| Patent application number | Description | Published |
|---|
| 20080211133 | MOLD, PRODUCTION PROCESS OF MOLD, IMPRINT APPARATUS, AND IMPRINT METHOD - A mold for imprinting a pattern onto a resin material applied onto a substrate is constituted by a mold substrate formed of a material transparent to light in at least a part of a wavelength range of light used for alignment, an alignment structure area having an alignment structure comprising a recess portion, a pattern forming area having a pattern, and a coating layer is formed of a material having an optical characteristic different from that of the mold substrate. The coating layer is on a side wall of the recess portion. | 09-04-2008 |
| 20080292976 | PATTERN FORMING METHOD, PATTERN FORMED THEREBY, MOLD, PROCESSING APPARATUS, AND PROCESSING METHOD - A pattern forming method includes a step of forming a pattern of a resist on a surface of a thin film formed on the base material; a step of forming a reverse layer on the pattern of the resist; a step of forming a reverse pattern, of the reverse layer complementary to the pattern of the resist by removing the resist after removing the reverse layer to expose a surface of the resist; a step of forming a hard mask layer including the thin film, on which the reverse layer is formed, by etching the thin film through the reverse pattern of the reverse layer as a mask; and a step of etching the base material through, as a mask, the hard mask layer on which the reverse layer remains or the hard mask layer on which the reverse layer has been removed. | 11-27-2008 |
| 20080293237 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USING DUAL DAMASCENE PROCESS AND METHOD FOR MANUFACTURING ARTICLE HAVING COMMUNICATING HOLE - A method for manufacturing a semiconductor device is provided, in which the lengths of a wiring trench and a via hole in a depth direction are easily controlled. A component having a first insulating film is prepared on a substrate, and a layer is disposed on the above-described first insulating film. A mold having a pattern is imprinted on the above-described layer so as to form a second insulating film having a wiring trench and a first via, the pattern corresponding to the wiring trench and the first via. Thereafter, the above-described first insulating film is etched by using the above-described second insulating film as a mask so as to form a second via, which is connected to the first via, in the first insulating film. | 11-27-2008 |
| 20090004321 | MOLDING APPARATUS AND MOLDING METHOD - A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece. | 01-01-2009 |
| 20090032998 | MOLDING APPARATUS AND MOLDING METHOD - A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece. | 02-05-2009 |
| 20090039550 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint method, includes the steps of: preparing a substrate; placing an uncured resin material on the substrate; preparing a mold having a first end and a second end; placing the mold to oppose the substrate at a position not sandwiching the resin material, wherein a first gap between the first end and the substrate and a second gap between the second end and the substrate are different from each other; imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of a space between the mold and the substrate; and changing at least one of the first and second gaps in the state that the resin material is present between the mold and the substrate. | 02-12-2009 |
| 20090092791 | MOLD, MOLD PRODUCTION PROCESS, PROCESSING APPARATUS, AND PROCESSING METHOD - A mold for imprinting a pattern onto a member to be processed is constituted by a mold body having a front surface, at which the pattern is formed, and a rear surface opposite from the front surface; a coating layer for covering the front surface of the mold body; and a coating layer for covering the rear surface of the mold body. The coating layer for covering the rear surface of the mold body is partially provided with an opening at the rear surface of the mold body. | 04-09-2009 |
| 20090098688 | IMPRINT METHOD, CHIP PRODUCTION PROCESS, AND IMPRINT APPARATUS - An imprint method is constituted by a step of curing a resin material formed on a substrate in a state in which an imprint pattern of a mold is in contact or proximity with the resin material, and a step of parting the mold from the cured resin material. The parting is effected while irradiating an entire area in which the imprint pattern of the mold is formed and the cured resin material with an electromagnetic wave for ionizing gaseous molecules in an atmosphere in which the mold and the cured resin material are placed. | 04-16-2009 |
| 20090101037 | GAP MEASURING METHOD, IMPRINT METHOD, AND IMPRINT APPARATUS - A gap measuring method for measuring a gap between two members by irradiating the two members with light is constituted by preparing a first member and a second member which are disposed opposite to each other; irradiating the first member and the second member with light from one member side to obtain spectral data about intensity of reflected light or transmitted light from the other member side; and determining a gap between the first member and the second member by comparing the obtained spectral data with a database in which a gap length and an intensity spectrum are correlated with each other. | 04-23-2009 |
| 20090152239 | PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
| 20090152753 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
| 20090166317 | METHOD OF PROCESSING SUBSTRATE BY IMPRINTING - A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin are exposed and the protective layer in the recesses of the pattern in the resin remains, etching the exposed protrusions of the pattern, to expose the substrate, while using the protective layer as a mask to prevent areas covered by the protective layer from being etched, so that a reverse pattern is formed on the protective layer, which has a structure reversed from the pattern imprinted on the resin, and etching the exposed substrate, to etch a pattern in the substrate, while using the reverse pattern as a mask to prevent areas covered by the protective layer from being etched. | 07-02-2009 |
