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Jun Young

Jun Young Choi, Siheung-Si KR

Patent application numberDescriptionPublished
20110061729Solar Cell and Method of Manufacturing the Same - Provided are a solar cell and a method of manufacturing the same. The method includes implanting impurities of a second conductivity type opposite to a first conductivity type on the entire surface of a semiconductor substrate of the first conductivity type to form an emitter layer, forming a first anti-reflective coating (ARC) layer on the emitter layer, patterning a portion of the first anti-reflective coating (ARC) layer where a front electrode will be formed, forming a second anti-reflective coating (ARC) layer on the first anti-reflective coating (ARC) layer and the emitter layer, and forming the front electrode and a rear electrode on front and rear surfaces of the semiconductor substrate. In this method, a double structure of two anti-reflective coating (ARC) layers with different thicknesses may be formed to make electrode patterns distinct, thereby facilitating alignment of electrodes.03-17-2011
20110277824Solar Cell and Method of Manufacturing the Same - Provided are a solar cell and a method of manufacturing the same. The method includes implanting impurities of a second conductivity type opposite to a first conductivity type into a front surface of a semiconductor substrate of the first conductivity type to form an emitter layer, forming a mask layer on the emitter layer, patterning the mask layer by coating etching paste on a portion of the mask layer where a front electrode will be formed, implanting high-concentration impurities into the portion of the mask layer where the front electrode will be formed to form a heavily doped region, removing the remaining mask layer, forming an anti-reflective coating (ARC) on the emitter layer, forming the front electrode on the front surface of the semiconductor substrate, and forming a rear electrode on a rear surface of the semiconductor substrate. In the method of manufacturing the solar cell, the patterning of the front surface of the semiconductor substrate includes directly coating a corrosive emulsion on the mask layer using a screen printing process instead of complicated photolithography and etching processes so that a desired pattern can be formed using a relatively simple process.11-17-2011
20120090682Solar Cell and Manufacturing Method Thereof - A solar cell and a manufacturing method thereof are provided. The method includes forming a microstructure including a texturing on the surface of a semiconductor substrate of a first conductive type, forming a plurality of nanostructures on the surface of the semiconductor substrate, forming an emitter layer by implanting impurities of a second conductive type opposite to the first conductive type in a front face of the semiconductor substrate, forming an anti-reflective coating (ARC) on the emitter layer, forming a front electrode passing through a portion of the ARC and being coupled to the emitter layer, and forming a back electrode on a rear face of the semiconductor substrate of the first conductive type, the rear face being opposite to the face on which the front electrode is formed. A dominant light-collecting characteristic can be approached by forming nanostructures on a semiconductor substrate of a solar cell.04-19-2012

Jun Young Choi, Suwon-Si KR

Patent application numberDescriptionPublished
20120105916PRINTING CONTROL APPARATUS AND METHOD WITH DOCUMENT SECURITY FUNCTION - A printing control apparatus includes a user interface driver to provide a security preview setup screen such that security preview options for each object are selected when a call signal is transmitted from a graphic device interface according to a print request signal input from an application program and a previewer to divide objects through the security preview setup screen and to secure a corresponding one of the objects when the security preview options are set so as to perform preview. A preview screen upon which security options for each object are set is displayed, thereby preventing malicious use and easily achieving security intended by a user.05-03-2012

