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Jung, Chungcheongnam-Do
Hoe-Chul Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100172820 | METHOD OF PREPARATION OF SPHERICAL SUPPORT FOR OLEFIN POLYMERIZATION CATALYST - Provided is a method of preparation of a spherical support for an olefin polymerization catalyst. Specifically, provided is a method of preparation of a support which can be used in preparation of an olefin polymerization catalyst, wherein, MgX(I) (X=halogen atom) is prepared by reacting a reaction initiator, nitrogen halide, and magnesium metal, and then magnesium metal and alcohol are reacted in the presence of the MgX, thereby resulting a smooth-surfaced spherical dialkoxy magnesium support having a uniform particle size distribution. | 07-08-2010 |
| 20100172821 | METHOD OF PREPARATION OF SPHERICAL SUPPORT FOR OLEFIN POLYMERIZATION CATALYST - Provided is a method of preparation of dialkoxy magnesium that is used as a support for an olefin polymerization catalyst for polyolefin preparation. Specifically, provided is a method of preparation of a support for an olefin polymerization catalyst, which comprises preparation of dialkoxy magnesium by reacting magnesium metal with alcohol in the presence of a reaction initiator, wherein bromine is used as the reaction initiator so as to obtain spherical dialkoxy magnesium. | 07-08-2010 |
Hwan Kyu Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110152475 | ETHYLENE ALPHA OLEFIN POLYMER FORMED BY USE OF METALLOCENE CATALYST - There is provided a method for producing copolymer that is composed of ethylene and alpha-olefin by a solution polymerization, and more specifically, a method for producing copolymer that is composed of ethylene and aromatic monomer as main components by using a transition metal catalyst including a cyclopentadiene derivative, and one or more anionic ligand having aryloxy group in which an aryl derivative is substituted at an ortho-position | 06-23-2011 |
Hyuk Jin Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110210368 | MICRO-COMPOSITE PATTERN LENS, AND METHOD FOR MANUFACTURING SAME - The present invention relates to a micro-composite pattern lens and to a method for manufacturing same. The micro-composite pattern lens of the present invention has a micro-composite pattern with one or more protrusions formed on one side of the lens having a predetermined curvature, and optical polymer nanoparticles arranged in the lens. The micro-composite pattern of the lens may form a wider angle of light emission, thus enabling an LED source, which is a point light source, to be converted into a surface light source having superior luminous intensity uniformity. The lens of the present invention is advantageous in that a single lens may serve as a light guide plate, a prism plate, and a diffusion plate, this eliminating the necessity of stacking optical plates, which might otherwise be required for conventional backlight units. According to the present invention, the angle of emission of the LED source which is approximately 90 degrees can be widened to 160 degrees or higher, and the local change in the micro-pattern and the mixture of ultrafine particles may improve the luminous intensity uniformity and the angle of emission of the light source. Also, wafer levels can be manufactured using a microfluidic channel array based on three dimensional molding techniques and the mixture of ultrafine particles. In addition, the use of single lens having a wider angle of light emission reduces the number of LEDs, thus reducing manufacturing costs and heat generated by LEDs. Further, the micro-composite pattern lens of the present invention has a double curvature structure to achieve improved luminous intensity uniformity and an improved angle of light emission as compared to a single curvature structure. | 09-01-2011 |
Inhwa Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090075049 | Microporous polyethylene film with good property of strength and permeability at high temperature - The present invention relates to a microporous polyethylene film for use as battery separator. The microporous polyethylene film according to the present invention is characterized by having a film thickness of 5-40 μm, a porosity of 35-55%, a permeability from 2.5×10 | 03-19-2009 |
| 20090148685 | Microporous polyolefin film possessing good mechanical properties and thermal stability - The present invention relates to a microporous polyolefin film suitable as a separator for batteries and thermal properties thereof. A microporous polyolefin film according to the present invention has a film thickness of 5-40 μm, a porosity of 30%-60%, a permeability of 2.0×10 | 06-11-2009 |
| 20090169862 | Microporous polyolefin multi layer film and preparing method thereof - The present invention relates to a multi-layered microporous polyolefin film for a battery separator and a method for preparing the same. The microporous multi-layered film of the present invention has a characteristics to have both the low shutdown temperature conferred by the polyethylene and the high melt fracture temperature conferred by the polypropylene and heat-resistant filler. In addition, it has the high strength and stability conferred by the micropores prepared under wet process and the high permeability and high strength conferred by the macropores prepared under dry process. Therefore, this multi-layered film can be used effectively to manufacture a secondary battery with high capacity and high power. | 07-02-2009 |
