| Patent application number | Description | Published |
|---|
| 20080239308 | HIGH THROUGHPUT MEASUREMENT SYSTEM - A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module. | 10-02-2008 |
| 20080243433 | METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA - A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics. | 10-02-2008 |
| 20090033942 | Determining Physical Property of Substrate - A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database. | 02-05-2009 |
| 20090275265 | ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA - A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference spectra, and determining based on the comparing whether a polishing endpoint has been achieved for the substrate having the outermost layer undergoing polishing. The current spectrum is a spectrum of light reflected from a substrate having an outermost layer undergoing polishing and at least one underlying layer. The plurality of reference spectra represent spectra of light reflected from substrates with outermost layers having the same thickness and underlying layers having different thicknesses. | 11-05-2009 |
| 20100184357 | Polishing Pad and System with Window Support - A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber. | 07-22-2010 |
| 20100261413 | Determining Physical Property of Substrate - A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database. | 10-14-2010 |
| 20110046918 | METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA - A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics. | 02-24-2011 |
| Patent application number | Description | Published |
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| 20100058130 | PROCESSOR TO JTAG TEST ACCESS PORT INTERFACE - Method and apparatus for operating for operating an Institute of Electrical and Electronics Engineers (IEEE) Standard 1149.1 compliant Joint Test Action Group (JTAG) Test Access Port (TAP) controller are disclosed. An example apparatus includes write logic that is configured to operationally interface with a TAP controller and a processor. The write logic is further configured to receive, from the processor, data for initializing the apparatus and operating the TAP controller, convert at least a portion of the data from a parallel format to a serial format and communicate the converted data to the TAP controller. | 03-04-2010 |
| 20100090743 | INTERFACE TO REGULATE VOLTAGE FOR ASIC POWER MANAGEMENT - A method and apparatus to regulate voltage used to power an ASIC comprising an ASIC having a signal source and a modulator. The modulator establishes a characteristic of a signal created by the signal source to indicate a voltage level to be used to power the ASIC. The signal is communicated to a voltage regulator to apply an optimal voltage to the ASIC. | 04-15-2010 |
| 20100218058 | FAULT INJECTION - Systems, methods, and other embodiments associated with programmable application specific integrated circuit (ASIC) fault injection are described. One example ASIC includes a serializer de-serializer (SERDES). The example ASIC may also include logics to process data in the ASIC. At least one of the logics either receives data from the SERDES and/or provides data to the SERDES. The example ASIC may also include an embedded fault injection logic (EFIL) to control injection of a fault to a path (e.g., data, control) associated with at least one of the logics. The example ASIC may also include an embedded set of multiplexers (ESOMs) controlled by the EFIL. The ESOMs are controllable by the EFIL to inject a fault signal to the data path. | 08-26-2010 |
