Patent application number | Description | Published |
20110314110 | MOBILE TERMINAL AND METHOD OF CONTROLLING THE SAME - A mobile terminal and a method of controlling the same are discussed. The mobile terminal includes a touch screen, and a controller acquiring first identification information about a receiving terminal, second identification information about a social network service account, and transmission data through the touch screen and transmitting the transmission data to the receiving terminal corresponding to the first identification information and a server of the social network service account corresponding to the second identification information. Accordingly, the data can be transmitted to the receiving terminal corresponding to the first identification information and the social network service server corresponding to the second identification information to improve the ease of use. | 12-22-2011 |
20130307468 | STRUCTURE OF TRANSMISSION AND RECEPTION UNIT IN WIRELESS CHARGING SYSTEM - The present disclosure provides the structure of a transmission and reception unit in a wireless charging system. To this end, according to an embodiment, there is provided a wireless power receiver configured to receive a wireless power signal from a wireless power transmitter to receive wireless power, and the wireless power receiver may include a receiving coil unit comprising a primary coil and a secondary coil receiving the wireless power signal; and a charger configured to charge power which is a sum of wireless power received by the primary coil and the secondary coil, respectively, based on the wireless power signal. | 11-21-2013 |
20140131895 | MEMORY MODULE AND MEMORY SYSTEM - A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal. | 05-15-2014 |