Patent application number | Description | Published |
20120326014 | OPTICAL FIBER CONNECTOR ASSEMBLY - An optical fiber connector assembly includes an optical socket and an optical plug. The optical socket defines a recess, and a coupling surface in the recess, with light emitters and light detectors on the coupling surface. Each light emitter includes a light emitting surface exposed in the recess, and is configured for converting a first electrical signal into a first optical signal. Each light detector includes a light incident surface exposed in the recess, and is configured for converting a second optical signal into a second electrical signal. The optical plug can be inserted into the recess, and includes optical output fibers aligned with the light emitting surface for outputting the first optical signal from the light emitting surface, and optical input fibers aligned with the light incident surface for inputting the second optical signal to the light incident surface. | 12-27-2012 |
20130010444 | CHIP PACKAGE - A chip package includes a circuit board, a chip, and wires. The circuit board includes a metal layer, a middle layer formed on the metal layer, and a wire pattern layer formed on the middle layer. The metal layer is configured to be grounded. A through hole is defined through the wire pattern layer and the middle layer to expose the metal layer. The chip is mounted on the metal layer and received in the through hole. The wires interconnect the chip and the wire pattern layer. | 01-10-2013 |
20130011099 | OPTICAL FIBER CONNECTOR ADAPTER AND RELATED OPTICAL FIBER CONNECTOR ASSEMBLY - An optical fiber connector adapter for coupling a first optical fiber connector to a second optical fiber connector includes a lens body. The lens body includes a first surface and an opposite second surface. A positioning hole is defined in the first surface. A lens hole is defined in the first surface and a first lens is formed on a bottom in the lens hole. The first lens is beneath the first surface and adjacent to the positioning hole. A positioning post and a second lens protrude from the second surface. The second lens is aligned with the first lens. An optical fiber connector assembly having the optical fiber connector adapter is also provided. | 01-10-2013 |
20130021767 | DOUBLE-SIDED PRINTED CIRCUIT BOARD - A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions. | 01-24-2013 |
20130044982 | OPTICAL FIBER CONNECTOR ASSEMBLY - An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances. | 02-21-2013 |
20130121649 | OPTICAL FIBER CONNECTOR AND OPTICAL FIBER COUPLING ASSEMBLY HAVING SAME - An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit. | 05-16-2013 |
20130136395 | OPTICAL FIBER TRANSMITTING SYSTEM - An optical fiber transmitting system including a first Optical/Electrical (O/E) module, a first interface, a second interface, a fiber cable and a second Optical/Electrical (O/E) module is provided. The first O/E module includes a laser diode (LD) configured to emit laser optical signals. The fiber cable includes two pieces of optical fiber and a third piece of optical fiber for transmitting the laser optical signals to the second O/E module via the first interface and the second interface. The second O/E module includes a photo-detector (PD) configured to convert the laser optical signals into electronic signals to supply power energy to a peripheral device. | 05-30-2013 |
20130142479 | CHIP PACKAGE - A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers. | 06-06-2013 |
20130142484 | OPTICAL ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF - An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission. | 06-06-2013 |
20130142485 | OPTICAL FIBER COUPLING ASSEMBLY - An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes. | 06-06-2013 |
20130142486 | OPTICAL FIBER COUPLING ASSEMBLY WITH CABLE - An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses. | 06-06-2013 |
20130146752 | OPTICAL-ELECTRICAL MODULE - An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area. | 06-13-2013 |
20130163925 | OPTICAL FIBER COUPLER AND INSERTION PORT - An optical fiber coupler includes two insertion ports inserted into each other. Each insertion port includes a main body having a connecting wall, at least two lenses positioned adjacent to the connecting wall, and at least two optical fibers coupled with the at least two lenses. While the connecting wall has an axis of symmetry, one insertion port acts as a male port, and the other insertion port acts as a female port. A positioning post protrudes from the connecting wall. A guiding hole is formed on the connecting wall. The projections of the positioning post and the guiding hole on the connecting wall are symmetrical around the longitudinal center axis of the optical fiber coupler, respectively. The lenses are symmetrical around the longitudinal center of axis. | 06-27-2013 |
20130170795 | OPTICAL COUPLER - An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall. | 07-04-2013 |
20130170796 | OPTICAL FIBER COUPLER HAVING MALE PORT AND FEMALE PORT - An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port. | 07-04-2013 |
