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Jung, Gyunggi-Do
Doo Sung Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110097856 | METHOD OF MANUFACTURING WAFER LEVEL PACKAGE - Disclosed is a method of manufacturing a wafer level package, which includes arranging semiconductor dies on a carrier, forming a protective layer between the semiconductor dies of the carrier through screen printing, primarily heat hardening the protective layer, simultaneously pressing and secondarily heat hardening the protective layer, and removing the carrier, so that a thickness difference between the semiconductor dies and the protective layer is not formed and the warping of the wafer level package is reduced. | 04-28-2011 |
Ha Woong Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090027113 | REFERENCE VOLTAGE GENERATING CIRCUIT AND OFFSET-COMPENSATED CURRENT-VOLTAGE CONVERTING CIRCUIT USING THE SAME - There is provided a reference voltage generating circuit generating a reference voltage to be applied to a current-to-voltage converting circuit in order to compensate for an offset voltage of the current-to-voltage converting circuit converting an input current into a voltage and outputting the voltage, the reference voltage generating circuit including: a sampling conversion circuit having the same circuit characteristics as the current-to-voltage converting circuit and adding a predetermined offset to the reference voltage to generate an output voltage; and a comparator controlling the reference voltage so that the output voltage of the sampling conversion circuit is equal to a predetermined voltage, wherein the reference voltage is applied as an input to the sampling conversion circuit. | 01-29-2009 |
Hyun Chul Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20120008254 | Method for manufacturing lithium ion capacitor and lithium ion capacitor manufactured using the same - A method for manufacturing a lithium ion capacitor, and a lithium ion capacitor manufactured using the method are provided. The method for manufacturing a lithium ion capacitor includes: disposing a lithium metal on a capacitor cell including a cathode, a separation film, and an anode; impregnating the capacitor cell with electrolyte including a lithium salt; changing the cathode and the anode to allow lithium ions within the electrolyte to be occluded into the anode; performing a primary reaction in which the cathode and the lithium metal are short-circuited to emit anions from the cathode and lithium ions from the lithium metal and a secondary reaction that the lithium ions emitted from the lithium metal are occluded into the cathode; and recharging the cathode and the anode to allow the lithium ions, which have been occluded into the cathode and the lithium ions within the electrolyte, to be occluded into the anode. | 01-12-2012 |
Hyung Mi Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090310323 | Printed circuit board including electronic component embedded therein and method of manufacturing the same - The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed | 12-17-2009 |
| 20110314667 | Method of manufacturing printed circuit board including electronic component embedded therein - A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed | 12-29-2011 |
Hyun-Min Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090020771 | III-Nitride Semiconductor Light Emitting Device And Method For Manufacturing The Same - The present disclosure relates to an III-nitride compound semiconductor light emitting device and a method of manufacturing the same. The III-nitride compound semiconductor light emitting device includes a substrate with a groove formed therein, a plurality of nitride compound semiconductor layers being grown on the substrate, and including an active layer for generating light by recombination of electron and hole, and an opening formed on the groove along the plurality of nitride compound semiconductor layers. | 01-22-2009 |
Jae Hyun Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090232467 | Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer. | 09-17-2009 |
| 20090290832 | Printed circuit board including optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption. | 11-26-2009 |
| 20100018052 | Method of manufacturing printed circuit board for optical waveguide - Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask. | 01-28-2010 |
| 20100142883 | Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part. | 06-10-2010 |
| 20100316329 | OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME - Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency. | 12-16-2010 |
| 20100316330 | PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDES AND METHOD OF MANUFACTURING SAME - Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased. | 12-16-2010 |
Moon Sik Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20080267603 | Auto-focusing camera module having liquid lens - Provided is an auto-focusing camera module having a liquid lens. The auto-focusing camera module includes a lens barrel having a liquid lens and a solid lens stacked and disposed therewith; an image sensor for focusing light that is passed through the liquid lens and the solid lens; a substrate provided in a lower end of the lens barrel to electrically mount the image sensor; and a power supply unit fixed integrally in the lens barrel and electrically coupled between the liquid lens and the substrate to apply a power source to the liquid lens. Therefore, the auto-focusing camera module may be useful to control its focus to coincide with high pixels and high performances of the camera module, manufacture a small final product by lowering the entire height of the camera module, enhancing the productivity of the camera module by employing a simple liquid lens to simplify an assembly structure of the liquid lens that is in contact with the substrate, and reduce the manufacturing cost. | 10-30-2008 |
