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Jung, Cheonan-Si
Boo Sup Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090086825 | METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING BROADCAST DATA FOR DIGITAL BROADCAST SYSTEM - A method and apparatus for transmitting and receiving broadcast data in a digital broadcast system is provided. The method includes broadcasting, at a broadcast station, a broadcast signal on a corresponding service channel according to a time slicing technique using at least two streams, receiving, at a broadcast receiver, the broadcast signal from the corresponding service channel according to the time slicing technique from the at least two streams, determining a channel status based on the received broadcast signal, and demodulating the broadcast signal received on at least one of the at least two streams according to the channel status. | 04-02-2009 |
| 20090153746 | DEVICE AND METHOD FOR SAVING POWER IN DIGITAL BROADCASTING RECEIVER - A device and a method are provided for saving electric power consumed in a digital broadcasting receiver. The device and method includes acquiring information regarding a transmission order of all service channels, calculating a delay relationship between an arbitrarily played service channel and a service channel for switching, and enabling a broadcast receiving unit when the service channel for switching is received. | 06-18-2009 |
Dong-Goon Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110042983 | NOZZLE FOR HOLDING A SUBSTRATE AND APPARATUS FOR TRANSFERRING A SUBSTRATE INCLUDING THE SAME - A nozzle for holding a substrate may include a nozzle head and a nozzle body. The nozzle head may provide the substrate with compressed air. The nozzle body may be connected to the nozzle head. The nozzle body may be arranged facing the semiconductor substrate. The nozzle body may have a substantially flat supporting surface which provides a uniform gap between the substrate and the nozzle body. The nozzle body may have a first passageway which allows the compressed air to pass through toward the substrate to form a vacuum between the substantially flat supporting surface and the substrate. | 02-24-2011 |
Dong Rak Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090156015 | DEPOSITION APPARATUS - A deposition apparatus configured to form a thin film on a substrate includes: a reactor wall; a substrate support positioned under the reactor wall; and a showerhead plate positioned above the substrate support. The showerhead plate defines a reaction space together with the substrate support. The apparatus also includes one or more gas conduits configured to open to a periphery of the reaction space at least while an inert gas is supplied therethrough. The one or more gas conduits are configured to supply the inert gas inwardly toward the periphery of the substrate support around the reaction space. This configuration prevents reactant gases from flowing between a substrate and the substrate support during a deposition process, thereby preventing deposition of an undesired thin film and impurity particles on the back side of the substrate. | 06-18-2009 |
| 20090163024 | METHODS OF DEPOSITING A RUTHENIUM FILM - A method of depositing includes: loading a substrate into a reactor; and conducting a plurality of atomic layer deposition cycles on the substrate in the reactor. At least one of the cycles includes steps of: supplying a ruthenium precursor to the reactor; supplying a purge gas to the reactor; and supplying non-plasma ammonia gas to the reactor after supplying the ruthenium precursor. The method allows formation of a ruthenium layer having an excellent step-coverage at a relatively low deposition temperature at a relatively high deposition rate. In situ isothermal deposition of barrier materials, such as TaN at 200-300° C., is also facilitated. | 06-25-2009 |
| 20090217871 | THIN FILM DEPOSITION APPARATUS AND METHOD OF MAINTAINING THE SAME - A thin film deposition apparatus and a method of maintaining the same are disclosed. In one embodiment, a thin film deposition apparatus includes: a chamber including a removable chamber cover; one or more reactors housed in the chamber; a chamber cover lifting device connected to the chamber cover. The chamber cover lifting device is configured to move the chamber cover vertically between a lower position and an upper position. The apparatus further includes a level sensing device configured to detect whether the chamber cover is level, and a level maintaining device configured to adjust the chamber cover if the chamber cover is not level. This configuration maintains the chamber cover to be level as a condition for further vertical movement of the chamber cover. | 09-03-2009 |