20130242518 | CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD - A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires. | 09-19-2013 |
20130250990 | LASER EMITTING CHIP PACKAGE - A laser emitting chip package includes a circuit board, a laser emitting chip, and at least three gold balls. The circuit board includes at least two substrate-pad areas. The laser emitting chip includes at least two chip-pad areas. Each of the chip-pad areas spatially corresponds to a respective one of the substrate-pad areas. The at least three gold balls are explanted on the at least two chip-pad areas. The laser emitting chip is supported on the circuit board by the at least three gold balls in a triangular or square arrangement between the chip-pad areas and the substrate-pad areas. The laser emitting chip is electrically connected to the circuit board through the gold balls. | 09-26-2013 |
20130251313 | HIGH-FREQUENCY TRANSMISSION MODULE AND OPTICAL CONNECTOR - A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip. | 09-26-2013 |
20130259432 | OPTICAL CONNECTOR PACKAGE AND OPTICAL CONNECTOR - An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes. | 10-03-2013 |
20130269983 | CIRCUIT BOARD ASSEMBLY WITH PADS AND CONNECTION LINES HAVING SAME RESISTANCE VALUE AS THE PADS AND IMPEDANCE MATCHING METHOD - A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad. | 10-17-2013 |
20130277839 | CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME - A chip package includes a PCB, a chip positioned on the PCB and bonding wires electrically connecting the chip to the PCB. The PCB includes a number of first bonding pads formed thereon. Each first bonding pad includes a first soldering ball. The chip includes a number of second bonding pads. Each second bonding pad includes a second bonding ball. Each bonding wire electrically connects a first bonding pad to a corresponding second bonding ball. Each bonding wire forms a vaulted portion upon the first bonding ball. | 10-24-2013 |
20130277847 | CHIP PACKAGE AND METHOD FOR ASSEMBLING CHIP PACKAGE - A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner. | 10-24-2013 |
20130279859 | CIRCUIT BOARD ASSEMBLY HAVING OPTICAL TRANSCEIVER FOR SIGNAL TRANSIMISSION - A circuit board assembly includes a circuit board, a first optical transceiver electrically connected to the circuit board, a first transparent shell optically coupled with the first optical transceiver, a second optical transceiver electrically connected to the circuit board, a second transparent shell optically coupled with the second optical transceiver, and a plurality of light wave guides optically coupled with the first transparent shell and the second transparent shell. The first optical transceiver sends first light signals. The first light signals are transmitted through the first transparent shell, the light wave guides, and the second transparent shell and are received by the second optical transceiver. The second optical transceiver sends second light signals. The second light signals are transmitted through the second transparent shell, the light wave guides, and the first transparent shell and are received by first optical transceiver. | 10-24-2013 |
20130285239 | CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD - A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner. | 10-31-2013 |
20130285243 | EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD - A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad. | 10-31-2013 |
20130287344 | CIRCUIT BOARD ASSEMBLY HAVING OPTICAL CONNECTORS FOR SIGNAL TRANSMISSION - A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell. | 10-31-2013 |
20130294779 | CIRCUIT BOARD ASSEMBLY EMPLOYING OPTICAL TRANSCEIVER FOR SIGNAL TRANSMISSION - A circuit board assembly includes a first circuit board, an optical transceiver, a second circuit board, and a number of light wave guides. The first circuit board includes a lower surface. The optical transceiver is mounted on the lower surface for sending and receiving light beams. The second circuit board is electrically connected to the first circuit board and includes a top surface facing the lower surface. The light wave guides are mounted on the top surface and optically coupled with the optical transceiver for transmitting the light beams. | 11-07-2013 |
20130302036 | CIRCUIT BOARD ASSEMBLY HAVING OPTICAL TRANSCEIVERS FOR SIGNAL TRANSMISSION - A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes. | 11-14-2013 |
20130306837 | OPTICAL-ELECTRICAL CONVERTING DEVICE - An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad. | 11-21-2013 |
20130306846 | OPTICAL FIBER CONNECTOR INCLUDING LIGHT TRANSCIVERS - An optical fiber connector is positioned on a printed circuit board (PCB) and includes a main body, a number of slots, and a number of optical fibers. The main body includes a number of light transceivers. Each of the light transceivers includes a light transmitting module and a light receiving module adjacent to the light transmitting module. One end of each of the optical fibers is optically coupled to a respective one of the light emitting modules and the light receiving modules, and the other end of each of the optical fibers is mounted on a respective one of the slots. | 11-21-2013 |
