| Patent application number | Description | Published |
|---|
| 20100050675 | HEAT PUMP SYSTEM - A heat pump system has a single heat source unit connected to at least one load unit to heat water to a high temperature. A hot water supply system | 03-04-2010 |
| 20100282434 | AIR CONDITIONING AND HOT WATER SUPPLY COMPLEX SYSTEM - There is provided an air conditioning and hot water supply complex system that can simultaneously treat a cooling load, a heating load and a high-temperature hot water supply load and supply a stable heat source throughout the year. | 11-11-2010 |
| 20100282435 | AIR-CONDITIONING HOT-WATER SUPPLY COMPLEX SYSTEM - To provide an air-conditioning hot-water supply complex system that can simultaneously process a cooling load, a heating load, and a high-temperature hot-water supply load to provide a stable heat source all through the year. The air-conditioning hot-water supply complex system provides a bypass pipe in which a bypass electromagnetic valve is installed in parallel with a heating medium-refrigerant heat exchanger between a gateway of refrigerant piping of the heating medium-refrigerant heat exchanger to control an inflow amount of the refrigerant for hot-water supply to the heating medium-refrigerant heat exchanger by making the refrigerant for hot-water to flow into a bypass pipe by opening and closing the bypass electromagnetic valve. | 11-11-2010 |
| 20110016897 | AIR CONDITIONING-HOT WATER SUPPLY COMBINED SYSTEM - There is provided a heat pump apparatus bringing heating water to a high temperature by connecting one or a plurality of load-side units to one heat source-side unit. The air conditioning-hot water supply combined system (heat pump apparatus) includes a heat source-side unit equipped with an air conditioning compressor, a four-way valve, and an outdoor heat exchanger; and the load-side units equipped with an air conditioning throttle, an indoor heat exchanger, a second compressor, a second load-side heat exchanger, and a second flow rate control unit. Here, a main circuit is configured by sequentially connecting the air conditioning compressor, the four-way valve, the outdoor heat exchanger, the air conditioning throttle, and the indoor heat exchanger, using a high-pressure side connection piping and a low-pressure side connection piping. On the other hand, a load-side refrigerant circuit is configured by sequentially connecting the second compressor, a second load-side heat exchanger second load-side heat exchanger, the second flow rate control unit, and the indoor heat exchanger using a load-side refrigerant piping. | 01-27-2011 |
| 20110314848 | COMBINED AIR-CONDITIONING AND HOT-WATER SUPPLY SYSTEM - A configuration provided with a heat source unit, an indoor unit, a circuit for a hot-water supply heat source provided with a refrigerant—refrigerant heat exchanger and throttle means for the hot-water supply heat source, and a branch unit that distributes a refrigerant flowing through the indoor unit and the circuit for hot-water supply heat source and also provided with a refrigerating cycle for air conditioning in which the indoor unit and the circuit for hot-water supply heat source are connected in parallel and connected to the heat source unit by at least two connection pipelines via the branch unit and a refrigerating cycle for hot-water supply in which a compressor for hot-water supply, a heat-medium—refrigerant heat exchanger, throttle means for hot-water supply, and the refrigerant—refrigerant heat exchanger are connected in series, in which the refrigerating cycle for air conditioning and the refrigerating cycle for hot-water supply are connected so as to exchange heat between the refrigerant for air conditioning and the refrigerant for hot-water supply in the refrigerant—refrigerant heat exchanger. | 12-29-2011 |
| Patent application number | Description | Published |
|---|
| 20090295458 | SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME - The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit. | 12-03-2009 |
| 20100301924 | SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME - The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit. | 12-02-2010 |
| 20110204957 | SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME - The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit. | 08-25-2011 |