| 20090189306 | MANUFACTURING METHOD OF STRUCTURE BY IMPRINT - A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers. | 07-30-2009 |
| 20090230320 | SCANNING PROBE APPARATUS - In a scanning probe apparatus capable of always effectively canceling an inertial force to suppress vibration even in repetitive use while replacing a sample holding table or a probe, a stage for a sample or the probe includes a drive element for moving the sample holding table and movable portions movable in a direction in which an inertial force generated during movement of the sample holding table. The stage is configured so that the drive element, the movable portions, and the sample holding table or the probe are integrally detachably mountable to a main assembly of the scanning probe apparatus. | 09-17-2009 |
| 20090273124 | NANOIMPRINTING METHOD AND MOLD FOR USE IN NANOIMPRINTING - A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other. | 11-05-2009 |
| 20090283938 | IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT - An imprint apparatus for imprinting a mold pattern onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold. | 11-19-2009 |
| 20100072653 | IMPRINTING APPARATUS AND METHOD THEREFOR - There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel. | 03-25-2010 |
| 20100072664 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto. | 03-25-2010 |
| 20100072667 | IMPRINTING METHOD - An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled. | 03-25-2010 |
| 20100078840 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage. | 04-01-2010 |
| 20100173032 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint apparatus in which a mold having a processing surface on which a predetermined imprint is formed is provided and an uncured resin material placed on a substrate is filled and cured in a space between the mold and the substrate and is subjected to imprint of the predetermined imprint formed on the processing surface of the mold. The imprint apparatus includes an attitude control mechanism for controlling attitudes of the mold and the substrate so that a first gap between a first end of the mold and the substrate and a second gap between a second end of the mold and the substrate are different from each other, and a measuring mechanism for measuring attitudes and positions of the mold and the substrate. Also provided is a mechanism for imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of the space between the mold and the substrate. | 07-08-2010 |
| 20100200544 | PRODUCTION PROCESS OF STRUCTURE - A process for producing a structure containing silicon oxide includes a step of forming a first layer of organic spin-on glass on a substrate and a step of forming a second layer of inorganic spin-on glass on the first layer. Thereafter, the first layer is etched by using a pattern formed on the second layer as a mask and then the first layer and the second layer are calcined to prepare the structure containing silicon oxide. | 08-12-2010 |
| 20100233432 | IMPRINT METHOD AND PROCESSING METHOD OF SUBSTRATE - An imprint method in which imprinting of a pattern of a mold onto a resin material on a substrate is repeated multiple times. The imprint method includes the steps of preparing the mold including a light blocking member at a position where the pattern is not formed, forming a pattern for the first time by bringing the mold into contact with a photocurable resin material provided on the substrate, forming a first processed area by curing the photocurable resin material by light irradiation, and removing a part of the photocurable resin material extruded from the first processed area into an outside area at a periphery of the first processed area. | 09-16-2010 |
| 20100270705 | IMPRINT METHOD AND IMPRINT APPARATUS - An imprint method for imprinting an imprint pattern provided to a mold onto a pattern forming layer formed on a substrate is constituted by a first step of effecting alignment between the substrate and the mold with feedback control; a second step of bringing the mold and the pattern forming layer into contact with each other; a third step of curing the pattern forming layer; and a fourth step of increasing a gap between the substrate and the mold. The imprint method further includes a step of stopping the feedback control between the first step and the second step and/or between the second step and the third step. | 10-28-2010 |
| 20100314799 | PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS IN WHICH A SUBSTRATE AND A MOLD ARE ALIGNED IN AN IN-PLANE DIRECTION - A pattern forming method for forming an imprinted pattern on a coating material disposed on a substrate with a pattern provided to a mold. The method includes preparing a mold provided with a first surface including a pattern area, a second surface located opposite from the first surface, and an alignment mark provided at a position at which the alignment mark is away from the first surface, contacting the pattern area of the mold with the coating material disposed on the substrate, obtaining information about positions of the mold and the substrate by using the alignment mark and a mark provided to the substrate in a state in which the coating material is disposed on the substrate at a portion where the alignment mark and the substrate are opposite to each other, and effecting alignment of the substrate with the mold in an in-plane direction of the pattern area, on the basis of the information in a state in which the pattern area and the coating material contact each other. | 12-16-2010 |
| 20110042348 | IMPRINT METHOD, IMPRINT APPARATUS, AND PROCESS FOR PRODUCING CHIP - An imprint method for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate so as to realize a high throughput includes the steps of bringing the imprint pattern and the pattern formation material into contact with each other; applying a first pressure between the mold and the substrate to increase a contact area between the imprint pattern and the pattern formation material; and adjusting a positional relationship between the mold and the substrate at a second pressure lower than the first pressure. | 02-24-2011 |
| 20110042352 | IMPRINT METHOD AND PROCESSING METHOD OF SUBSTRATE USING THE IMPRINT METHOD - An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed. | 02-24-2011 |
