Patent application number | Description | Published |
20090274412 | OPTICAL MODULE, METHOD OF PRODUCING OPTICAL MODULE, OPTICAL TRANSMISSION MODULE, AND ELECTRONIC APPARATUS - An optical module comprising has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of said optical transmission path or a light incidence surface of the optical transmission path is arranged such that said optical element and said optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of said optical element. Said optical element is sealed by a sealing agent. A gap is provided between said optical transmission path and the surface of said sealing agent on the light receiving surface or the light emitting surface of said optical element. | 11-05-2009 |
20090279827 | OPTICAL TRANSMISSION MODULE - An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent. | 11-12-2009 |
20100303412 | OPTICAL TRANSMISSION MODULE AND ELECTRONIC DEVICE - An optical transmission module has a light-emitting element, a light-receiving element, and an optical path for optically coupling the light-emitting element and the light-receiving element, and transmitting a optical signal. The optical path has a core part, a clad part surrounding the core part, and a support board for supporting the optical path itself and the light-receiving element. A resin part formed of resin having a refractive index higher than air outside the optical path is arranged at a part of a surface area of the clad part along an optical transmission direction to which optical signals are transmitted. The resin part has an inclined surface in which the surface on the opposite side of the clad part is tilted relative to the optical transmission direction. The inclined surface forms an acute angle with the surface of the clad part at the opposite side of the light-receiving element in the resin part. | 12-02-2010 |
20140021565 | SENSOR PACKAGE - A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove. | 01-23-2014 |
Patent application number | Description | Published |
20090152241 | PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD - The invention provides a method and apparatus for performing plasma etching to form a gate electrode on a large-scale substrate while ensuring the in-plane uniformity of the CD shift of the gate electrode. The present invention measures a radical density distribution of plasma in the processing chamber, feeds processing gases into the processing chamber through multiple locations and controls either the flow rates or compositions of the respective processing gases or the in-plane temperature distribution of a stage on which the substrate is placed, or feeds processing gases into the processing chamber through multiple locations and controls both the flow rates or compositions of the processing gases and the in-plane temperature distribution of the stage on which the substrate is placed. | 06-18-2009 |
20100127974 | DATA INSPECTING DEVICE AND METHOD - A data inspecting device displays each of a plurality of data individually indicated as a mark which can be reproduced by a reproducing element and which has a length, so that the data inspecting device makes it possible to inspect a plurality of the data. The data inspecting device is provided with a calculating element for calculating the degree of mutual relevancy to predetermined kinds of parameters at different length points between one group of data which the reproducing element is reproducing out of a plurality of the data and the other groups of the data except such one group of the data and a display element for displaying the mark indicative of each of the other groups of data corresponding to the point in a different mode of display in accordance with the calculated relevancy. This makes a user recognize more accurately the relevancy of the mutual data. | 05-27-2010 |
20130247110 | IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - An image processing apparatus includes a receiving unit configured to receive image data of program content and genre information relating to the program content, a selection unit configured to select a size selection parameter for causing the genre information received by the receiving unit to be reflected in a block size, a determination unit configured to determine a block size in accordance with the size selection parameter selected by the selection unit, the block size being used for orthogonal transformation, and an orthogonal transformation unit configured to perform orthogonal transformation on the image data received by the receiving unit at the block size determined by the determination unit. | 09-19-2013 |
20140246585 | MEASURING METHOD, DATA PROCESSING APPARATUS AND ELECTRON MICROSCOPE USING SAME - The objective of the invention is to provide a measuring method that can determine pattern contours and dimensions with high precision even if an object to be measured shrinks due to electron beam radiations. In order to achieve this objective, a method, which performs measurements by irradiating an electron beam onto a sample having a pattern formed on a primary coating thereof, prepares an SEM image and contour of the pattern (S | 09-04-2014 |
20150036914 | METHOD FOR ESTIMATING SHAPE BEFORE SHRINK AND CD-SEM APPARATUS - In the present invention, at the time of measuring, using a CD-SEM, a length of a resist that shrinks when irradiated with an electron beam, in order to highly accurately estimate a shape and dimensions of the resist before shrink, a shrink database with respect to various patterns is previously prepared, said shrink database containing cross-sectional shape data obtained prior to electron beam irradiation, a cross-sectional shape data group and a CD-SEM image data group, which are obtained under various electron beam irradiation conditions, and models based on such data and data groups, and a CD-SEM image of a resist pattern to be measured is obtained (S | 02-05-2015 |
Patent application number | Description | Published |
20090110350 | OPTICAL CABLE MODULE - An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate. | 04-30-2009 |