Jun Young Choi, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20100160238TGFP-CAP Peptide and its Uses - The present invention relates to a GFP-CAP peptide having an amino acid sequence derived from TGF-β1 (transforming growth factor-β1) and a cell adhesion sequence, wherein the amino acid sequence derived from TGF-β1 consists of the amino acid sequence of SEQ ID NO:1 and the TGFP-CAP peptide is represented by the following formula I: Ile-Trp-Ser-Leu-Asp-Thr-Gln-Tyr-Cell adhesion sequence (I). The TGFP-CAP peptide of the present invention exhibits excellent anti-angiogenic activity. In addition, the TGFP-CAP peptide of the present invention prevents effectively melanin generation in skin to have skin whitening effects. The present peptide shows much higher stability and permeability to skin than natural-occurring TGF-β1. Such plausible activities and safety of the present peptide enable advantageously to application to drugs, quasi-drugs and cosmetics.06-24-2010
20110160131Growth Factor-Mimicking Peptides and Uses Thereof - The present invention relates to a growth factor-mimicking peptide having an activity of the growth factor, and a composition and a method for improving skin conditions or for treating a wound using the same. The growth factor-mimicking peptides of this invention have identical functions or actions to natural-occurring human growth factor, and much better stability and skin penetration potency than natural-occurring growth factor. In these connections, the composition comprising the peptides of this invention can exhibit excellent efficacies on the treatment, prevention and improvement of diseases or conditions demanding growth factor activities. In addition, excellent activity and stability of the peptides of this invention can be advantageously applied to pharmaceutical compositions, quasi-drugs and cosmetics.06-30-2011

Jun Young Jeon, Seoul KR

Patent application numberDescriptionPublished
20100077133Flash Memory Integrated Circuit with Compression/Decompression CODEC - Provided is a flash memory integrated circuit with a compression codec. The flash memory integrated circuit may simultaneously include a memory block and a compression codec circuit. The compression codec circuit may compress input data. A controller circuit may store the compressed input data in at least one page that is included in the memory block. Through this, it is possible to enhance a usage efficiency of a flash memory.03-25-2010

Jun Young Jeong, Suwon-Si KR

Patent application numberDescriptionPublished
20080225961APPARATUS AND METHOD TO ESTIMATE SAMPLING OFFSET - A sampling offset estimation apparatus including a pilot sub-carrier refiner, an information sub-carrier refiner, a data sub-carrier refiner, and a sampling offset estimator. The pilot sub-carrier refiner to refine a pilot sub-carrier extracted from a differential demodulated signal, and to generate a reference pilot sub-carrier. The information sub-carrier refiner to refine an information sub-carrier extracted from the differential demodulated signal, and to generate a reference information sub-carrier. The data sub-carrier refiner to refine a data sub-carrier extracted from the differential demodulated signal, and to generate a reference data sub-carrier. The sampling offset estimator to estimate a sampling offset included in the differential demodulated signal, on a basis of the reference pilot sub-carrier, the reference information sub-carrier, and the reference data sub-carrier.09-18-2008
20090274223ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING RECEIVER - In one aspect, an orthogonal frequency division multiplexing (OFDM) receiver includes an offset compensator, a fast Fourier transform (FFT) block, a control unit, a channel impulse response estimation block, and a sampling offset estimation block. The offset compensator is configured to receive a digital input signal and a sampling offset, and to convert the digital input signal into a baseband signal in accordance with the sampling offset. The fast Fourier transform (FFT) block is configured to perform an FFT operation of the base band signal output from the offset compensator and to output a corresponding FFT result. The control unit is configured to generate OFDM symbol information and a plurality of control signals based on the FFT result. The channel impulse response estimation block is configured to periodically generate receiving channel impulse response information of a receiving channel based on the FFT result. The sampling offset estimation block is configured to generate the sampling offset based on the FFT result, the receiving channel impulse response information, the OFDM symbol information, and the plurality of control signals.11-05-2009

Patent applications by Jun Young Jeong, Suwon-Si KR

Jun Young Kim, Seoul KR

Patent application numberDescriptionPublished
20110003210Polyolefin Microporous Membrane Surface-Modified By Hydrophilic Polymer, Surface Modification Method Thereof And Lithium-Ion Polymer Battery Including The Same - Disclosed herein are a polyolefin microporous membrane of which surface is modified by a hydrophilic polymer, a surface modification method thereof and a lithium ion polymer battery including the surface-modified polyolefin microporous membrane as a separator.01-06-2011