20130308896 | OPTICAL ADAPTER AND OPTICAL SIGNAL TRANSMISSION DEVICE INCLUDING SAME - An optical adapter includes a loading plate and a coupling lens. The coupling lens includes a main body, a first optical reflector, and a second optical reflector. The first optical reflector is positioned on the loading plate. The main body includes a top plate made of transparent material and spaced a predetermined distance from the loading plate. The second optical reflector is positioned on the first top plate. The first loading plate loads a portion of a planar optical waveguide of an optical printed circuit board. An optical signal from the planar optical waveguide is reflected by the first optical reflector to the second optical reflector, then is reflected by the second optical reflector to the outside of the optical adapter. | 11-21-2013 |
20130308901 | LIGHT TRANSMISSION SYSTEM WITH OPTICAL WAVEGUIDE - A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections. | 11-21-2013 |
20140233961 | OPTICAL COMMUNICATION MODULE INCLUDING OPTICAL-ELECTRICAL SIGNAL CONVERTERS AND OPTICAL SIGNAL GENERATORS - An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole. | 08-21-2014 |
Patent application number | Description | Published |
20130156374 | OPTICAL-ELECTRICAL MODULE - An optical-electrical module includes a base board and an optical transmitting unit fixed on the base board. The optical transmitting unit includes an edge-emitting laser transmitting optical signals parallel to the base board, a driving integrated circuit for driving the edge-emitting laser to transmit optical signals, and a first lens unit for transmitting and converging the optical signals. Furthermore, the optical-electrical module can also include an optical receiving unit used to receive the optical signals transmitted by the optical transmitting unit and convert the optical signals into electrical signals. The optical receiving unit includes a photo diode, a transimpedance amplifier, and a second lens unit. | 06-20-2013 |
20130315546 | OPTICAL PRINTED CIRCUIT BOARD - An optical PCB includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface. The surface includes a flat area. The conductive traces are formed on the surface of the substrate and only positioned outside of the flat area. The solder resist layer is formed on the substrate and covers the conductive traces. The light waveguide is positioned on the solder resist layer. An orthogonal projection of the light waveguide on the surface of the substrate coincides with the flat area. | 11-28-2013 |
20130330044 | OPTICAL CONNECTOR WITH REDUCED SIZE - An optical connector includes a substrate, a number of light emitters, a number of light receivers, and a lens module. The light emitters and the light receivers are positioned on the substrate. The lens module is positioned on the substrate, and the light emitters and the light receivers are received in the lens module. The lens module includes a reflection surface, a number of first lenses, and a number of second lenses. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The first lenses are aligned with the light emitters and the light receivers. | 12-12-2013 |
20140119017 | LIGHT SOURCE MODULE INCORPORATING LASER LIGHT SOURCE - A light source module includes a laser light source, and an optical lens facing the laser light source. The optical lens includes a first light reflecting face, a second light reflecting face facing the first light reflecting face, a light incident face connecting the first light reflecting face and the second light reflecting face, and a light emitting face opposite to the light incident face. Light emitted from the laser light source is firstly reflected to the second reflecting face by the first reflecting face, then reflected to the light incident face by the second reflecting face, and then entered into the optical lens from the light incident face, and transmitted in the optical lens, finally exited from the light emitting face. | 05-01-2014 |
20140133798 | LIGHT SOURCE USING LASER DIODES - A light source includes a base, a first bonding layer, at least two laser diodes, a second bonding layer, a substrate, and a planer waveguide. The laser diodes are fixed to and are electrically connected to the base using the first bonding layer, and each of the laser diodes includes a side surface for emitting light. The substrate is fixed to the base using the second bonding layer. The waveguide is formed on the substrate and includes an output section including an output end and at least two input branches branching off from an end of the output section opposite to the output end. Each of the input branches includes an input end opposite to the output section and aligning with a respective one of the side surfaces of the at least two laser diodes. | 05-15-2014 |
20140138127 | CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING CONSISTENT IMPEDANCE - A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area. | 05-22-2014 |
