaw inspection device which has a plurality of light-receiving parts that identify reflected lights coming from an inspection plane of a metal strip under two or more of optical conditions different from each other; a signal processing section that judges the presence/absence of surface flaw on the inspection plane based on a combination of reflected light components identified under these optical conditions different from each other; and a marking device which applies marking that indicates information relating to the flaw on the surface of the metal strip. | 04-02-2009 |
Taihei Kaneto, Chiba JP
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20090110921 | Chromate-Free Surface Treated Metal Material with Excellent Corrosion Resistance, Heat Resistance, Fingermark Resistance, Conductivity, Coatability, and Blackening Resistance at the Time of Working - The present invention provides a metal material given a chrome-free surface treatment satisfying all of the requirements of corrosion resistance, heat resistance, fingermark resistance, conductivity, coatability, and blackening resistance at the time of working, which was difficult to achieve with conventional chromate-free technology. The chromate-free surface treated metal material of the present invention is comprised of a metal material on the surface of which is coated and dried an aqueous metal surface treatment agent comprising an organic silicon compound (W), obtained by blending a silane coupling agent (A) containing one amino group in its molecule and a silane coupling agent (B) containing one glycidyl group in its molecule in a solid weight ratio [(A)/(B)] of 0.5 to 1.7, at least one type of fluorocompound (X) selected from fluorotitanic acid or fluorozirconic acid, phosphoric acid (Y), and a vanadium compound (Z) so as to form a composite coating containing the different ingredients. | 04-30-2009 |
Taihei Kaneto, Tokyo JP
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20120064354 | SURFACE-TREATED METAL MATERIAL AND PROCESS FOR PRODUCING THE SAME - A surface-treated metal material, comprising: a metal material, and a coating film disposed on the surface thereof, the coating film containing (A) an organic resin having a glass transition temperature of more than 35° C. and not more than 100° C., and (B) an organic resin having a glass transition temperature of more than 100° C. and not more than 250° C.; wherein the difference between the glass transition temperatures of the organic resins (A) and (B) is 50° C. or more. There are provided a surface-treated metal material having a coating film which contains no environmental load substance such as hexavalent chromium, and is particularly excellent in scratch resistance, press formability, and corrosion resistance after the shape processing thereof, and also a process for producing such a surface-treated metal material. | 03-15-2012 |
20140023879 | SURFACE-TREATED STEEL SHEET AND METHOD OF MANUFACTURING THE SAME - A surface-treated steel sheet includes: a steel sheet; and a coated layer which is formed on one surface or both surfaces of the steel sheet and includes zinc and vanadium, wherein the coated layer has a vanadium content of 1% or higher and 20% or less and a coating weight of 3 g/m | 01-23-2014 |
20140050939 | SURFACE-TREATED METAL MATERIAL AND AQUEOUS METAL SURFACE-TREATMENT AGENT - A surface-treated metal material of the present invention has a composite film on the surface of a metal material. The composite film includes an organic silicon compound (W) having cyclic siloxane bonds, at least one metal compound (X) selected from a group consisting of a titanium compound and a zirconium compound, a phosphate compound (Y) and a fluorine compound (Z). In each of the components of the composite film, the ratio of X | 02-20-2014 |
Taishi Kaneto, Gunma JP
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20130208026 | SEMICONDUCTOR LIGHT EMITTING APPARATUS, IMAGE DISPLAYING APPARATUS, MOBILE TERMINAL, HEAD-UP DISPLAY APPARATUS, IMAGE PROJECTOR, HEAD-MOUNTED DISPLAY APPARATUS, AND IMAGE FORMING APPARATUS - A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements. | 08-15-2013 |
Taishi Kaneto, Tokyo JP
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20150277269 | SEMICONDUCTOR APPARATUS, EXPOSING HEAD, AND IMAGE FORMING APPARATUS - A semiconductor apparatus includes a rectangular plate-like body including a major surface. A plurality of light emitting portions formed in the major surface, and aligned in a straight line. A first terraced portion and a second terraced portion are formed in the major surface except areas in which the plurality of light emitting portions are formed. | 10-01-2015 |
20150280067 | LIGHT EMITTING ELEMENT ARRAY, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, PRINTING HEAD AND IMAGE FORMING APPARATUS - A light emitting element array includes a semiconductor thin-film layer in which a plurality of light emitting portions are arranged. The plurality of light emitting portions are driven to emit light in such a manner that an arrangement direction of the plurality of light emitting portions defines a main scanning direction. The plurality of light emitting portions are arranged in such a manner that adjacent light emitting portions are displaced from each other in a sub scanning direction perpendicular to the main scanning direction by a certain amount. An end portion of the semiconductor thin-film layer in the sub scanning direction has a shape along a pattern in which the plurality of light emitting portions are arranged. | 10-01-2015 |