Patent application number | Description | Published |
20110182039 | COMPOSITE MODULE - A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate. | 07-28-2011 |
20110279340 | ANTENNA AND WIRELESS IC DEVICE - An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip. | 11-17-2011 |
20120043117 | SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD - A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction. | 02-23-2012 |
20120056796 | CIRCUIT BOARD AND CIRCUIT MODULE - A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion. | 03-08-2012 |
20120097428 | SIGNAL LINE PATH AND MANUFACTURING METHOD THEREFOR - A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer. | 04-26-2012 |
20120097433 | SIGNAL LINE AND CIRCUIT SUBSTRATE - A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction. | 04-26-2012 |
20120133458 | SIGNAL LINE - A signal line that can be easily bent and significantly reduces loss generated in a high-frequency signal includes a main body including a plurality of insulating sheets made of a flexible material and stacked on each other in a stacking direction. Ground conductors are provided in the main body on the positive z-axis direction side of a signal line. The ground conductors have a slit S formed therein that overlaps the signal line when viewed in plan from the z-axis direction. A ground conductor is provided in the main body on the negative z-axis direction side of the signal line, and is overlapped by the signal line when viewed in plan from the z-axis direction. The ground conductors and the signal line define a strip line structure. A distance between the ground electrodes and the signal line is smaller than a distance between the ground electrode and the signal line. | 05-31-2012 |
20120138340 | MULTILAYER SUBSTRATE - A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors. | 06-07-2012 |
20120176282 | ANTENNA DEVICE AND MOBILE COMMUNICATION TERMINAL - An antenna device includes a feeding member including a coil pattern and an emitting member to emit a transmit signal supplied from the feeding member and to receive a receive signal and supplying it to the feeding member. The emitting member includes an opening portion and a slit portion communicating with the opening portion. When seen in plan view from the direction of the winding axis of the coil pattern, the opening portion of the emitting member and the inner region of the coil pattern overlap each other, and the emitting member and the coil pattern overlap each other at least partially. | 07-12-2012 |
20130038501 | ANTENNA MODULE - In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction. | 02-14-2013 |
20130099353 | ESD PROTECTION DEVICE - An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes. | 04-25-2013 |
20130127560 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈ | 05-23-2013 |
20130147581 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 06-13-2013 |
20130147675 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes an antenna coil including a first conductive pattern disposed on a first major surface of a magnetic sheet, a second conductive pattern disposed on a first major surface of a non-magnetic sheet, and an interlayer conductor connecting the first conductive pattern and second conductive pattern. The antenna coil including the first conductive pattern and second conductive pattern defines a spiral or substantially spiral pattern. The antenna device is a resin multilayer structure in which its base body is a laminate of the magnetic layer and non-magnetic layer and the predetermined patterns are disposed inside and outside the laminate. | 06-13-2013 |
20130154388 | ANTENNA DEVICE AND MOBILE COMMUNICATION TERMINAL - An antenna device includes a feeding member including a coil pattern and an emitting member to emit a transmit signal supplied from the feeding member and to receive a receive signal and supplying it to the feeding member. The emitting member includes an opening portion and a slit portion communicating with the opening portion. When seen in plan view from the direction of the winding axis of the coil pattern, the opening portion of the emitting member and the inner region of the coil pattern overlap each other, and the emitting member and the coil pattern overlap each other at least partially. | 06-20-2013 |
20130168837 | ESD PROTECTION DEVICE - An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer located on the top surface of the semiconductor substrate. An ESD protection circuit is provided in the top layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post-shaped electrodes. First ends of the interlayer wiring lines provided in the thickness direction are connected to the input/output electrodes provided on the top surface of the semiconductor substrate and the second ends are connected to first ends of the in-plane wiring lines extending in the plane direction. The distance between the centers of the first and second post-shaped electrodes is larger than the distance between the centers of the first and second input/output electrodes. | 07-04-2013 |
20130181876 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device that includes coil antennas each having a coil conductor wound around a winding axis and a planar conductor including a surface and an edge end portion, the surface extending along the winding axis of the coil conductor, the edge end portion being adjacent to a coil opening of the coil conductor. A current flowing through the coil conductor induces a current in the planar conductor, this current produces a magnetic flux in a direction normal to the planar conductor, and thus the planar conductor acts as a booster antenna. The antenna device has directivity in the direction normal to the planar conductor because the magnetic flux produced by the coil antennas and that produced by the planar conductor are combined. This enables the antenna device to occupy a small area while achieving a predetermined communication distance. | 07-18-2013 |
20130207740 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other. | 08-15-2013 |
20130229319 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes a base including a planar conductor disposed thereon, and a coil antenna. The coil antenna includes a coil conductor wound around a magnetic core. The coil antenna is arranged such that a coil opening of the coil conductor is closed to an edge of the planar conductor. A current passing through the coil conductor induces a current in the planar conductor. Thus, a first magnetic flux occurs in the coil antenna, and a second magnetic flux occurs in the planar conductor. Therefore, a third magnetic flux occurs in an area of the planar conductor. Accordingly, the antenna device achieves a small footprint, a small-sized communication terminal apparatus and a desired communication distance. | 09-05-2013 |
20130234808 | SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD - A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction. | 09-12-2013 |
20130300515 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 11-14-2013 |
20130300516 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 11-14-2013 |
20140048312 | SIGNAL LINE AND CIRCUIT SUBSTRATE - A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction. | 02-20-2014 |
20140097916 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈ | 04-10-2014 |
20140125426 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 05-08-2014 |
20140125434 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 05-08-2014 |
20140166344 | MULTILAYER SUBSTRATE - A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors. | 06-19-2014 |
20140299374 | FLAT CABLE - A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors. | 10-09-2014 |
20140340273 | ANTENNA APPARATUS - There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus. | 11-20-2014 |
20140375876 | CAMERA MODULE - A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked. | 12-25-2014 |
20140376199 | LAMINATED MULTI-CONDUCTOR CABLE - A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination. | 12-25-2014 |
20150022286 | HIGH-FREQUENCY SIGNAL LINE - A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer. | 01-22-2015 |
20150022288 | HIGH-FREQUENCY SIGNAL LINE - A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion. | 01-22-2015 |
20150022289 | HIGH-FREQUENCY SIGNAL LINE - A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion. | 01-22-2015 |
20150024700 | TRANSMISSION LINE - A signal line conductor extends in a direction in which a signal propagates, and a dielectric, surrounding the signal line conductor, also extends in the direction in which the signal propagates. Conductive films that define and function as a ground conductor extend on a side surface of the dielectric in the direction in which the signal propagates. Furthermore, conductive films that define and function as a bridge conductor extend on a side surface of the dielectric in a direction across the direction in which the signal propagates, and thus connect the conductive films to each other. | 01-22-2015 |
20150048906 | HIGH-FREQUENCY SIGNAL LINE AND METHOD FOR PRODUCING BASE LAYER WITH SIGNAL LINE - A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion. | 02-19-2015 |
20150061146 | ESD PROTECTION DEVICE - An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer located on the top surface of the semiconductor substrate. An ESD protection circuit is provided in the top layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post-shaped electrodes. First ends of the interlayer wiring lines provided in the thickness direction are connected to the input/output electrodes provided on the top surface of the semiconductor substrate and the second ends are connected to first ends of the in-plane wiring lines extending in the plane direction. The distance between the centers of the first and second post-shaped electrodes is larger than the distance between the centers of the first and second input/output electrodes. | 03-05-2015 |
20150084822 | CIRCUIT BOARD AND CIRCUIT MODULE - A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion. | 03-26-2015 |