Patent application number | Description | Published |
20090119287 | IMAGE PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM - The Object of the present invention is providing a filtering function that is easily used for filtering a document whose importance is changed as time passes. For that end, importance of each search condition and a valid period of the importance are set in association with each other. On searching log data matching the set search condition, calculation is performed on a score of log data matching the search condition on the basis of an execution time of a search, importance of the search condition and the valid period of the importance. Log data having the score thus calculated exceeding a predetermined threshold is extracted. | 05-07-2009 |
20100238490 | INFORMATION PROCESSING APPARATUS, METHOD OF CONTROLLING INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM - This invention provides an information processing system and control method thereof for reducing a storage capacity requested of a database and preventing the expiration of reference to image data. To accomplish this, in an information processing system according to this invention, when an image processing apparatus is to store the job history of an output job in a database via an information processing server, only attribute information including identification information of image data used to execute the job is stored. If the image data has already been stored in the database, the expiration date of the image data is changed to one added to the attribute information. | 09-23-2010 |
20100332636 | INFORMATION PROCESSING APPARATUS THAT REGISTERS INFORMATION ON IMAGE PROCESSING JOB IN DATA SERVER, METHOD OF CONTROLLING THE SAME, AND STORAGE MEDIUM - An information processing apparatus which enables reduction of the capacity of a data server. An intermediate server receives audit information concerning a job executed by an MFP or PC. The intermediate server registers at least one of attribute information and content information contained in the received audit information, in the data server. A registration processing determination section of the intermediate server determines a type of the job which the received audit information concerns. The section causes a job information and content information registration section to register the attribute information and the content information contained in the received audit information in the data server, or a content information registration section to register the content information in the data server without registering the attribute information therein. | 12-30-2010 |
20110029572 | DATA PROCESSING SYSTEM AND METHOD OF CONTROLLING THE SYSTEM - The present invention relates to a data processing system and method of controlling the system which store job histories of jobs executed on a data processing apparatus. A database stores job attribute data and content data of jobs executed on the data processing apparatus as well as retention dates set for the job attribute data and content data. The database determines the content data to be deletable if data serving as the basis of the content data has been deleted on the data processing apparatus, and deletes the content data upon expiration of its retention date. | 02-03-2011 |
20110032572 | JOB HISTORY DATA INSPECTION SYSTEM - There is provided a job history data inspection system capable of appropriate access control on job histories. A data processing apparatus includes a reception unit configured to receive job history data about a history of a job executed by an image processing unit, a setting unit configured to acquire, based on information about a job execution user included in the job history data received by the reception unit, access right information about the job execution user and set the acquired access right information in the job history data received by the reception unit, and a storage unit configured to store in a memory unit job history data including the access right information set by the setting unit. | 02-10-2011 |
20120229823 | OUTPUT APPARATUS, SYSTEM, CONTROL METHOD, AND STORAGE MEDIUM STORING A PROGRAM - An output apparatus includes a generation unit configured to generate a two-dimensional code by encoding information indicative of the output apparatus, information indicative of an output time of an image output by the output apparatus, and information indicative of a page number and a print copy number when the image is output, a combining unit configured to combine the generated two-dimensional code with the image, and an output unit configured to output the image including the two-dimensional code. | 09-13-2012 |
20130038902 | INFORMATION PROCESSING APPARATUS AND INFORMATION PROCESSING METHOD - An information processing apparatus, which stores attribute data of a job executed by an image processing apparatus, and reference information of image data associated with the job in a storage device as a job log, saves image data corresponding to reference information in the storage device as cached data. Then, the apparatus acquires image data corresponding to reference information included in a job log from the cached data in the storage device, and outputs a job log appended with the acquired image data to an external system. | 02-14-2013 |
20140036311 | JOB HISTORY MANAGEMENT SYSTEM AND CONTROL METHOD THEREOF - In a job history management system, a printer determines whether the print data includes a job history recorded flag indicating that a PC has recorded a job history of the print data and has transmitted the job history to a job history management server. If the printer determines that the job history recorded flag is not included in the print data, the printer transmits the print data to a multifunction peripheral. Upon receiving the print data from the printer, the multifunction peripheral records the job history of the print data and transmits the job history to the job history management server, without performing a printing process based on the received print data. | 02-06-2014 |
Patent application number | Description | Published |
20130285254 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBTRATE - A wiring substrate includes a core substrate. The core substrate includes a first surface, a second surface, and an opening extending through the core substrate between the first and second surfaces. A first conductive film is formed on the first surface and covers the opening. A second conductive film is formed on the second surface. The second conductive film covers the opening. An electronic component is arranged in the opening and connected to the first conductive film. An insulator fills the opening. A first wiring portion includes alternately stacked insulative layers and wiring layers and covers the first surface of the core substrate and the first conductive film. A second wiring portion includes alternately stacked insulative layers and wiring layers, and covers the second surface of the core substrate and the second conductive film. | 10-31-2013 |
20130319740 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively. | 12-05-2013 |
20140063763 | WIRING BOARD - A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component. | 03-06-2014 |
20140291859 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer. | 10-02-2014 |
20140360760 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer. | 12-11-2014 |
20140360765 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located. | 12-11-2014 |
20150041053 | Method of Manufacturing Wiring Substrate - A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other. | 02-12-2015 |