20140140667 | CIRCUIT BOARD AND OPTICAL-ELECTRICAL MODULE WITH SAME - A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped. | 05-22-2014 |
20140151536 | OPTICAL COMMUNICATION MODULE - An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board. | 06-05-2014 |
20140168611 | LASER PROJECTION DEVICE - A laser projection device includes a blue laser chip, a red laser chip and a green laser chip and a spectroscope arranged on light paths of laser beams emitted from the laser chips. The laser projection device further includes a substrate. The laser chips are mounted on the substrate. The laser beams emitted from the laser chips are converged by a lens to reach the spectroscope and then reflected by the spectroscope to mix together. | 06-19-2014 |
20140168612 | LASER PROJECTION DEVICE - A laser projection device includes three laser chips, a spectroscope arranged on light paths of laser beams emitted from the three laser chips, and a lens mounted between the laser chips and the spectroscope. The lens includes a main body and a bending part bent from the main body. The main body is on the light paths of two of the laser chips. The bending part is on the light path of another laser chip. The laser beams emitted from the corresponding two laser chips are refracted by the main part of the lens. The laser beams emitted from the corresponding another laser chip are refracted by the bending part. The laser beams emitted from the laser chips are converged by the lens to reach the spectroscope and then reflected by the spectroscope to be mixed together. | 06-19-2014 |
20140175266 | CIRCUIT BOARD ASSEMBLY EMPLOYED IN OPTICAL CONNECTOR - A circuit board assembly includes a printed circuit board (PCB), at least two laser diodes, a number of first bonding wires, at least two photo diodes and a number of second bonding wires. The PCB includes a mounting surface, a first connecting pad, and a second connecting pad, both the first connecting pad and the second connecting pad are positioned on the mounting surface. The at least two laser diodes and the driving chip mounted on the first connecting pad. The first bonding wires each electrically connects the laser diodes to the driving chip. The photo diodes and the transimpedance amplifier mounted on the second connecting pad. The second bonding wires each electrically connects the photo diodes to the transimpedance amplifier. | 06-26-2014 |
20140176913 | LASER PROJECTION DEVICE - An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color. | 06-26-2014 |
20140182902 | CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE - A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces. | 07-03-2014 |
20140199033 | OPTICAL CONNECTOR WITH PRINTED CIRCUIT BOARD AND LENS ELEMENT BONDED TO EACH OTHER - An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit boar and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board. | 07-17-2014 |
20140209791 | PHOTOELECTRIC COUPLING MODULE - A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit. | 07-31-2014 |
20140209792 | PHOTOELECTRIC COUPLING MODULE - A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate carries at least two alignment marks for correct and absolute positioning of the lens module on the substrate. The photoelectric unit is positioned on the substrate. The lens module defines at least two through holes aligned with the alignment marks. | 07-31-2014 |
20140212099 | OPTICAL CONNECTOR CONNECTED BETWEEN ELECTRONIC DEVICE AND OPTICAL FIBER - An optical connector includes a substrate, a photoelectric element, and a base. The substrate includes a bearing surface. The photoelectric element includes a base, at least one light emitter, and at least one light receiver. The base is positioned on the bearing surface and includes an installing surface substantially perpendicular to the bearing surface. The light emitters and the light receivers are positioned on the installing surface. The optical element includes at least two first lenses and at least two second lenses aligned with the first lenses. The light emitters and the light receivers are aligned with the first lenses. | 07-31-2014 |
20140262441 | CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE - A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than a width of the connector traces. The dielectric layer includes trace areas of different depths for each type of trace to achieve a uniform impedance throughout all traces. | 09-18-2014 |
20140307231 | LASER PROJECTION DEVICE - A laser projection device includes a substrate, three laser diodes mounted on the substrate, and a spectroscope located on light paths of the laser diodes. The laser diodes are arranged along an arc-shaped curve. A sector-shaped region is defined by the three laser diodes and two intersected sides of the substrate. The spectroscope is located at the sector-shaped region. Light emitted from the laser diodes is adjusted by the spectroscope to transmit along a common direction and be mixed with each other. | 10-16-2014 |