Jun Young Kim, Suwon KR

Patent application numberDescriptionPublished
20110057995Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles.03-10-2011
20110065851Nonaqueous ink composition for ink jet and method of manufacturing ink comprising the same - A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing.03-17-2011
20110193913Inkjet head cleaning apparatus - There is provided an inkjet head cleaning apparatus including: an air blowing unit spaced apart from a nozzle ejecting ink at a predetermined distance and blowing air toward the nozzle; a blocking surface disposed to face the air blowing unit and blocking ink being removed from the nozzle due to the air released by the air blowing unit; a rebound blocking unit disposed between the blocking surface and the nozzle and blocking ink droplets being rebounded farther than a predetermined distance from the blocking surface among the ink blocked by the blocking surface; and a storage unit receiving the removed ink.08-11-2011
20120024573Printed circuit board and manufacturing method thereof - There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.02-02-2012

Jun Young Lim, Gyeongbuk KR

Patent application numberDescriptionPublished
20110100687CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.05-05-2011

Jun Young Yu, Paju-Si KR

Patent application numberDescriptionPublished
20090279045Methods of manufacturing liquid crystal display devices - An LCD device and a method for manufacturing the same is disclosed, in which it is possible to correct a problem of insufficient or excessive supply of liquid crystal in an LCD device by controlling an amount of liquid crystal. The method includes preparing a liquid crystal cell comprised of a first substrate, a second substrate, a liquid crystal layer between the first and second substrates, and a first sealant formed in the periphery of the liquid crystal layer between the first and second substrates; measuring an amount of liquid crystal provided to the inside of liquid crystal cell; forming an inlet for liquid crystal in the first sealant; and regulating the amount of liquid crystal by supplying or discharging the liquid crystal through the inlet; and sealing the inlet.11-12-2009

Patent applications by Jun Young Yu, Paju-Si KR

Jun-Young Cho, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20090100115Methods and Apparatus for File Management Using Partitioned File Metadata - Management of files in a memory, such as a flash memory, includes storing in the memory a first node including a first type of metadata of the file, a second node including data of the file and a third node including a second type of metadata of the file including file status and memory location information for the first and second nodes. The third node may include a node including memory location information for the second node and a node including an index table that cross-references a memory location for the memory location information for the second node to a memory location of the first node. Methods and devices may be provided.04-16-2009

Jun-Young Hong, Seoul KR

Patent application numberDescriptionPublished
20110218240NOVEL COMPOUND WITH SPIRO CHIRAL CARBON BACKBONE, PREPARATION METHOD THEREOF, AND PHARMACEUTICAL COMPOSITION CONTAINING THE SAME - Provided are a novel compound with a spiro chiral carbon backbone, a stereoisomer thereof, an enantiomer thereof, an in vivo hydrolysable precursor thereof, or a pharmaceutically acceptable salt thereof. The novel compound with the spiro chiral carbon backbone has excellent osteoblast differentiation activity, mast cell inhibitory activity, and fatty acid synthesis inhibitory activity in the liver. Therefore, the novel compound can be expected to play an innovative role in treatment of osteoporosis, fatty liver, and obesity.09-08-2011

Jun-Young Jang, Suwon-Si KR

Patent application numberDescriptionPublished
20100245825Substrate including alignment marks, methods of aligning wafers and fabricating semiconductors - Provided is a substrate having an alignment mark, methods of aligning wafers and fabricating semiconductors. An alignment method of a wafer comprises providing a wafer on a wafer stage of a photolithography apparatus, irradiating light to the alignment mark, collecting reflected light from the alignment mark, analyzing optical information of the collected light, and determining a location of the wafer based on the analyzed optical information, wherein the wafer comprises a first surface having an alignment mark, the alignment mark including a first plurality of alignment patterns in a first row, and a second plurality of alignment patterns in a second row, the second plurality of alignment patterns being adjacent to the first plurality of alignment patterns, wherein the first plurality of alignment patterns are arranged in a row direction at a first pitch, and the second plurality of alignment patterns are arranged in the row direction at a second pitch different from the first pitch.09-30-2010