20090175579 | OPTICAL TRANSMISSION MODULE, CONNECTING PART, AND ELECTRONIC DEVICE HAVING OPTICAL TRANSMISSION MODULE - A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode. | 07-09-2009 |
20100119238 | LIGHT TRANSMISSION PATH PACKAGE, LIGHT TRANSMISSION MODULE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING LIGHT TRANSMISSION MODULE - A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H | 05-13-2010 |
20110186717 | OPTICAL TRANSMISSION MODULE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING OPTICAL TRANSMISSION MODULE - A light transmission module includes a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for optically coupling with the light transmitted by the light transmission path, and being formed with a light emitting and receiving point having a function of photoelectric conversion and an electrode pad on the light emitting and receiving surface. The light transmission module further includes a substrate mounted with the optical element and an electrical wiring and an electrical connecting member for electrically connecting the electrode pad and the electrical wiring. The substrate includes a wiring exposed surface where the electrical wiring is exposed. The electrical connecting member is made of solidified object of a liquid conductive material arranged to contact the electrical wiring, which is exposed at the wiring exposed surface, and the electrode pad. | 08-04-2011 |
Patent application number | Description | Published |
20080319709 | DIMENSION MEASURING APPARATUS AND DIMENSION MEASURING METHOD FOR SEMICONDUCTOR DEVICE - A dimension of a specific part of a semiconductor device is measured with high accuracy and at a high speed. | 12-25-2008 |
20090299512 | SEMICONDUCTOR MANUFACTURING SYSTEM AND METHOD - In the manufacturing system and the manufacturing method of a semiconductor device using a plasma treatment apparatus, a plasma treatment condition is controlled so that a desired shape is obtained after the plasma processing by using a processing shape prediction model for calculating the shape after the plasma processing from the inspection data of a wafer to be treated prior to the treatment and a response surface model for calculating the processing shape depending on a plasma treatment condition. In this configuration, the processing shape prediction model has an adjustable prediction model coefficient, and this prediction model coefficient is automatically calibrated. | 12-03-2009 |
20120098954 | SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD USING THE SAME - Provided are a semiconductor inspection device and a semiconductor inspection method such that in a specimen image in a single field of view obtained by an electron microscope, it is possible to suppress variations in the edge position measurement error attributable to the materials and structures of the lower layers of measured patterns by a first method, wherein the area in the field of view obtained by electron beam scanning is divided into a plurality of regions on the basis of information regarding the structures and materials of the object to be observed and the electron beam scanning conditions are changed for individual regions ( | 04-26-2012 |
20120212602 | PATTERN DIMENSION MEASUREMENT METHOD AND CHARGED PARTICLE BEAM MICROSCOPE USED IN SAME - In order to provide a pattern dimension measurement method with a small measured error and excellent reproducibility even though defocus occurs and a charged particle beam microscope used in the same, in a method for applying a charged particle beam to a specimen formed with a pattern to measure a pattern dimension from a signal intensity distribution of signal charged particles from the specimen, edge index positions (X | 08-23-2012 |
20120298865 | SCANNING ELECTRON MICROSCOPE - Disclosed is a scanning electron microscope provided with a calculation device ( | 11-29-2012 |
20120327213 | Charged Particle Beam Microscope - Disclosed is a charged particle beam microscope which can obtain information about pattern materials and stereostructure without lowering throughput of pattern dimension measurement. To achieve this, the charged particle beam microscope acquires a plurality of frame images by scanning the field of view of the sample (S | 12-27-2012 |
20130292568 | SCANNING ELECTRON MICROSCOPE AND LENGTH MEASURING METHOD USING THE SAME - This electron scanning microscope comprises an electron source ( | 11-07-2013 |
Patent application number | Description | Published |
20090190100 | IMAGE PROJECTION APPARATUS - An image projection apparatus that illuminates an image forming element arranged downstream of the image forming element and configured to form an original image by using light form a light source, and projects light from the image forming element onto a projected screen includes a housing having an inlet port with a dust removal filter, a fan configured to draw air into the housing through the inlet port, a duct configured to lead the air drawn from the inlet port into a space that contains the image forming element, and a chamber provided between the inlet port and the duct, wherein a sectional area of the chamber is larger in a direction orthogonal to an inflow direction of air into the duct at a connection part between the chamber and the duct than a sectional area of the connection part. | 07-30-2009 |
20090200001 | ELECTRIC APPARATUS - An electric apparatus includes a centrifugal fan that includes an impeller in a casing, and is configured to draw air when the impeller rotates in the casing, and to have a blowoff channel of the air from the impeller in the casing, which spreads in a rotating direction of the impeller, and a first cooled part and a second cooled part that has a necessary cooling air capacity larger than that of the first cooled part, the first cooled part and the second cooled part being cooled by the air drawn by the centrifugal fan, wherein a drawing surface of the centrifugal fan has a first drawing area and a second drawing area that has a drawing speed higher than that of the first drawing area when the impeller rotates. | 08-13-2009 |