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Jung-Chih

Jung-Chih Hu, Yangmei TW

Patent application numberDescriptionPublished
20100009518Particle Free Wafer Separation - A method for singulating semiconductor wafers is disclosed. A preferred embodiment comprises forming scrub lines on one side of the wafer and filling the scrub lines with a temporary fill material. The wafer is then thinned by removing material from the opposite side of the wafer from the scrub lines, thereby exposing the temporary fill material on the opposite side. The temporary fill material is then removed, and the individual die are removed from the wafer.01-14-2010

Jung-Chih Kuo, Taoyuan TW

Patent application numberDescriptionPublished
20090040536MARK FOR ALIGNMENT AND OVERLAY, MASK HAVING THE SAME, AND METHOD OF USING THE SAME - A mark for alignment and overlay, a mask having the same, and a method of using the same are provided. The mark includes a first mark pattern and a second mark pattern. The first mark pattern includes a first pattern and a second pattern, and the second mark pattern includes a third pattern and a fourth pattern. The first pattern includes a plurality of rectangular regions arranged in a first direction, and for each rectangular region, a sideline in a second direction is longer than a sideline in the first direction, wherein the first direction is perpendicular to the second direction. The second pattern is disposed on both sides of the first pattern in the second direction and includes a plurality of rectangular regions arranged in the second direction, and for each rectangular region, the sideline in the first direction is longer than a sideline in the second direction. The third pattern includes two rectangular regions disposed on both sides of the first pattern in the first direction, and the fourth pattern includes two rectangular regions disposed on both sides of the second pattern in the second direction.02-12-2009

Jung-Chih Su, Kaohsiung County TW

Patent application numberDescriptionPublished
20090096778METHOD AND APPARATUS OF DETECTING IMAGE-STICKING OF DISPLAY DEVICE - A method of measuring image-sticking of a display device based on a vision model is described. A display device is provided, and a test frame is displayed on the display device. The test frame has a pattern formed by a maximum gray level and a minimum gray level. After burning-in the test frame for a period of time, a gray frame at a medium gray level is displayed on the display device. The test frame, including portions of extreme black and extreme white, leaves image-sticking on the gray pattern at a medium gray level at the same time. Next, an image capture device is used to capture the image-sticking on the display device after burn-in. Finally, a vision model is employed to simulate the human visual perception on the image-sticking and to grade the image-sticking according to the human eye sensitivity for viewing the image-sticking on the display device.04-16-2009