Jun-Young Jang, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20090017577Methods of Forming Phase Change Memory Devices Having Bottom Electrodes - Phase change memory devices can have bottom patterns on a substrate. Line-shaped or L-shaped bottom electrodes can be formed in contact with respective bottom patterns on a substrate and to have top surfaces defined by dimensions in x and y axes directions on the substrate. The dimension along the x-axis of the top surface of the bottom electrodes has less width than a resolution limit of a photolithography process used to fabricate the phase change memory device. Phase change patterns can be formed in contact with the top surface of the bottom electrodes to have a greater width than each of the dimensions in the x and y axes directions of the top surface of the bottom electrodes and top electrodes can be formed on the phase change patterns, wherein the line shape or the L shape represents a sectional line shape or a sectional L shape of the bottom electrodes in the x-axis direction.01-15-2009
20110044098Nonvolatile Memory Cells Having Phase Changeable Patterns Therein for Data Storage - A nonvolatile memory cell includes a substrate and a phase changeable pattern configured to retain a state of the memory cell, on the substrate. An electrically insulating layer is provided, which contains a first electrode therein in contact with the phase changeable pattern. The first electrode has at least one of an L-shape when viewed in cross section and an arcuate shape when viewed from a plan perspective. A lower portion of the first electrode may be ring-shaped when viewed from the plan perspective. The lower portion of the first electrode may also have a U-shaped cross-section. An upper portion of the first electrode may also have an arcuate shape that spans more than 180° of a circular arc.02-24-2011

Jun-Young Jang, Seoul KR

Patent application numberDescriptionPublished
20110098916NAVIGATION METHOD OF MOBILE TERMINAL AND APPARATUS THEREOF - A navigation method and apparatus of a mobile terminal provide a vehicle driver with information about whether or not he can enter an intersection based on traffic light information and traffic volume information (a traffic congestion degree) to allow the vehicle driver to safely drive on the road (e.g., intersection). The navigation apparatus of a mobile terminal includes a display unit configured to display a route from a current location to a destination on map data, a communication unit configured to receive signal information of a traffic light and traffic volume information regarding an intersection on the route, and a controller configured to inform a vehicle driver about whether or not the vehicle driver can enter the intersection based on the signal information of the traffic light and the traffic volume information.04-28-2011

Jun-Young Jung, Seoul KR

Patent application numberDescriptionPublished
20080209080COMPUTER SYSTEM AND CONTROL METHOD THEREOF - A computer system include an operation performing unit which performs at least one operation, a manipulation information producing unit which senses user's manipulation to produce direction information and motion amount information corresponding to an amount of motion in a direction corresponding to the direction information, a mode selection unit which inputs user's selection about a manipulation mode, and a controller which controls the operation performing unit based on the direction information which is produced by the manipulation information producing unit, or controls the operation performing unit based on the direction information and the motion amount information, according to the user's selection inputted through the mode selection unit.08-28-2008

Jun-Young Jung, Ulsan-Si KR

Patent application numberDescriptionPublished
20110095293THIN FILM TRANSISTOR ARRAY PANEL - A thin film transistor array panel includes: a substrate, a gate line disposed on the substrate, a data line intersecting the gate line, a drain electrode separated from the data line a first insulating layer covering the data line, a color filter disposed on the first insulating layer, a second insulating layer disposed on the color filter and having a contact hole exposing the drain electrode and the color filter and a pixel electrode disposed on the second insulating layer and connected to the drain electrode through the contact hole. The contact hole partially exposes the color filter near a portion where the drain electrode and the pixel electrode are connected to each other, and the pixel electrode covers the color filter exposed through the contact hole.04-28-2011

