Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Kanazawa, Tokyo
Hashime Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090253729 | Analgesic Agent - A pharmaceutical preparation useful for alleviating or treating a pain, e.g., a chronic pain (particularly, a neuropathic pain) is provided. The pharmaceutical preparation contains (a) a propionic acid-derived nonsteroidal anti-inflammatory agent (e.g., ibuprofen), (b) a non-pyrazolone antipyretic analgesic agent (e.g., acetaminophen), and (c) an opioid analgesic agent (e.g., codeine phosphate, dihydrocodeine phosphate). The pharmaceutical preparation may contain 5 to 100 parts by weight of the antipyretic analgesic agent (b) or 0.5 to 500 parts by weight of the analgesic agent (c) relative to 100 parts by weight of the anti-inflammatory agent (a). The pharmaceutical preparation may be substantially free from a nontoxic N-methyl-D-aspartate receptor antagonist and may contain 20 to 80 parts by weight of the antipyretic analgesic agent (b) and 1 to 100 parts by weight of the analgesic agent (c) relative to 100 parts by weight of the anti-inflammatory agent (a). | 10-08-2009 |
Hideaki Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100087064 | METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The present inventors have found that a wafer process of VLSI (Very Large Scale Integration) has the following problem, that is, generation of foreign matters due to moisture from a wafer as a result of degassing when a barrier metal film or a first-level metal interconnect layer is formed by sputtering as a preliminary step for the formation of a tungsten plug in a pre-metal step. To overcome the problem, the present invention provides a manufacturing method of a semiconductor integrated circuit device including, in a plasma process, in-situ monitoring of moisture in a processing chamber by receiving an electromagnetic wave generated from plasma. | 04-08-2010 |
Hidehiro Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090148695 | OPTICAL ELEMENT FOR X-RAY - An optical element for X-ray includes a substrate, a first multilayer film having a reflection property with respect to light in a soft X-ray wavelength range, and a second multilayer film, disposed between the substrate and the first multilayer film, for reducing film stress of the first multilayer film. The second multilayer film has a periodic structure having a unit period film thickness which is 90% or more and less than 110% of a two or more integral multiple of 7 nm. | 06-11-2009 |
| 20090252977 | MULTILAYER FILM REFLECTOR - A stress distribution resulting from variation in in-plane film quality of a stress relaxation layer and a reflective layer is eliminated. A reflective layer is stacked on a substrate via a stress relaxation layer. The stress relaxation layer has a stress relaxation portion having a uniform film thickness distribution to cancel the internal stress of the reflective layer, and a stress distribution eliminating portion with a film thickness distribution approximated to a second order even function. The stress is substantially proportional to the film thickness. Thus, formation of a given film thickness distribution allows the stress distribution to be controlled. However, changing the film thickness distribution based on a design value may degrade the optical characteristics. Thus, the film thickness distribution of the stress distribution eliminating portion, which serves to eliminate the stress distribution, is approximated to the second order even function. This enables aberration associated with the film thickness distribution to be reduced by adjusting an optical system. | 10-08-2009 |
Hidenori Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110213069 | AQUEOUS COATING COMPOSITION - The present invention relates to an aqueous coating composition having excellent coating adhesion, workability, heat resistance and chemical resistance, and has an object to provide an aqueous coating composition for sealing, which is suitable for members to be screwed in. The present invention relates to an aqueous coating composition including: as main components, component (A) an ethylene-vinyl acetate copolymer resin emulsion and component (B) two or more PTFE resin powders having different particle diameters, in which 35 to 80 parts by mass of water is contained on the basis of 100 parts by mass of the total of (A) and (B). | 09-01-2011 |
Hideo Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090136443 | Drug Carrier - The present invention has an object of providing a drug carrier capable of controlling in vivo pharmacokinetics. The present invention is directed to a drug carrier comprising a molecular assembly having a drug incorporated therein, and the above object can be achieved by a part of the amphiphilic molecules included in the molecular assembly being released from the molecular assembly by an external environmental change. The present invention utilizes a phenomenon that the hydrophilic-hydrophobic balance of the amphiphilic molecules is shifted toward hydrophilicity by an external environmental change and thus the amphiphilic molecules are freed from the molecular assembly. | 05-28-2009 |