| 20110020545 | LATERAL-FLOW DEPOSITION APPARATUS AND METHOD OF DEPOSITING FILM BY USING THE APPARATUS - A deposition apparatus according to an exemplary embodiment of the present invention is a lateral-flow deposition apparatus in which in which a process gas flows between a surface where a substrate is disposed and the opposite surface, substantially in parallel with the substrate. The lateral-flow deposition apparatus includes: a substrate support that moves up/down and rotates the substrate while supporting the substrate; a reactor cover that defines a reaction chamber by contacting the substrate support; and a substrate support lifter and a substrate support rotator that move the substrate support. | 01-27-2011 |
Dong Sik Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080233217 | COMPOSITION COMPRISING NOTOGINSENG RADIX EXTRACT FOR PREVENTING AND TREATING OF ARTHRITIS AS AN EFFECTIVE INGREDIENT - The present invention relates to a composition comprising Notoginseng radix extract for preventing and treating arthritis as an effective ingredient. | 09-25-2008 |
Hee-Joon Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110051254 | LIQUID LENS - A variable-focus liquid lens is provided. The liquid lens includes a membrane and a fluid. The membrane is made of a transparent elastomer, and the fluid fills a predetermined space to contact at least a lens surface of the membrane. The membrane and the fluid are respectively made of materials repulsive to each other, for example, hydrophilic and hydrophobic materials or oleophilic and oleophobic materials. Accordingly, a repulsive force between the fluid and the membrane can prevent the absorption or leaking of the fluid into/through the membrane. | 03-03-2011 |
Hyung-Gi Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100225621 | GATE-DRIVING APPARATUS AND DISPLAY DEVICE INCLUDING THE SAME - A gate driving apparatus includes a first stage which outputs a first gate output signal, and a second stage which outputs a second gate output signal. The first stage includes: a transistor which includes a gate electrode, a source electrode and a drain electrode; and a dummy transistor which includes a dummy gate electrode, a dummy source electrode and a dummy drain electrode. The gate electrode receives the second gate output signal, and the dummy source electrode is connected to the source electrode or the drain electrode of the transistor and prevents static electricity from flowing to the first stage. | 09-09-2010 |
Jin-Kwan Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100184582 | MIXED POWDER AND SINTERED BODY, MIXED CERMET POWDER AND CERMET, AND FABRICATION METHODS THEREOF - A mixed powder and a sintered body obtained by sintering the mixed powder. The mixed powder includes a solid-solution powder with complete solid-solution phase. The solid-solution powder includes a carbide or a carbonitride of at least two metals selected, including Ti, from metals of Groups IVa, Va and VIa of the periodic table, or a mixture thereof. A mixed cermet powder and a cermet obtained by sintering the mixed cermet powder are also disclosed. The mixed cermet powder includes at least a cermet powder with complete solid-solution phase. The cermet powder includes a carbide or a carbonitride of at least two metals selected, including Ti, from metals of Groups IVa, Va and VIa of the periodic table, or a mixture thereof, and at least one metal selected from the group consisting of Ni, Co and Fe. Also disclosed are a sintered body and a fabrication method of a cermet. | 07-22-2010 |
Ji-Yoon Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090027609 | SUBSTRATE FOR DISPLAY PANEL AND LIQUID CRYSTAL DISPLAY PANEL WITH THE SAME - A liquid crystal display that includes a first substrate having a thin film transistor, a common electrode, and a pixel electrode, and a second substrate is presented. The second substrate has one side with a transparent conductive layer and an insulating layer covering the transparent conductive layer, and the other side facing the first substrate. A liquid crystal layer is between the first substrate and the second substrate. Static electricity generation can be prevented by forming the transparent conductive layer on a substrate where the common electrode and the pixel electrode are not formed. Also, the transparent conductive layer is protected from damage by forming the insulating layer on the transparent conductive layer. | 01-29-2009 |
| 20090109384 | ARRAY SUBSTRATE AND DISPLAY PANEL HAVING THE SAME - An array substrate includes: a gate line, a data line crossing disposed substantially perpendicular to the gate line, a first switching element being electrically connected to the gate line and the data line, a pixel electrode being electrically connected to the first switching element to be formed in a pixel area, the pixel electrode having including an opening pattern, and a light-blocking wiring formed disposed in correspondence with the opening pattern is formed, the light-blocking wiring including a convex-concave pattern. | 04-30-2009 |