Jun-Young Kim, Giheung-Gu KR

Patent application numberDescriptionPublished
20110281384METHOD OF MANUFACTURING THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING FLAT PANEL DISPLAY USING THE SAME - A method of manufacturing a thin film transistor (TFT) and a method of manufacturing a flat panel display (FPD) using the same. A metal layer made out of Mo having no etch selectivity with a semiconductor layer so that a source electrode, a drain electrode, and an activation layer may be produced using a single mask in a single etch step. The metal layer and the semiconductor layer are simultaneously etched to form the source electrode, the drain electrode, and the activation layer, of a same width so that the area occupied by the TFT may be minimized. When the TFT is applied to the FPD, the maximal aperture ratio of pixels may be obtained and the FPD may be manufactured using only four masks.11-17-2011

Jun-Young Kim, Yongin-City KR

Patent application numberDescriptionPublished
20110292312LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A liquid crystal display device (LCD) is constructed with a light blocking layer positioned on a data line region of a lower substrate defined by pixel regions and data line regions. A data line is positioned on the data line region of the lower substrate to overlap the light blocking layer with a gate insulating layer interposed therebetween. An organic insulating layer is positioned on the data line region of the lower substrate in order to cover the data line. Pixel electrodes are respectively positioned on the pixel regions to be spaced apart from the data line. Capacitors are respectively positioned on the pixel regions, and each of the capacitors has a lower electrode formed of a first transparent conductive material and an upper electrode formed of a second transparent conductive material, and the upper electrode is physically insulated from the data line with the organic insulating layer interposed therebetween.12-01-2011

Jun-Young Ko, Chungcheongnam-Do KR

Patent application numberDescriptionPublished
20090053858METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION SUBSTRATE - An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.02-26-2009

Patent applications by Jun-Young Ko, Chungcheongnam-Do KR

Jun-Young Ko, Cheonan-Si KR

Patent application numberDescriptionPublished
20080311727METHOD OF CUTTING A WAFER - In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.12-18-2008
20080315408Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same - Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.12-25-2008
20090278249Printed circuit board and method thereof and a solder ball land and method thereof - A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.11-12-2009
20110110062Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same - A stack-type semiconductor device including semiconductor chips having different backside structures and an electronic apparatus including the stack-type semiconductor device include: a base frame for a semiconductor device; a first semiconductor chip that is mounted on the base frame and has a bottom surface having a first surface roughness; and a second semiconductor chip that is mounted on the first semiconductor chip and has a bottom surface having a second surface roughness, wherein the second surface roughness is greater than the first surface roughness by 1.2 nm or more. The stack-type semiconductor device is manufactured to be thin while cracking of the first semiconductor chip is prevented. In addition, changes in data caused by charge loss resulting from diffusion of metal ions, which can occur when a stack-type semiconductor device is a memory device, is prevented.05-12-2011
20110318887METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.12-29-2011

Patent applications by Jun-Young Ko, Cheonan-Si KR

Jun-Young Lee, Yongsan-Gu KR

Patent application numberDescriptionPublished
20090053630METHOD OF PREPARING TONER AND TONER PREPARED USING THE METHOD - A method of preparing toner, the method including: preparing latex particles for a core which contain wax by polymerizing a toner composition comprising at least one polymerizable monomer and a macromonomer having a hydrophilic group, a hydrophobic group, and at least one reactive functional group; mixing the latex particles for a core with a self-dispersable pigment dispersion and adding an inorganic salt thereto to prepare a primarily agglomerated toner; and coating latex particles for a shell layer on the primarily agglomerated toner. In addition, a toner prepared using the preparation method, a method of forming image using the toner, and an image forming apparatus using the toner. Accordingly, pigments can be uniformly dispersed even without using an emulsifying agent and a dispersant, and thus images that are uniformly transferred can be obtained, and toner with long-term storage and excellent durability can be prepared.02-26-2009

Jun-Young Lee, Yonin-Si KR

Patent application numberDescriptionPublished
20100084658DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate having a low-resistance metallic layer and a method of manufacturing the display substrate. The gate conductors are extended in a first direction. The source conductors are extended in a second direction crossing the first direction including a lower layer of molybdenum or a molybdenum alloy, and an upper layer of aluminum or an aluminum alloy. The pixel areas are defined by the gate conductors and the source conductors. A switching element is formed in each of the pixel areas and includes a gate electrode extended from the gate conductor and a source electrode extended from the source conductor. The pixel electrode includes a transparent conductive material, and is electrically connected to a drain electrode of the switching element.04-08-2010

