Patent application number | Description | Published |
20080214084 | FLAT FLUORESCENT LAMP AND METHOD OF MANUFACTURING THE SAME - The present invention provides a flat fluorescent lamp. The flat fluorescent lamp comprises a single plate. Consequently, the flat fluorescent lamp is structurally safe, brightness of the flat fluorescent lamp is high, and efficiency of the flat fluorescent lamp is also high without the provision of other additional optical components. The present invention also provides a method of manufacturing such a flat fluorescent lamp. | 09-04-2008 |
20080214085 | FLAT FLUORESCENT LAMP AND METHOD OF MANUFACTURING THE SAME - The present invention provides a flat fluorescent lamp. The flat fluorescent lamp comprises a single plate. Consequently, the flat fluorescent lamp is structurally safe, brightness of the flat fluorescent lamp is high, and efficiency of the flat fluorescent lamp is also high without the provision of other additional optical components. The present invention also provides a method of manufacturing such a flat fluorescent lamp. | 09-04-2008 |
20080292431 | TRANSFER CHAMBER FOR FLAT DISPLAY DEVICE MANUFACTURING APPARATUS - The present invention relates to a transfer chamber for a flat display device manufacturing apparatus, and more particularly, to a transfer chamber for a flat display device manufacturing apparatus, having a combination of functions of transfer and load-lock chambers, in which a robot is provided aside from a center of the transfer chamber, a buffer is provided to be driven without interference of the robot, and a aligner is provided to adjust a position of a substrate mounted on the buffer. In order to achieve the aforementioned objects, there is provided a transfer chamber for a flat display device manufacturing apparatus, wherein a robot is provided aside from a center of the transfer chamber. In addition, in order to drive the robot, a sealing member is provided to seal a hole formed at a predetermined portion of the transfer chamber, and an aligner for adjusting the substrate in the transfer chamber and a buffer where the substrate is mounted on are provided. | 11-27-2008 |
20090025877 | FLAT PANEL DISPLAY MANUFACTURING APPARATUS - Disclosed herein is a flat panel display manufacturing apparatus in a predetermined process is performed using plasma generated therein. In such a flat panel display manufacturing apparatus, a process gas is supplied into a chamber in an evenly diffused state to generate even plasma inside a symmetrical interior space of the chamber. Consequently, the flat panel display manufacturing apparatus can appropriately control flow rate of the plasma, thereby being capable of performing even processing on a large-scale substrate. In the flat panel display manufacturing apparatus, a substrate pedestal thereof is provided with a combination of vertical and horizontal shielding members, thereby being entirely protected from attack of the plasma, resulting in an increased life-span. | 01-29-2009 |
20090078200 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - Disclosed herein is a flat panel display (FPD) manufacturing apparatus for performing a desired process for a substrate positioned in a chamber after establishing a vacuum atmosphere in the chamber. The vacuum chamber is divided into a chamber body and an upper cover to ensure easy opening/closing operations of the upper cover. | 03-26-2009 |
20090078373 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - Disclosed herein is a flat panel display (FPD) manufacturing apparatus for performing a desired process for a substrate positioned in a chamber after establishing a vacuum atmosphere in the chamber. The vacuum chamber is divided into a chamber body and an upper cover to ensure easy opening/closing operations of the upper cover. | 03-26-2009 |
20090084316 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - Disclosed herein is a flat panel display (FPD) manufacturing apparatus for performing a desired process for a substrate positioned in a chamber after establishing a vacuum atmosphere in the chamber. The vacuum chamber is divided into a chamber body and an upper cover to ensure easy opening/closing operations of the upper cover. | 04-02-2009 |
20090133837 | APPARATUS FOR MANUFACTURING FLAT-PANEL DISPLAY - An flat-panel display (FPD) manufacturing apparatus is provided. The apparatus is flexibly configured so that it is capable of easily processing large-size substrates while also simplifying manufacturing, transporting, operating, and repair processes. | 05-28-2009 |
20100086381 | VACUUM PROCESSING APPARATUS - Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body. | 04-08-2010 |
20100086382 | VACUUM PROCESSING APPARATUS - Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body. | 04-08-2010 |
20100086383 | VACUUM PROCESSING APPARATUS - Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body. | 04-08-2010 |
20100089531 | VACUUM PROCESSING APPARATUS - Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body. | 04-15-2010 |
20100120696 | Peptides Having Activities of Epidermal Growth Factor and Its Uses - The present invention relates to peptides comprising the amino acid sequence represented by the following formula 1 and having the activities of epidermal growth factor and their uses: Cys-Met-Tyr-Ile-Glu-Linker-Arg-Gly-Asp (1) The EGF-mimicking peptides of the present invention possess identical functions or activities to natural-occurring human EGF and are able to promote the generation of autocrine EGF in cells. In addition the peptides of the present invention are much higher stability and skin penetration potency than natural-occurring EGF. Therefore, the composition containing the peptide exhibits excellent treatment and prevention efficacies on diseases or conditions demanding EGF activities, and can be advantageously applied to pharmaceutical compositions, quasi-drugs and cosmetics. | 05-13-2010 |
20110180937 | STACKED PACKAGE OF SEMICONDUCTOR DEVICE - Provided is a stacked package of a semiconductor device and a method of manufacturing the same. The stacked package of a semiconductor device may include at least one first semiconductor chip, at least one second semiconductor chip, at least one interposer between the at least one first semiconductor chip and the at least one second semiconductor chip, and a third semiconductor chip on the at least one first semiconductor chip. The at least one first semiconductor chip and the at least one second semiconductor chip may be configured to perform a first function and a second function and each may include a plurality of bonding pads. The third semiconductor chip may be configured to perform a third function which is different from the first and the second functions. The package may further include external connection leads may be configured to electrically connect the third semiconductor chip to the outside. | 07-28-2011 |
20120139109 | PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE CONFIGURED TO IMPROVE SOLDER JOINT RELIABILITY AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A a printed circuit board (PCB) for a semiconductor package and a semiconductor package having the same, which may improve adhesion of a PCB with an encapsulant. The semiconductor package includes a PCB for a semiconductor package including a resin through hole disposed in a central portion thereof and at least one resin fixing hole disposed in an outermost edge thereof, a semiconductor chip connected to first connection pads disposed on a first surface of the PCB by bumps, an upper encapsulant configured to hermetically seal the first surface of the PCB and the semiconductor chip, and a lower encapsulant protrusion configured to extend to a second surface of the PCB through the resin through hole and the resin fixing hole disposed in the first surface of the PCB. | 06-07-2012 |