20140321129 | LIGHT EMITTING DIODE MODULE - An LED module includes a circuit board with circuit arranged thereon and an LED package mounted on the circuit board via flip-chip mounting. The LED package includes a substrate, a pin structure and a reflector arranged on the substrate, an LED chip disposed on the pin structure and an encapsulation layer covering the LED chip and received in the reflector. A top surface of the encapsulation layer adjacent to the circuit board acts as a light outputting surface. The pin structure extends from the substrate to a top surface of the reflector near the light outputting surface. The pin structure electrically connects the circuit board by conductive adhesive arranged therebetween. The light outputting surface faces a through hole defined in the circuit board. Light emitted from the LED chip travels through the light outputting surface and the through hole in sequence to illuminate. | 10-30-2014 |
20140321815 | OPTICAL CONNECTOR AND CIRCUIT BOARD OF SAME - A circuit board includes a first circuit substrate configured for mounting a driving chip and a second circuit substrate positioned on and electrical connected to the first circuit substrate. The second circuit substrate comprises two first top pads, and each of the first top pads can be configured for mounting a light emitter. The second circuit substrate is arranged on the first circuit substrate and can be employed to mount the light emitters, which can improve the precision in the process of mounting the light emitters. | 10-30-2014 |
20140321816 | OPTICAL CONNECTOR - Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface of the receiving groove, and the photoelectric element is aligned with the through hole. The coupler is positioned on the first surface of the substrate and is aligned with the photoelectric element through the through hole. The holder holds an optical fiber. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element. | 10-30-2014 |
20140347638 | MINIATURE PROJECTION DEVICE - A miniature projection device includes a rotatable bracket assembly, a rotating plate, a driving device, and a light source unit. The rotating plate is rotatably mounted to the rotatable bracket assembly. The driving device is configured to drive the rotatable bracket assembly to rotate in a first direction, and to drive the rotatable plate to rotate in a second direction. The first direction is substantially perpendicular to the second direction. The light source unit is mounted on the rotatable plate and is capable of rotating together with the rotating plate. The light source unit is configured to emit laser beams and to project the laser beams onto a screen. | 11-27-2014 |
20140368897 | MEMS-BASED RAPIDSCAN DEVICE AND PROJECTOR HAVING SAME - A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a rotating seat, a substrate, a reflective mirror, a driver, and a controller. The rotating seat is rotably positioned on the base. The substrate is positioned on the rotating seat. The at least one MEMS reflective mirror is formed on the substrate and configured for rotating in two directions under control of the attached driver and controller to form two-dimensional images in a range. | 12-18-2014 |
20140375969 | MEMS-BASED RAPIDSCAN DEVICE AND PROJECTOR HAVING SAME - A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a first substrate, a first reflective mirror, a second substrate, and a second reflective mirror. The first substrate and the second substrate are adjacently positioned on the base. The first reflective mirror is formed on the first substrate by a micro electro-mechanical system (MEMS) technology and configured for receiving a light beam and rotating in two directions under control of the MEMS for reflect the received light in two directions. The second reflective mirror is formed on the rotatable second substrate to receive the image and be rotated, thus further adjusting the range of the projected images. | 12-25-2014 |
20150034375 | CIRCUIT BOARD ASSEMBLY WITH PADS AND CONNECTION LINES HAVING SAME RESISTANCE VALUE AS THE PADS AND IMPEDANCE MATCHING METHOD - A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad. | 02-05-2015 |
20150362831 | LASER PROJECTION DEVICE - An exemplary laser projection device includes a substrate, a first laser diode, a second laser diode, a third laser diode, and a triangular spectroscope located among the first, second and third laser diodes. The first, second and third laser diodes are located at vertices of a triangle, respectively. The spectroscope is located on light paths of the laser diodes. The spectroscope includes a first lateral face, a second lateral face, and a third lateral face interconnecting the first lateral face and the second lateral face. Each lateral face of the spectroscope is corresponding with one respective laser diode. A first and a second light splitting films are formed on two of the lateral faces of the spectroscope respectively. Light emitted from the laser diodes is adjusted by the first and second light splitting films to transmit along a common direction and be mixed with each other. | 12-17-2015 |