| 20110064929 | MICROPOROUS POLYOLEFIN FILM WITH THERMALLY STABLE POROUS LAYER AT HIGH TEMPERATURE - Provided is a microporous film for a secondary battery, and more particularly, to a microporous film for a secondary battery with excellent quality stability and heat resistance, the microporous film comprising a 3 layer microporous film wherein: an inner layer that includes polypropylene of 20-80 wt % having a melting temperature of 150° C. or higher and a filler of 80-20 wt % having a melting temperature of 140° C. or higher, wherein a gross content of the filler and polypropylene in the inner layer is 60 wt % or more, and both surface layers which include polyethylene, wherein at least one layer of the both surface layers includes polyethylene of 70 wt % or more. | 03-17-2011 |
In Hwa Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100041779 | Preparing Method of Microporous Polyolefin Film Through Effective Extrusion - The present invention relates to a process for manufacturing a microporous polyolefin film which can be used for various battery separators, separating filters and membranes for microfiltration. The process for manufacturing a microporous polyolefin film according to the invention comprises mixing/extrusion through efficient and separate injection of 15-55% by weight of polyolefin (Component I), and 85-45% by weight of a diluent (Component II) which forms thermodynamic single phase with the polyolefin and a diluent (Component III) which can undergo thermodynamic liquid-liquid phase separation with the polyolefin, into an extruder. | 02-18-2010 |
| 20110104468 | MICROPOROUS POLYOLEFIN MULTI LAYER FILM AND PREPARING METHOD THEREOF - Disclosed is a microporous polyolefin multilayer film which can be used as a separator for a battery, and a preparing method thereof. The microporous polyolefin multilayer film is a trilayer microporous film which is prepared by a wetting method to have both surface layers containing polyethylene of 95 wt % or more having a melting temperature of 125° C. or more, and an intermediate layer containing polypropylene of 50 to 90 wt % having a melting temperature of 160° C. or more and polyethylene of 10 to 50 wt % having a melting temperature of 125° C. or more, wherein a thickness of the film is 9-50 μm, a puncture strength is 0.15 N/μm or more, a permeability is 1.5×10 | 05-05-2011 |
Jin-Sung Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20080225598 | Flash memory and method for checking status register by block unit - Provided is a test method of a NAND flash memory. The method includes programming a page of a selected memory block in the flash memory; accumulating a program result of the page; and repeating the programming of other pages and the accumulating of the program result of the other pages until all pages in the selected memory block are programmed. | 09-18-2008 |
Jin-Young Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20080201519 | MEMORY CARD - A memory card is structured to support a variety of applications by dividing a storage region into a plurality of sub storage regions, each sub storage region being assigned a particular data format associated with each of a plurality of application programs stored in a controller of the memory card. The data stored in each of the sub storage regions co-exists compatibly in the memory card. This allows for a multiplicity of applications, which can be made available through the use of a single memory card. | 08-21-2008 |
Ji-Yoon Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100103362 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes a first substrate and a second substrate. The first substrate includes a sealant which is formed on a peripheral area surrounding a display area including a plurality of pixel portions. The sealant includes a photocuring material hardened by multiphoton absorption and a thermosetting material hardened by heat. The second substrate faces the first substrate and is combined with the first substrate by the sealant. Thus, the reliability of manufacturing the display device, the display quality, and the productivity may be improved. | 04-29-2010 |
Kyeong Taek Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100272973 | FLEXIBLE SUBSTRATE FOR DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A flexible substrate for a display panel and a manufacturing method thereof is disclosed. The flexible substrate may include a first film having a glass cloth located within a first heat-resistant resin, and a second film laminated on at least one side of the first film. The second film may include a second heat-resistant resin. The flexible substrate may further include an intermediate material between the first film and the second film. The intermediate material may be applied to an outer part of the first film and may adhere the first film to the second film. | 10-28-2010 |
Kyu-Chea Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090169069 | Apparatus for Inputting Optical Data Using Optical Fiber - Disclosed herein is an apparatus for inputting optical data. The optical data input apparatus includes an image sensor, a bundle of optical fibers, and a light emission device. One end surface of the bundle of optical fibers is arranged close to the image sensor, and the other end surface of the bundle of optical fibers is arranged close to an image acquisition surface. The light emission device radiates light onto the image acquisition surface. The end surface (light receiving surface) of the bundle of optical fibers, which is arranged close to the image acquisition surface, is spaced apart from the image acquisition surface. Optical signals radiated by the light emission device are radiated to a space between the image acquisition surface and the light receiving surface, are reflected or scattered on the image acquisition surface, and are received by the bundle of optical fibers. | 07-02-2009 |
