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Kaminishi, JP

Daisuke Kaminishi, Kyoto-Fu JP

Patent application numberDescriptionPublished
20090173156ANGULAR RATE SENSOR - An angular rate sensor includes: a substrate; and a vibrator having a beam part supported in a state of floating from the substrate and a pair of supports formed on the substrate and provided at both ends of the beam part for supporting the beam part. The vibrator includes a piezoelectric film formed in the beam part, a detecting electrode for detecting an angular rate, the detecting electrode being formed on the piezoelectric film so as to extend toward a center portion of the beam part from one end thereof, and a driving electrode for vibrating the vibrator, the driving electrode being formed on the piezoelectric film so as to extend toward the center portion of the beam part from the other end thereof and to be spaced from the detecting electrode.07-09-2009
20100206073ANGULAR VELOCITY DETECTING DEVICE AND MANUFACTURING METHOD OF THE SAME - An angular velocity detecting device includes a semiconductor substrate (08-19-2010

Kensuke Kaminishi, Osaka JP

Patent application numberDescriptionPublished
20100287880Medicine Dispensing System and Medicine Dispensing Device - There is provided a medicine dispensing system configured such that a medicine dispensing device includes a sub unit having a function to dispense medicine that is connected to a medicine dispensing device that includes a main unit having a function of packing medicines. There is also provided a medicine dispensing device that can be appropriately integrated with such a medicine dispensing system. The medicine dispensing system includes, in some embodiments a main unit, a sub unit and a transfer device connecting the main unit and the sub unit. The medicine dispensing system transfers the medicine dispensed in the sub unit to the main unit by means of a transfer device and dispenses the medicine at a medicine packing part together with the medicine dispensed from a main storage part in the main unit.11-18-2010
20110107591MEDICINE PACKAGING DEVICE AND CART FOR CHANGING PACKAGING UNIT - There is provided a medicine packaging device that can resolve the problem in which fine mechanical adjustments are needed for changing setting conditions of a packaging part or when the packaging part fails. The medicine packaging device has a device body 05-12-2011

Kentaro Kaminishi, Shizuoka JP

Patent application numberDescriptionPublished
20110278083SNOW VEHICLE - A snow vehicle includes a vehicle body, an arm member supported with respect to the vehicle body, a knuckle supported with respect to the arm member at a predetermined support point, a coupling unit arranged to couple the knuckle to the arm member, a ski member, and a ski coupling unit. The ski coupling unit couples the ski member to the knuckle such that the ski member pivots about a pitching axis with respect to the knuckle, the pitching axis extends in a width direction of the ski member. The pitching axis is disposed such that, when the vehicle is in a reference attitude of being placed on a horizontal surface, a horizontal distance from the pitching axis to a reference normal directed to the horizontal surface from the support point is shorter than a horizontal distance from the pitching axis to a steering axis.11-17-2011

Masahiko Kaminishi, Oshu-Shi JP

Patent application numberDescriptionPublished
20090232967THERMAL PROCESSING APPARATUS, METHOD FOR REGULATING TEMPERATURE OF THERMAL PROCESSING APPARATUS, AND PROGRAM - There are provided a thermal processing apparatus, a method for regulating a temperature of a thermal processing apparatus, and a program, by which a temperature can be easily regulated. A control part 09-17-2009

Morimasa Kaminishi, Miyagi JP

Patent application numberDescriptionPublished
20090168828VERTICAL-CAVITY, SURFACE-EMISSION TYPE LASER DIODE AND FABRICATION PROCESS THEREOF - A vertical-cavity, surface-emission-type laser diode includes an optical cavity formed of an active region sandwiched by upper and lower reflectors, wherein the lower reflector is formed of a distributed Bragg reflector and a non-optical recombination elimination layer is provided between an active layer in the active region and the lower reflector.07-02-2009
20090286342SEMICONDUCTOR LIGHT-EMITTING DEVICE, SURFACE-EMISSION LASER DIODE, AND PRODUCTION APPARATUS THEREOF, PRODUCTION METHOD, OPTICAL MODULE AND OPTICAL TELECOMMUNICATION SYSTEM - A semiconductor light-emitting device has a semiconductor layer containing Al between a substrate and an active layer containing nitrogen, wherein Al and oxygen are removed from a growth chamber before growing said active layer and a concentration of oxygen incorporated into said active layer together with Al is set to a level such that said semiconductor light-emitting device can perform a continuous laser oscillation at room temperature.11-19-2009
20100158064SEMICONDUCTOR LIGHT EMITTER - A semiconductor light emitter includes a quantum well active layer which includes nitrogen and at least one other Group-V element, and barrier layers which are provided alongside the quantum well active layer, wherein the quantum well active layer and the barrier layers together constitute an active layer, wherein the barrier layers are formed of a Group-III-V mixed-crystal semiconductor that includes nitrogen and at least one other Group-V element, a nitrogen composition thereof being smaller than that of the quantum well active layer.06-24-2010
20110176122SURFACE EMITTING LASER ELEMENT, SURFACE EMITTING LASER ARRAY, OPTICAL SCANNING APPARATUS, AND IMAGE FORMING APPARATUS - A surface emitting laser element includes a p-side spacer layer; an n-side spacer layer; and an active layer disposed between the p-side spacer layer and the n-side spacer layer. The p-side spacer layer includes an undoped region adjacent to the active layer in which no p-type dopant is contained. The entire n-side spacer layer is doped with an n-type dopant.07-21-2011

Patent applications by Morimasa Kaminishi, Miyagi JP

Yuji Kaminishi, Ishikawa-Gun JP

Patent application numberDescriptionPublished
20090303140ANTENNA AND WIRELESS COMMUNICATION APPARATUS - In an antenna, a first type radiation electrode and a second type radiation electrode are provided on the surface of a dielectric base, which has a predetermined external shape, or embedded in the dielectric base. The first type radiation electrode is provided with an open terminal at one end thereof and a feeding terminal at the other end thereof so as to constitute a monopole type antenna. The second type radiation electrode is provided with a capacitive-coupling feeding electrode at one end thereof and a ground connection terminal at the other end thereof so as to constitute a capacitive feed antenna. The one end of the first type radiation electrode is located opposite to the feeding electrode of the second type radiation electrode when viewed in the direction of the length of the dielectric base.12-10-2009

Yuji Kaminishi, Ishikawa-Ken JP

Patent application numberDescriptionPublished
20090115671ANTENNA DEVICE AND WIRELESS COMMUNICATION APPARATUS INCLUDING THE SAME - A non-feeding element is provided with a proximity-providing gap from a feeding element that receives RF power from a feeding point on a circuit board, and a resonant state is generated there by capacitive coupling. The non-feeding element is formed so as to resonate at a frequency different from a resonant frequency of the feeding element. The feeding element and the non-feeding element have alongside-ground-terminal extending portions formed so as to be spaced from an edge surface (a ground terminal) at one end of a ground surface formed on the circuit board and to extend in a direction along the edge surface at the one end of the ground surface. At least one of the feeding element and the non-feeding element is formed three-dimensionally with a plurality of bending portions so that at least parts of the alongside-ground-terminal extending portion of the feeding element and the ground-terminal extending portion of the non-feeding element have substantially the same amount of spacing from the ground surface, with a mutual gap in a thickness direction of the circuit board.05-07-2009