Hiromichi Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080254323 | MAGNETIC RECORDING MEDIUM - A magnetic recording medium includes a metal thin-film magnetic layer formed on a non-magnetic substrate. The metal thin-film magnetic layer is formed so that the coercivity measured when a magnetic field is applied with an angle of intersection of 120° between the plane of the non-magnetic substrate and magnetic field lines of the magnetic field and the coercivity measured when the magnetic field is applied with the angle of intersection of 60° are both at least 160 kA/m. | 10-16-2008 |
Hirotaka Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080265007 | Method and Apparatus for Positioning Plate Members to Be Butt-Welded - It is made possible to position plate members to be butt-welded for formation of weld line in a small amount of time so as to enhance working capacity of butt welding. | 10-30-2008 |
| 20100187292 | METHOD AND APPARATUS FOR POSITIONING PLATE MEMBERS TO BE BUTT-WELDED - It is made possible to position plate members to be butt-welded for formation of weld line in a small amount of time so as to enhance working capacity of butt welding. | 07-29-2010 |
Ikuko Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110164908 | IMAGE FORMING APPARATUS AND METHOD FOR SELECTING MATERIAL OF CLEANING BLADE - An image forming apparatus includes an image carrying member which carries an image composed of a developer, a lubricant application device which applies a lubricant onto the image carrying member, and a cleaning blade which abuts against the image carrying member to scrape the developer. The cleaning blade is formed of a material whose tensile stress-elongation test shows that the definite integral of a tensile stress with respect to an elongation percentage on an interval between the elongation percentage of zero and the elongation percentage at which the stress is a predetermined value is a predetermined upper limit value or less. | 07-07-2011 |
| 20110164909 | LUBRICANT APPLICATION DEVICE AND IMAGE FORMING APPARATUS - In the lubricant application device | 07-07-2011 |
| 20110176845 | LUBRICANT APPLICATION DEVICE AND IMAGE FORMING APPARATUS - A lubricant application device | 07-21-2011 |
Jyunya Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20120074543 | PACKAGE APPARATUS OF POWER SEMICONDUCTOR DEVICE - A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals. | 03-29-2012 |
Katsuyuki Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20120014551 | SOUND GENERATION SYSTEM, SOUND RECORDING SYSTEM, SOUND GENERATION METHOD, SOUND RECORDING METHOD, SOUND ADJUSTING METHOD, SOUND ADJUSTING PROGRAM, SOUND FIELD ADJUSTING SYSTEM, SPEAKER STAND, FURNITURE, SPEAKER CABINET, AND SPEAKER DEVICE - Provided are a sound generation system and a sound recording system, which are placed in a room to adjust sound. A columnar body is disposed around a sound source to adjust how much sound of a low-tone range, as well as of a middle- and high-tone range, is absorbed and diffused. Moreover, a columnar body is disposed around a recording device to adjust how much sound of a low-tone range, as well as of a middle- and high-tone range, is absorbed and diffused. The columnar bodies may be made of a combination of different diameters and/or lengths. The arrangement distances may be random. With the columnar body disposed at the most appropriate location, it is possible to adjust sound in a wide band. | 01-19-2012 |
Masaki Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090107634 | Film Peeling Method and Film Peeling Device - There is provided a film peeling device ( | 04-30-2009 |
| 20090163120 | WAFER GRINDING MACHINE AND WAFER GRINDING METHOD - A wafer grinding machine and a wafer grinding method are disclosed. A barrier ( | 06-25-2009 |
| 20090191796 | WAFER PROCESSING METHOD FOR PROCESSING WAFER HAVING BUMPS FORMED THEREON - A wafer processing method for processing a wafer ( | 07-30-2009 |
Masaru Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090116085 | Optical system and projection display device - An optical system capable of outputting hi-contrast images and multi-primary color or 3-dimensional images is provided. Light in primary colors RGB modulated in a first modulation optical system is transmitted through a relay lens | 05-07-2009 |
Masayuki Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090246955 | WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS - A wafer processing method is provided comprising the steps of: holding a wafer ( | 10-01-2009 |