Jun-Young Lee, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20110081762Methods of fabricating non-volatile memory devices with discrete resistive memory material regions - A semiconductor memory device includes a first conductive line on a semiconductor substrate, an interlayer insulating layer on the first conductive line, a second conductive line on the interlayer insulating layer, and a memory cell in an hole through the interlayer insulating layer wherein the first and second conductive lines cross, the memory cell including a discrete resistive memory material region disposed in the hole and electrically connected between the first and second conductive lines. The resistive memory material region may be substantially contained within the hole. In some embodiments, contact between the resistive memory material region and the interlayer insulating layer is substantially limited to sidewalls of the interlayer insulating layer in the hole.04-07-2011
20110128165KEYPAD FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE KEYPAD - A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a rigidity enough to be molded and molding the primarily thermal-treated metal alloy board with a press, a button portion formed by secondarily thermal-treating the keypad body to cure the keypad body and etching the secondarily thermal-treated keypad body by means of etching processing, and urethane rubber and a silicon pad attached to a back surface of the keypad body which has undergone anodizing processing and various colorations.06-02-2011
20120003796DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL HAVING THE SAME - An improved display substrate is provided to reduce surface defects on insulating layers of organic thin film transistors. Related methods of manufacture are also provided. In one example, a display substrate includes a base, a plurality of data lines, a plurality of gate lines, a pixel defined by the data lines and the gate lines, an organic thin film transistor, and a pixel electrode. The data lines are on the base and are oriented in a first direction. The gate lines are oriented in a second direction that crosses the first direction. The organic thin film transistor includes a source electrode electrically connected to one of the data lines, a gate electrode electrically connected to one of the gate lines, and an organic semiconductor layer. The pixel electrode is disposed in the pixel and electrically connected to the organic thin film transistor. The pixel electrode comprises a transparent oxynitride.01-05-2012

Patent applications by Jun-Young Lee, Gyeonggi-Do KR

Jun-Young Lee, Suwon-Si KR

Patent application numberDescriptionPublished
20080240576METHOD OF AND APPARATUS FOR DETECTING ERROR IN IMAGE DATA STREAM - A method is provided for detecting an error in an image data stream in a device environment where digital image data is reproduced, especially, in a wired/wireless network such as a personal portable device. The method comprises determining whether or not an error is present in an input image data stream; determining a similarity between patterns of transform coefficients that are generated in the course of decoding the input image data stream; and detecting the starting position of the error based on the similarity determination. Accordingly, a decoder can independently detect the position of the error accurately, and the quality of an image which is replaced and restored using error concealment can be improved.10-02-2008
20080242377INPUT DEVICE FOR MOBILE TERMINAL - An input device for a mobile terminal includes a touch unit disposed on a surface of a housing of the mobile terminal, a conductive member disposed on an inner surface of the housing in a position corresponding to the touch unit, and a touch sensor to sense an operation of the touch unit through the conductive member and generate a corresponding signal. The touch sensor is provided within the housing in a position corresponding to the conductive member.10-02-2008

Patent applications by Jun-Young Lee, Suwon-Si KR

Jun-Young Lee, Yongin-City KR

Patent application numberDescriptionPublished
20110279746LIQUID CRYSTAL DISPLAY DEVICE AND INSPECTION METHOD THEREOF - The embodiment is to provide a liquid crystal display device capable of detecting malfunctions. The liquid crystal display device includes pixels configured to be connected to scan lines and data lines, data pads electrically connected to the data lines, a data integrated circuit supplying data signals to the data lines through the data pads, first data transistors coupled to the data pads, and second data transistors coupled to the data lines. The first data transistors are disposed on the data integrated circuit and the second data transistors are separated from the data integrated circuit.11-17-2011

