| Patent application number | Description | Published |
|---|
| 20080319110 | Latent curing agent - A latent curing agent that can cure a thermosetting epoxy resin in a relatively short period of time and at a relatively low temperature has a structure in which an aluminum chelating agent is held by a porous resin carrier obtained through interfacial polymerization of a polyfunctional isocyanate compound. The aluminum chelating agent is preferably a complex compound comprising β-ketoenolate anion ligands coordinated to aluminum. The latent curing agent can be produced by dissolving the aluminum chelating agent and the polyfunctional isocyanate compound in a volatile organic solvent, adding the resulting solution to an aqueous phase containing a dispersing agent, and stirring the resulting mixture to cause interfacial polymerization of the isocyanate compound while the mixture is being heated. | 12-25-2008 |
| 20090209669 | LATENT CURING AGENT - An aluminum chelating agent-based latent curing agent is provided that can rapidly cure thermosetting epoxy resins at relatively low temperatures. A method for producing the aluminum chelating agent-based latent curing agent is also provided that enables relatively facile control of the curing conditions therefor. The latent curing agent holds an aluminum chelating agent in a porous resin obtained by the interfacial polymerization of a polyfunctional isocyanate compound, and when the latent curing agent is incorporated in a curable epoxy resin composition for differential scanning calorimetric (DSC) measurement, the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that contains the latent curing agent that has been treated by immersion in a nonaqueous polar solvent can be brought to not less than the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that incorporates the latent curing agent that has not been subjected to the immersion treatment. | 08-20-2009 |
| 20090275708 | Thermosetting Epoxy Resin Composition - Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization. | 11-05-2009 |
| 20100249338 | THERMOSETTING EPOXY RESIN COMPOSITION - A thermosetting epoxy resin composition can be cured rapidly at low temperature with an aluminum chelate-based latent curing agent without the use of a cycloaliphatic epoxy compound. The thermosetting epoxy resin composition includes an aluminum chelate-based latent curing agent, a silanol compound of the formula (A), and a glycidyl ether-type epoxy resin: | 09-30-2010 |
| 20100324170 | MICROCAPSULE-TYPE LATENT CURING AGENT - An aluminum chelate-based latent curing agent having excellent latency and thermal response includes a latent curing agent in which an aluminum chelating agent is retained in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound, and an enzyme-treated gelatin film coating such latent curing agent. This microcapsule-type latent curing agent can be produced by dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, charging the obtained solution into a gelatin-containing aqueous phase, carrying out interfacial polymerization by heating and stirring, and subjecting the gelatin to an enzyme treatment by adding an enzyme to the obtained polymerization reaction mixture. | 12-23-2010 |
| 20100331435 | ALUMINUM CHELATE LATENT CURING AGENT AND PRODUCTION METHOD THEREOF - An aluminum chelate latent curing agent includes an aluminum chelate curing agent, and a porous resin that holds the aluminum chelate curing agent and is obtained by subjecting a polyfunctional isocyanate compound to interfacial polymerization while simultaneously subjecting a polyfunctional radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator. In the aluminum chelate latent curing agent, a silanol compound of the formula (A) is further held in the porous resin. | 12-30-2010 |