Mitsuo Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110011013 | FLOOR-PANEL AND FLOOR-PANEL ASSEMBLIES - The present invention provides a floor panel that affords a seismic isolation effect against large-magnitude quakes. A floor panel comprises a sliding unit that comprises a floor unit member having a lower portion that can come into contact with a base member and an upper portion supported on the lower portion; and a panel member having a structure fixing face that can be fixed to an upper structure, and an abutting face that abuts an upper face of the upper portion of the floor unit member, such that the abutting face is provided so as to be slidable on the upper face. The floor panel also comprises an elastic insert member provided between a wall and a side face of the panel member of the sliding unit. | 01-20-2011 |
Noriaki Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090082621 | Electric Bending Endoscope Apparatus - The present invention has an object to provide an electric bending endoscope apparatus with a configuration which is always capable of securing favorable operability at a time of using an endoscope without placing a weight burden on an operator when operating the endoscope, and for the purpose, the electric bending endoscope apparatus includes at least an electric bending endoscope that is configured by an elongated insertion portion which is inserted into a body cavity, a bending drive section which electrically drives a part of the insertion portion to bend, and an operation portion configured to be separate from the bending drive section and electrically connected to the bending drive section, and performs observation and treatment of an inside of the body cavity, a system controller which is electrically connected to the electric bending endoscope and centrally controls the electric bending endoscope, and an endoscope holding device configured by a bending drive unit which contains the bending drive section and holds a part of the electric bending endoscope, and an arm portion which is connected to the bending drive unit and holds the bending drive unit, and is configured such that by the bending drive unit being attachably and detachably connected to a proximal end side of the insertion portion, the electric bending endoscope and the bending drive section are electrically connected. | 03-26-2009 |
Takamitsu Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100289127 | SEMICONDUCTOR DEVICE - A semiconductor device in which the wiring resistance and parasitic inductance of a semiconductor package configuring a power semiconductor module is reduced. In the semiconductor device, a semiconductor chip with an IGBT formed therein and a diode chip are mounted over the upper surface of a die pad. An emitter pad of the semiconductor chip and an anode pad of the diode chip are coupled with a lead by an Al wire. One end of the lead is located in a higher position than the upper surface of the die pad in order to shorten the length of the Al wire for coupling the emitter pad and the lead. | 11-18-2010 |
Takanori Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110263560 | Organic Compounds - 3,4-substituted piperidine compounds, these compounds for use in the diagnostic and therapeutic treatment of a warm-blooded animal, especially for the treatment of a disease (=disorder) that depends on activity of renin; the use of a compound of that class for the preparation of a pharmaceutical formulation for the treatment of a disease that depends on activity of renin; the use of a compound of that class in the treatment of a disease that depends on activity of renin; pharmaceutical formulations comprising a 3,4-substituted piperidine compound, and/or a method of treatment comprising administering a 3,4substituted piperidine compound, a method for the manufacture of a 3,4-substituted piperidine compound, and novel intermediates and partial steps for their synthesis are disclosed. The 3,4-disubstituted piperidine compounds have the formula (I), wherein the symbols have the meanings defined in the specification. | 10-27-2011 |
Yasuo Kanazawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110305196 | COMMUNICATION SYSTEM, FEMTO-CELL BASE STATION, AUTHENTICATION DEVICE, COMMUNICATION METHOD, AND MEMORY MEDIUM - A communication system that includes at least UE and an HLR that are used in an IMS network further includes: a Femto-cell base station that makes up a predetermined communication area, and a control unit for controlling at least communication between the UE and the HLR. The Femto-cell base station and the control unit are present between the UE and the HLR. The Femto-cell base station includes a transmission unit for transmitting messages received from the UE to the control unit and for transmitting messages received from the control unit to the UE. The control unit converts messages received from the Femto-cell base station to messages that can be recognized by the HLR, and converts messages received from the HLR to messages that can be recognized by the UE. | 12-15-2011 |