Jyun-Lin
Jyun-Lin Cian, Hsin-Chu TW
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20160088276 | PROJECTION DISPLAY SYSTEM AND METHOD FOR CORRECTING PROJECTION REGION - A projection display system and a correcting method are provided. The projection display system includes a plurality of projection devices, an image capturing device, a blending device and computing device. The projection devices are configured to project a plurality of projection regions to a projection surface. The image capturing device is configured to capture an image on the projection surface. The computing device determines locations of the projection regions according to the image captured by the imaging capture device. A display screen of the computing device is configured to display a control interface including a display screen region proportionally corresponding to the projection regions. The computing device dynamically adjusts a projection ratio of an image frame displayed on the projection region by adjusting locations of control points on the display screen region and a space between the control points. | 03-24-2016 |
Jyun-Lin Huang, Tu Cheng TW
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20120055975 | AUTOMATIC SOLDERING SYSTEM - An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism. | 03-08-2012 |
Jyun-Lin Huang, New Taipei City TW
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20130334904 | ELECTROMOTIVE FORCE GENERATOR AND ELECTRIC POWER GENERATING MODULE USING THE SAME - An electric power generating module includes an electromotive force (EMF) generator and a circuit unit. The EMF generator has a shell having two opposite plates, a coil unit mounted to one of the plates, first and second stationary magnets disposed in the shell with different magnetic pole, and a moveable magnet having a magnetic pole opposite to that of the first stationary magnet. The moveable magnet is moveable between a first position adjacent to a first side of the second stationary magnet and a second position adjacent to a second side of the second stationary magnet along a circumference of the first stationary magnet across a space defined between the coil unit and the other one of the plates. The circuit unit is electrically connected with the coil unit. When the EMF generator is shaken, electric power is produced by the electric power generating module. | 12-19-2013 |
Jyun-Lin Wu, Hsin-Chu TW
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20150214150 | Capacitor with Fuse Protection - An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node. | 07-30-2015 |
Jyun-Lin Wu, Hsinchu City TW
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20160086902 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor package structure includes a semiconductor substrate including a plurality of through substrate vias (TSV) extending from a first surface to a second surface of the semiconductor substrate, wherein the second surface is opposite to the first surface; a plurality of conductive bumps on the second surface and connected to a corresponding TSV; a polymeric layer on the second surface and surrounding a lower portion of a corresponding conductive bump. The polymeric layer includes a first portion configured as a blanket covering a periphery region of the semiconductor substrate; and a second portion in a core region of the semiconductor substrate and configured as a plurality of isolated belts, wherein each of the isolated belts surrounds a corresponding conductive bump. | 03-24-2016 |