Patent application number | Description | Published |
20090116284 | MEMORY APPARATUS AND METHOD THEREOF FOR OPERATING MEMORY - A memory apparatus, a controller, and a method thereof for programming non-volatile memory cells are provided. The memory apparatus includes a plurality of memory cells, wherein each memory cell shares a source/drain region with a neighboring memory cell. The method utilizes a compensation electron flow applied into a source/drain region between two memory cells to provide enough electron flow to program one of the two memory cells, even under the circumstances that the other memory cell has a greater threshold voltage, such that the dispersion of the programming speed of the memory cells is reduced. | 05-07-2009 |
20100176437 | MEMORY ARRAY AND METHOD FOR MANUFACTURING AND OPERATING THE SAME - The invention provides a memory array. The memory array comprises a substrate, a plurality of word lines, a charge trapping structure, a plurality of trench channels and a plurality of bit lines. The word lines are located over the substrate and the word lines are parallel to each other. The charge trapping structure covers a surface of each of the word lines. The trench channels are located over the substrate and the word lines and the trench channels are alternatively arranged and each trench channel is separated from the adjacent word lines by the charge trapping structure. The bit lines are located over the word lines and each bit line is across over each of the word lines and each trench channel is electrically coupled to the bit lines. | 07-15-2010 |
20110079840 | MEMORY CELL AND MANUFACTURING METHOD THEREOF AND MEMORY STRUCTURE - A memory cell is provided. The memory cell includes a substrate, an isolation layer, a gate, a charge storage structure, a first source/drain region, a second source/drain region and a channel layer. The isolation layer is disposed over the substrate. The gate is disposed over the isolation layer. The charge storage structure is disposed over the isolation layer and the gate. The first source/drain region is disposed over the charge storage structure at two sides of the gate. The second source/drain region is disposed over the charge storage structure at top of the gate. The channel layer is disposed over the charge storage structure at sidewall of the gate and is electrically connected with the first source/drain region and the second source/drain region. | 04-07-2011 |
20120018790 | NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF - A non-volatile memory including a substrate, a stacked gate structure, two doped regions and a plurality of spacers is provided. The stacked gate structure is disposed on the substrate, wherein the stacked gate structure includes a first dielectric layer, a charge storage layer, a second dielectric layer and a conductive layer in sequence from bottom to top relative to the substrate. The doped regions are disposed in the substrate at two sides of the stacked gate structure, respectively, and bottom portions of the doped regions contact with the substrate under the doped regions. The spacers are respectively disposed between each side of each of the doped regions and the substrate, and top portions of the spacers are lower than top portions of the doped regions. | 01-26-2012 |
20120287724 | METHOD OF PROGRAMMING MEMORY AND MEMORY APPARATUS UTILIZING THE METHOD - A method of programming a memory is provided. The memory has a first cell, having a first S/D region and a second S/D region shared with a second cell. The second cell has a third S/D region opposite to the second S/D region. When programming the first cell, a first voltage is applied to a control gate of the first cell, a second voltage is applied to a control gate of the second cell to slightly turn on a channel of the second cell, a third and a fourth voltage are respectively applied to the first and the third S/D regions, and the second S/D region is floating. A carrier flows from the third S/D region to the first S/D region, and is injected into a charge storage layer of the first cell by source-side injection. | 11-15-2012 |
20120326222 | MEMORY STRUCTURE AND FABRICATING METHOD THEREOF - A memory structure including a memory cell is provided, and the memory cell includes following elements. A first gate is disposed on a substrate. A stacked structure includes a first dielectric structure, a channel layer, a second dielectric structure and a second gate disposed on the first gate, a first charge storage structure disposed in the first dielectric structure and a second charge storage structure disposed in the second dielectric structure. At least one of the first charge storage structure and the second charge storage structure includes two charge storage units which are physically separated. A first dielectric layer is disposed on the first gate at two sides of the stacked structure. A first source and drain and a second source and drain are disposed on the first dielectric layer and located at two sides of the channel layer. | 12-27-2012 |
20120327721 | METHOD FOR ERASING MEMORY ARRAY - A method for erasing a memory array is provided. The memory array comprises a plurality of memory cell strings, and each of the memory cell strings comprises a plurality of memory cells connected to a plurality of word lines. The method for erasing the memory array includes the following steps. A first voltage is applied to a substrate of the memory array. A second voltage is applied to a word line of a selected memory cell, and a plurality of passing voltages are applied to other word lines. And, a third voltage and a fourth voltage are respectively applied to a first source/drain region and a second source/drain region of the selected memory cell, so that a band to band (BTB) hot hole injecting method is induced to erase the specific memory cell, wherein the third voltage is not equal to the fourth voltage. | 12-27-2012 |
20130099303 | MEMORY AND MANUFACTURING METHOD THEREOF - A memory and a manufacturing method thereof are provided. A plurality of stacked structures extending along a first direction is formed on a substrate. Each of the stacked structures includes a plurality of first insulating layers and a plurality of second insulating layers. The first insulating layers are stacked on the substrate and the second insulating layers are respectively disposed between the adjacent first insulating layers. A plurality of trenches extending along the first direction is formed in each of the stacked structures. The trenches are respectively located at two opposite sides of each of the second insulating layers. A first conductive layer is filled in the trenches. A plurality of charge storage structures extending along a second direction is formed on the stacked structures and a second conductive layer is formed on each of the charge storage structures. | 04-25-2013 |
20130105882 | MEMORY STRUCTURE AND FABRICATING METHOD THEREOF | 05-02-2013 |
20130176789 | MEMORY ARRAY AND METHOD FOR PROGRAMMING MEMORY ARRAY - A method for programming a memory array is provided. The memory array includes a memory cell string composed of a first transistor, a plurality of memory cells and a second transistor connected in series, and the method for programming the memory array includes following steps. In a setup phase, a switching memory cell in the memory cells is turned off, and a first voltage and a second voltage are applied to a first source/drain and a second source/drain of the switching memory cell. In a programming phase, a bit line connected to the memory cell string is floating, and a ramp signal is provided to a word line electrically connected to the switching memory cell. | 07-11-2013 |
20140306282 | MULTI LEVEL PROGRAMMABLE MEMORY STRUCTURE - A memory structure includes a memory cell, and the memory cell includes following elements. A first gate is disposed on a substrate. A stacked structure includes a first dielectric structure, a channel layer, a second dielectric structure and a second gate disposed on the first gate, a first charge storage structure disposed in the first dielectric structure and a second charge storage structure disposed in the second dielectric structure. The first charge storage structure is a singular charge storage unit and the second charge storage structure comprises two charge storage units which are physically separated. A channel output line physically connected to the channel layer. A first dielectric layer is disposed on the first gate at two sides of the stacked structure. A first source or drain and a second source or drain are disposed on the first dielectric layer and located at two sides of the channel layer. | 10-16-2014 |