| 20090168005 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an embodiment includes a first substrate, a pixel electrode, which is formed on the first substrate comprises a first domain dividing means, a first sub pixel electrode and a second sub pixel electrode which are distanced from each other to have a predetermined interval, a second substrate which is disposed to face the first substrate, a second domain dividing means which is formed on the second substrate; and a liquid crystal layer which is interposed between the first substrate and the second substrate, wherein a plurality of sub areas are defined by the first and second domain dividing means, and a width of a sub area of the first sub pixel electrode and a width of a sub area of the second sub pixel electrode are different. | 07-02-2009 |
| 20090185120 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A thin-film transistor (“TFT”) substrate includes; a substrate including both a light-transmitting region and a light-blocking region, a solar cell pattern disposed on the light-blocking region of the substrate, and comprising at least one solar cell, an insulation layer disposed on the solar cell pattern, and a TFT disposed on the insulation layer. | 07-23-2009 |
| 20100328598 | SEALANT, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - A sealant for a display device includes a photoinitiator having an oxime ester compound or a 2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide compound, and a curing resin. The sealant may further include a curing agent, a coupling agent, and a filler. A display device includes a first substrate having a display area, a second substrate opposite to the first substrate, a liquid crystal layer interposed between the first substrate and the second substrate, and a sealing pattern contacting the first substrate and the second substrate so as substrate to combine the first substrate and the second substrate with each other. The sealing pattern may include a photoinitiator having an oxime ester compound or a 2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide compound. In a method of manufacturing the display device, a sealant including a photoinitiator having an oxime ester compound or a 2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide compound, and a curing resin is coated along a peripheral portion of the first substrate to form a sealing pattern. A liquid crystal is dropped on the first substrate. The second substrate opposite to the first substrate is disposed on the first substrate. The sealing pattern is cured to combine the first substrate and the second substrate with each other. | 12-30-2010 |
Ky-Hyun Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090200362 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE - In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package. | 08-13-2009 |
| 20090278249 | Printed circuit board and method thereof and a solder ball land and method thereof - A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance. | 11-12-2009 |
| 20110136334 | METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE - A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad. | 06-09-2011 |
Nak-Do Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090252591 | IN-LINE APPARATUS - An in-line apparatus includes a loader chamber loading and unloading a substrate, a plurality of process chambers coupled in series to the loader chamber, and respectively and sequentially performing predetermined processes for the substrate, and at least one buffer chamber disposed in parallel to the process chambers, wherein the buffer chamber replaces at least one process chamber to transfer the substrate therethrough. | 10-08-2009 |
Yong-Jin Jung, Cheonan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090166879 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip, a package substrate, a first attaching member, a second attaching member, a connecting member and a molding member. The package substrate has a central region and an edge region. The first attaching member attaches the semiconductor chip to the central region of the package substrate. The second attaching member is arranged in the edge region of the package substrate. The second attaching member includes first attaching patterns extending in a first direction, and second attaching patterns extending in a second direction. The connecting member electrically connects the semiconductor chip to the package substrate. The molding member is attached to the package substrate using the second attaching member to molding the semiconductor chip. | 07-02-2009 |
| 20100052130 | SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME - Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire. | 03-04-2010 |
| 20100164101 | Ball land structure having barrier pattern - Disclosed is a ball land structure suitable for use with a semiconductor package. The ball land structure includes a ball land and a barrier on a core. The barrier may be configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier thus exposing a portion of the core. A solder mask may be deposited on the ball land and a portion of the core exposed by the barrier hole so as to partially expose the core. | 07-01-2010 |