Sang Cheol Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100073794 | OPTICAL FILTER FOR COMPENSATING FOR COLOR SHIFT AND DISPLAY DEVICE HAVING THE SAME - An optical filter for compensating for color shift is provided in front of a display panel of a display device. The optical filter includes a background layer and a green wavelength absorption pattern provided with a predetermined thickness on the background layer. The green wavelength absorption pattern absorbs a green wavelength of light. The green wavelength absorption pattern contains a material that absorbs a green wavelength of light in the range of 510 nm to 560 nm, and can also contain a white light absorbing material. A green's complementary color absorbing part absorbs a wavelength of light complementary to green, and contains at least one of a material absorbing a blue wavelength of light in the range of 440 nm to 480 nm and a material absorbing a red wavelength of light in the range of 600 nm to 650 nm. A first thick-film layer, a first thin-film layer, and a second thick-film layer are stacked over one another in the order named. | 03-25-2010 |
| 20110001095 | ZINC OXIDE-BASED CONDUCTOR - A zinc oxide-based conductor includes ZnO co-doped with gallium and manganese. Preferably, the doping concentration of the gallium ranges from 0.01 at % to 10 at % and the doping concentration of the manganese ranges from 0.01 at % to 5 at %. More preferably, the doping concentration of the gallium ranges from 2 at % to 8 at % and the doping concentration of the manganese ranges from 0.1 at % to 2 at %. Still more preferably, the doping concentration of the gallium ranges from 4 at % to 6 at % and the doping concentration of the manganese ranges from 0.2 at % to 1.5 at %. The zinc oxide-based conductor is a transparent conductor that is used as an electrode of a solar cell or a liquid crystal display. | 01-06-2011 |
| 20110102722 | INDIUM TIN OXIDE SPUTTERING TARGET AND TRANSPARENT CONDUCTIVE FILM FABRICATED USING THE SAME - An indium tin oxide sputtering target includes indium oxide, tin oxide, and gallium. The content of tin atoms is 5 to 15 atomic percent of the total amount of indium and tin atoms, and the content of gallium atoms is 0.5 to 7 atomic percent of the total amount of indium, tin, and gallium atoms. A method of fabricating an indium tin oxide transparent conductive film includes depositing the transparent conductive film by sputtering the sputtering target. The indium tin oxide transparent conductive film having high durability can be fabricated by depositing an amorphous transparent conductive film by sputtering the sputtering target at a first temperature, patterning the deposited amorphous transparent conductive film by etching it using a weak acid, and crystallizing the patterned amorphous transparent conductive film at a second temperature higher than the first temperature. A crystallization temperature ranges from 150° C. to 210° C., or from 170° C. to 210° C. | 05-05-2011 |
| 20110168254 | Electrode Plate And Dye-Sensitized Photovoltaic Cell Having The Same - An electrode plate for a dye-sensitized photovoltaic cell includes a transparent substrate and a transparent conductive film. The transparent conductive film includes a zinc oxide thin film layer formed over the transparent substrate, the zinc oxide thin film layer being doped with gallium, and a tin oxide thin film layer formed over the zinc oxide thin film layer, the tin oxide thin film layer being doped with a dopant. | 07-14-2011 |
Sung-Do Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090291390 | Acid generating agent for chemically amplified resist compositions - An acid generating agent represented by the following formula (1) or (2) is provided, which is included in chemically amplified resist compositions: | 11-26-2009 |
Yong-Jin Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090126979 | SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME - A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are marked in correspondence to locations of identified defective circuit board units of the circuit board units. An operator can readily put a defective mark on the indicator without any confusion. The operator or a sensor can readily recognize the defective mark. Since the indicator can be formed on the circuit board unit, the integration of the semiconductor package circuit board can be increased, and the productivity can be substantially improved. Furthermore, a pathway of the sensor can be reduced, and interferences that might occur if the sensor moves can be hindered. | 05-21-2009 |
Young-Seok Jung, Chungcheongnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090028671 | IN-LINE SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE - An in-line system for manufacturing a semiconductor package according to principles of the present invention can prevent wafer warpage due to a back-lap process and die defects due to sticking of the die. In one embodiment, the in-line system adheres a semiconductor chip to a substrate by coating a liquid adhesive agent on a rear surface of the wafer. The processes of the in-line system are preferably performed in series. More particularly, the in-line system for manufacturing a semiconductor package can include a loading unit for loading a wafer into the system. A back-lap unit can include a grinder configured to back-grind a rear surface of the wafer received from the loading unit. A cleansing unit preferably comprises an air pressure plasma generating unit for cleansing the wafer using air pressure plasma. A coating unit can be configured to form an adhesive layer on a rear surface of the cleansed wafer by using a nozzle to coat a liquid adhesive agent onto the wafer. In the coating unit, the wafer can be rotated or not rotated depending on the desired characteristics of the adhesive layer. An attaching unit is preferably provided to attach a dicing tape on the adhesive layer formed. And an unloading unit unloads the wafer from the system. A transporting unit can be configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit. One or more wafer chucks can be mounted to the wafer as the wafer is transported through the manufacturing processes. | 01-29-2009 |