Se Ho Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100118371 | THREE-DIMENSIONAL SPACE SCANNER - A three-dimensional space scanner can obtain spatial data by scanning a space around a mobile object not only in the horizontal direction but also in the vertical direction to measure a distance to a surrounding obstacle using a mirror that is driven to rotate as well as to tilt. | 05-13-2010 |
Suk Ho Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100090231 | LED PACKAGE MODULE - An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size. | 04-15-2010 |
| 20100171143 | LIGHT EMITTING DIODE PACKAGE - There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes. | 07-08-2010 |
Su Young Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110156539 | PIEZOELECTRIC ACTUATOR FOR ACTUATING HAPTIC DEVICE - Disclosed herein is a piezoelectric actuator for actuating a haptic device, which includes a piezoelectric element having a plurality of piezoelectric layers which are stacked and have the same polling direction, and an electrode pattern formed on the piezoelectric element, in which the length of each of the plurality of piezoelectric layers is greater than or equal to four times the width of each of the plurality of piezoelectric layers, and the width of each of the plurality of piezoelectric layers is greater than or equal to ten times the thickness of each of the plurality of piezoelectric layers, so that the piezoelectric actuator can greatly vibrate in the direction of length with reduced power consumption. | 06-30-2011 |
| 20110157035 | ACTUATOR MODULE - Disclosed herein is an actuator module that improves vibration of a touch screen pad. More specifically, the actuator module is configured to include a plate that is positioned at the lower part of a touch display module in which an image display unit is coupled to the lower part of a touch screen panel, a vibration generator that is positioned at the lower part of the plate and is mechanically deformed by compression or contraction when voltage is applied, and an adhesive layer that bonds the touch display module to the plate and the plate to the vibration generator and generates bending moment by the mechanical deformation of the vibration generator, thereby making it possible to transfer the vibration by the vibration generator directly to the touch screen panel and be designed in an ultra-thin type. | 06-30-2011 |
| 20110163634 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate, two or more elastic members, and a piezoelectric element. The elastic members are provided on each of opposite ends of the plate in a longitudinal direction thereof and protrude perpendicularly from the plate in such a way that a first end of each of the elastic members is coupled to an electronic device. The piezoelectric element is provided on a first surface of the plate and transmits vibrating force to the electronic device. The piezoelectric actuator module includes a plate having on opposite ends thereof two or more elastic members, thus being capable of controlling vibrating force by changing the length of the plate and the number of the elastic members, in addition to reliably supporting piezoelectric elements provided on the plate. | 07-07-2011 |
| 20110163635 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate. An elastic member is provided on each of opposite ends of the plate in a longitudinal direction thereof, and protrudes perpendicularly from the plate in such a way that a first end of the elastic member is coupled to an electronic device. A plate-shaped elastic body is provided on a first surface of the plate. A piezoelectric element is provided on a first surface of the elastic body. The plate-shaped elastic body is provided between the plate and the piezoelectric element, so that the overall spring constant of the piezoelectric actuator module is lowered and thus the vibrating force of the piezoelectric actuator module is increased. | 07-07-2011 |
| 20110273405 | TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a case that partitions an internal space, a touch panel module that is received in the case to recognize external pressure, a first actuator that is mounted at the lower part of the touch panel module to generate vibration, a second actuator that is mounted at the case to generate vibration, and | 11-10-2011 |
Woo-Suk Jung, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100148192 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode display includes: a substrate member; a pixel electrode formed on the substrate member; a pixel defining film having an opening through which the pixel electrode is exposed, and formed on the substrate member; a light absorbing layer pattern for dividing the opening into a plurality of sub-emitting areas within the opening of the pixel defining film; an organic light emitting layer formed on the pixel electrode; and a common electrode formed on the organic light emitting layer. | 06-17-2010 |