| Patent application number | Description | Published |
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| 20090208164 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board. | 08-20-2009 |
| 20090304324 | Optical waveguide and optical printed circuit board having the same - An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core. | 12-10-2009 |
| 20110007999 | Printed circuit board - A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide. | 01-13-2011 |
| 20110019959 | Printed circuit board for optical waveguides and method of manufacturing the same - The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides. | 01-27-2011 |
| 20110103737 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer. | 05-05-2011 |
| 20110103738 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a first through-hole formed therein and the first through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer has a second through-hole formed therein and the second through-hole corresponds to the first through-hole, and forming a second clad layer by filling a second clad substance in the second through-hole, in which the second clad layer covers the core unit. | 05-05-2011 |
| 20110116736 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer. | 05-19-2011 |
| 20110116737 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin. | 05-19-2011 |
| 20110168666 | MANUFACTURING METHOD FOR OPTICAL WAVEGUIDE - A method of manufacturing an optical waveguide is disclosed. The method in accordance with an embodiment of the present invention includes providing a carrier, fixing a base substrate to the carrier by using a first insulation layer such that the base substrate is directly stacked on the carrier, stacking an optical waveguide layer on at least one of the base substrate and the first insulation layer, and severing the base substrate such that the base substrate and the optical waveguide layer are separated from the carrier. Accordingly, the optical waveguide layer can be formed with a uniform thickness since wrinkles in the base substrate supporting the optical waveguide layer are prevented from forming during the manufacturing process. | 07-14-2011 |
| 20110317957 | Optical flexible printed circuit board with optical waveguides and method manufacturing the same - The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer. | 12-29-2011 |
| 20120005890 | Method of manufacturing printed circuit board for optical waveguides - A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed. | 01-12-2012 |
| Patent application number | Description | Published |
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| 20090243457 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 10-01-2009 |
| 20100025700 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 02-04-2010 |
| 20100219428 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generate a base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light and the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 09-02-2010 |
| 20100330714 | MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 12-30-2010 |
| 20110284822 | LIGHT EMITTING DIODE CHIP HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME - An exemplary embodiment of the present invention discloses an LED chip including a substrate, a GaN-based compound semiconductor stacked structure arranged on the substrate, an electrode electrically connected to the semiconductor stacked structure, and a wavelength converting layer covering a portion of the semiconductor stacked structure. The electrode passes through the wavelength converting layer. The semiconductor stacked structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. | 11-24-2011 |
| 20120007502 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 01-12-2012 |
