Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Jung, Uiwang-Si
Doo-Young Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100099043 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent. | 04-22-2010 |
| 20110003248 | Positive photosensitive resin composition - A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage. | 01-06-2011 |
| 20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
| 20110159428 | Positive Type Photosensitive Resin Composition - This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51. | 06-30-2011 |
| 20110171578 | Positive Photosensitive Resin Composition - A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes. | 07-14-2011 |
Ho-Kuk Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110156013 | COMPOUND FOR ORGANIC PHOTOELECTRIC DEVICE AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE SAME - A compound for an organic photoelectric device and an organic photoelectric device including the same, the compound being represented by the following Chemical Formula 1: | 06-30-2011 |
| 20110156014 | MATERIAL FOR ORGANIC PHOTOELECTRIC DEVICE AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE SAME - A material for an organic photoelectric device and an organic photoelectric device including the same, the material including an asymmetric compound represented by the following Chemical Formula 1: | 06-30-2011 |
| 20110248257 | COMPOUND FOR AN ORGANIC PHOTOELECTRIC DEVICE, ORGANIC PHOTOELECTRIC DEVICE, AND DISPLAY DEVICE INCLUDING THE SAME - A compound for an organic photoelectric device, an organic photoelectric device, and a display device including the same, the compound being represented by the following Chemical Formula 1: | 10-13-2011 |
Hyuk Jin Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100152358 | Polycarbonate Resin Composition with High Weld Line Strength - A polycarbonate resin composition of the present invention comprises (A) about 30 to about 95 parts by weight of thermoplastic polycarbonate resin; (B) about 1 to about 50 parts by weight of rubber-modified-vinyl graft copolymer; (C) about 0 to about 50 parts by weight of vinyl copolymer; and (D) about 1 to about 50 parts by weight of amorphous thermoplastic polyester copolymer. The resin composition of the present invention can have excellent physical properties such as weld line strength, fluidity, impact resistance, and heat resistance. | 06-17-2010 |
| 20100160511 | Scratch-Resistant Polycarbonate Resin Composition - Disclosed herein is a scratch-resistant polycarbonate resin composition, the resin composition comprising: (A) about 100 parts by weight of a polycarbonate resin; (B) about 1 to about 30 parts by weight of a phosphate eater compound represented by the following | 06-24-2010 |
Ju-Ho Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110250531 | Photosensitive Resin Composition for Color Filter, and Color Filter Using the Same - The present invention provides a photosensitive resin composition for a color filter including a methine-based dye represented by the following Chemical Formula 1, and a color filter fabricated using the same. | 10-13-2011 |
Kwang Jin Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110155430 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME - An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle. | 06-30-2011 |
Seok Hyun Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110147678 | PASTE FOR SOLAR CELL ELECTRODE AND SOLAR CELL USING THE SAME - A paste for solar cell electrodes includes conductive particles, a glass frit, an organic vehicle, and lead oxide. The lead oxide may be added in an amount of about 0.05 to about 1.5 wt % with respect to a total weight of the paste. | 06-23-2011 |
| 20110227004 | PASTE FOR SOLAR CELL ELECTRODE AND SOLAR CELL USING THE SAME - A paste for solar cell electrodes includes a conductive powder, a glass frit, the glass frit including a crystallized glass frit, and an organic vehicle. | 09-22-2011 |
Sung-Hyun Jung, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110156013 | COMPOUND FOR ORGANIC PHOTOELECTRIC DEVICE AND ORGANIC PHOTOELECTRIC DEVICE INCLUDING THE SAME - A compound for an organic photoelectric device and an organic photoelectric device including the same, the compound being represented by the following Chemical Formula 1: | 06-30-2011 |