Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Jung Ho Kim, Suwon-Si KR

Jung Ho Kim, Suwon-Si KR

Patent application numberDescriptionPublished
20090041095METHOD AND APPARATUS FOR FINE FREQUENCY SYNCHRONIZATION IN WIRELESS BROADBAND (WIBRO) SYSTEM WITHOUT USING GLOBAL POSITIONING SYSTEM (GPS) RECEIVER - Provided is a fine frequency synchronization method of a WiBro system, and particularly, a fine frequency synchronization method which measures a spread degree of a received signal of an adjacent subcarrier using orthogonality of PN sequences and thereby estimates a frequency offset, in a base station or a wireless repeater without using a GPS receiver. The fine frequency synchronization method includes: (a) performing despreading on received adjacent subcarrier sequences, using a PN sequence transmitted from a transmitting party; (b) obtaining ratios of correlative values obtained by the despreading; and (c) estimating a frequency offset on the basis of the ratio of correlative values. Accordingly, fine frequency offset estimation with relatively low complexity is possible without using a GPS receiver in a WiBro environment where interference signals of other base stations or repeaters exist.02-12-2009
20090041097APPARATUS AND METHOD FOR NETWORK-CODING - Provided are a network-coding apparatus and method which can increase a data communication capacity in a communication environment to which an error-correction code (ECC) is applied. The network-coding apparatus includes a received signal processing unit receiving at least two signals, and decoding the at least two received signals; and a transmission signal processing unit receiving the at least two decoded signals from the received signal processing unit, merging the at least two decoded signals, and generating a merged transmission signal.02-12-2009
20100068868Wafer temporary bonding method using silicon direct bonding - A wafer temporary bonding method using silicon direct bonding (SDB) may include preparing a carrier wafer and a device wafer, adjusting roughness of a surface of the carrier wafer, and combining the carrier wafer and the device wafer using the SDB. Because the method uses SDB, instead of an adhesive layer, for a temporary bonding process, a module or process to generate and remove an adhesive is unnecessary. Also, a defect in a subsequent process, for example, a back-grinding process, due to irregularity of the adhesive may be prevented.03-18-2010
20100138055Method of controlling a multi-tub washing machine - A method of controlling a washing machine having a first washing tub and a second washing tub, the method having the operations: receiving a first operating command to be performed in the first washing tub; determining whether the operating command can be performed; and when the operating command can be performed, performing the operating command in the first washing tub.06-03-2010
20100140685Nonvolatile Memory Devices - Nonvolatile memory devices and methods of manufacturing nonvolatile memory devices are provided. The method includes patterning a bulk substrate to form an active pillar; forming a charge storage layer on a side surface of active pillar; and forming a plurality of gates connected to the active pillar, the charge storage layer being disposed between the active pillar and the gates. Before depositing a gate, a bulk substrate is etched using a dry etching to form a vertical active pillar which is in a single body with a semiconductor substrate.06-10-2010
20100224923Semiconductor memory device and method of manufacturing the same - Provided are a semiconductor memory device and a method of manufacturing the same. The semiconductor memory device may include a plurality of active pillars projecting from a semiconductor substrate, a gate pattern disposed on at least a portion of each of the active pillars with a gate insulator interposed therebetween, and a conductive line disposed on each of the active pillars and below the corresponding gate pattern, the conductive line may be insulated from the semiconductor substrate and the gate pattern, wherein each of the active pillars may include a drain region above the corresponding gate pattern, a body region adjacent to the corresponding gate pattern, and a source region that is in contact with the conductive line below the gate pattern.09-09-2010
20100310920CENTER PIN FOR SECONDARY BATTERY AND SECONDARY BATTERY INCLUDING THE SAME - A center pin for a secondary battery, and a secondary battery including the same, are disclosed. The center pin is capable of efficiently preventing generation of heat, ignition and explosion of the secondary battery as may be caused by overcharge or exposure to high temperatures. The center pin comprises a body having a predetermined length, a fluid inserted into the body, and sealing members for sealing the body. The secondary battery comprises an electrode assembly including a positive electrode plate, a negative electrode plate and a separator interposed between the positive electrode plate and the negative electrode plate, a center pin comprising a fluid disposed in the electrode assembly, a can accommodating the electrode assembly and the center pin, and a cap assembly sealing the can.12-09-2010
20110048237Air cleaning humidifier - An air cleaning humidifier which minimizes interference or resistance between cleaned air and a disc assembly mounted to the humidifier to perform the humidifying function while the cleaned air is being passed through the disc assembly by a ventilation fan. The air cleaning humidifier includes a body frame having an air discharge port, a water tub disposed in the body frame, a ventilation fan generating an air current in the body frame, and a disc assembly arranged around the ventilation fan and rotated with a part thereof submerged in the water tub. The disc assembly includes a ring portion forming a circumferential body thereof and a cut portion formed by cutting a part of the ring portion and disposed near the air discharge port.03-03-2011
20110049732Humidification apparatus and disc assembly thereof - Disclosed herein are a humidification apparatus having a disc assembly, and a disc assembly thereof. The disc assembly includes at least one disc member assembled by stacking, a first clamp disposed at one side of the at least one disc member, and a second clamp disposed at the other side of the at least one disc member. Each of the at least one disc member includes at least one recess part indented on the edge thereof, and the first clamp includes at least one recess connection part inserted into the at least one recess part so as to prevent movement of the at least one disc member.03-03-2011
20110084415Air cleaning humidifier and disc assembly thereof - Disclosed herein is an air cleaning humidifier having a disc assembly performing a purifying function and a humidifying function of indoor air, and a disc assembly thereof. The air cleaning humidifier includes a main body, a tub provided in the main body, an air blower fan generating an air current in the tub, and a rotatable disc assembly having a part of the disc assembly being disposed in the tub, and including a plurality of stacked discs, each of at least two of the discs including a body, a plurality of assembly parts defined through a surface of the body, first protrusion parts protruded from one surface of the body, and second protrusion parts protruded from the other surface of the body, the body being divided into a plurality of sectors by the plurality of assembly parts, and the first protrusion parts and the second protrusion parts being alternately formed in even-numbered regions, into which each of the plurality of sectors is divided.04-14-2011

Patent applications by Jung Ho Kim, Suwon-Si KR