Jun-Young Lim, Seoul KR

Patent application numberDescriptionPublished
20090236951SWITCHED RELUCTANCE MOTOR - The present invention relates to a switched reluctance motor which includes a housing, a stator and a rotor received and installed within the housing, and a rotor position detecting unit that detects a rotational position of the rotor at an outer side of the housing. Assembling can be quickly and easily performed, a sensor can be easily repaired and checked, and a bad influence on the sensor by temperature and dust can be reduced.09-24-2009
20090267548SWITCHED RELUCTANCE MOTOR AND CONNECTION METHOD FOR SENSOR SHUTTER THEREOF - The present invention relates to a switched reluctance motor and a connection method for a sensor shutter thereof. The switched reluctance motor in accordance with the present invention includes a stator; a rotor rotating with respect to the stator centering around a rotational shaft; and a sensor shutter having a sensing part through which a light can be passed and connected to an end portion of the rotational shaft, and a stopping ring is connected to the end portion of the rotational shaft so as to prevent the sensor shutter from being separated. Accordingly, the sensor shutter can be quickly and easily connected and the length of the rotational shaft can be decreased.10-29-2009
20100147012REFRIGERATOR HAVING DISPENSER - Disclosed is a refrigerator having a dispenser, including a main body having a cooling chamber and a door for selectively shielding the cooling chamber. The refrigerator also includes a container accommodating unit and a communication chute that passes through a front surface of the door and guides content to a dispensing cavity defined by the container accommodating unit. The refrigerator further includes an obstruction unit disposed in the container accommodating unit, and movable, about a plane perpendicular to the front which content guided by the communication chute is relatively obstructed by the obstruction unit and a second position in which content guided by the communication chute is relatively unobstructed by the obstruction unit.06-17-2010
20100321961INSULATION TRANSFORMER AND KEY INPUT CIRCUIT HAVING THE SAME - An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented.12-23-2010
20110318504METHOD FOR FABRICATING COMPOSITE MATERIAL COMPRISING NANO CARBON AND METAL OR CERAMIC - Disclosed is a method for fabricating a composite material comprising nano carbon and metal or ceramic, in more detail, a method for fabricating a composite material in which metallic or ceramic particles are uniformly dispersed on a nano carbon surface, the method including (1) coating a metal layer on nano carbon, (2) fabricating composite nano powders by performing a thermal treatment for the nano carbon coated with the metal layer, and (3) sintering the composite nano powders, whereby the composite nano powders, in which metallic or ceramic nano powders are uniformly mixed on the surface of the nano carbon, can be easily fabricated, and such composite nano powders can be sintered so as to fabricate the composite material, in which the nano carbon and the metallic or ceramic powders are uniformly dispersed. Also, the use of the composite material can have a great contribution to implementation of high performance, lightweight and size reduction in electric, electronic and vehicle-related fields, in detail, the composite material can be applied to an electrode material with a high conductivity, a thermal interface with a high thermal conductivity, a structural material with a high strength-to-weight ratio, and the like.12-29-2011

Patent applications by Jun-Young Lim, Seoul KR

Jun-Young Yang, Chilgok-Gun KR

Patent application numberDescriptionPublished
20110132527METHOD FOR FABRICATING CLICHE AND METHOD FOR FORMING THIN FILM PATTERN BY USING THE SAME - Disclosed is a method for fabricating a cliché that can prevent formation of a defective thin film pattern, and a method for forming a thin film pattern using the same. The method for fabricating a cliché includes providing a base substrate having first and second regions, forming a first depressed pattern having a first depth and a first width at a first region, and a second depressed pattern having a second width greater than the first width and a depth the same with the first depth at a second region, forming a protective film for exposing the second region and covering the first region, the protective film having adhesivity, forming the second depressed pattern to have a second depth deeper than the first depth of the first depressed pattern at the first region by using the protective film having the adhesivity, and removing the protective film.06-09-2011