| Patent application number | Description | Published |
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| 20100242271 | DIELECTRIC LAMINATION STRUCTURE, MANUFACTURING METHOD OF A DIELECTRIC LAMINATION STRUCTURE, AND WIRING BOARD INCLUDING A DIELECTRIC LAMINATION STRUCTURE - A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness of from 0.3 to 10 μm. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 μm, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 μm, and a minimum via pitch is from 100 to 350 μm. | 09-30-2010 |
| 20100300602 | Method for Manufacturing Ceramic Capacitor - A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion. | 12-02-2010 |
| 20100300740 | Ceramic Capacitor and Wiring Board - A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section. | 12-02-2010 |
| 20110083794 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-14-2011 |
| 20110090615 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-21-2011 |
| 20110157763 | CAPACITOR FOR INCORPORATION IN WIRING BOARD, WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, AND CERAMIC CHIP FOR EMBEDMENT - A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body. | 06-30-2011 |
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| 20120019855 | CONTENT PRINTING SYSTEM, PRINT RELAY SYSTEM, CONTROL METHOD, AND STORAGE MEDIUM - A print relay system capable of connecting to an image forming apparatus and a print service system, which is provided by a vendor that publishes a unique specification for executing data communication with the image forming apparatus includes an acquisition unit configured to, in response to the print service system receiving a printing instruction input by a user via a client, acquire data from the print service system according to a first specification, which is the unique specification for data communication between the print service system and a relay virtual printer, and a transmission unit configured to transmit the data acquired by the acquisition unit from the relay virtual printer to the image forming apparatus according to a second specification for executing data communication between the relay virtual printer and the image forming apparatus. | 01-26-2012 |
| 20120019865 | CONTENT PRINTING SYSTEM, PRINT RELAY SYSTEM, CONTROL METHOD, AND STORAGE MEDIUM - A print relay system includes a receiving unit configured to receive, from an image forming apparatus, a request for registering information about the image forming apparatus to a print service, a generation unit configured to, in response to the receiving unit receiving the request, generate a relay virtual printer corresponding to the image forming apparatus that has transmitted the request, and a request unit configured to request the print service to register identification information for identifying the relay virtual printer. | 01-26-2012 |
