Patent application number | Description | Published |
20080236924 | SADDLE RIDE, FUEL CELL POWERED VEHICLE - A fuel cell powered vehicle includes radiators disposed on left and right sides on the skew rear side of a front wheel in relation to the vehicle body front-rear direction. A secondary battery is disposed between the left and right radiators. A thin plate-shaped inner cowl is disposed between the secondary battery and the front wheel. Duct mechanisms surrounding the radiators are provided on the left and right sides of the inner cowl and inside a cowling. Each duct mechanism includes introduction ports for a running airflow, and a discharge port that is fitted with variable-type louvers. A voltage converter unit is accommodated in a straddled part of the vehicle. Radiating fins of the voltage converter include plate-like members erected in the vehicle body front-rear direction that are directed toward the upper side of the vehicle body and are exposed to the exterior of the vehicle body. | 10-02-2008 |
20090020347 | SADDLE SEAT TYPE FUEL-CELL ELECTRIC VEHICLE - A saddle seat type fuel-cell electric vehicle includes a body frame having a pair of right and left main frames connected at their front ends to a head pipe and extending downward therefrom and a pair of right and left under frames connected at their front ends to the head pipe and extending downward therefrom along the right and left main frames on the lower side thereof. A pair of hydrogen cylinders extend substantially vertically along the body frame between the front side of the head pipe and the front side of the front end portion of the footrest so as to interpose the body frame in the lateral direction of the vehicle. A fuel supply unit is provided in a space surrounded by the main frames and the under frames with the hydrogen cylinders being surrounded by a guard pipe connected to the main frames. | 01-22-2009 |
20090020348 | SADDLE SEAT TYPE ELECTRIC VEHICLE - A saddle seat type fuel-cell electric vehicle includes a motor for driving rear wheels, a secondary battery for supplying electric power to the motor, a carrier for carrying luggage and a seat for supporting an operator, the carrier is located behind the seat and above the rear wheels. The secondary battery includes a plurality of cells each having an elongated boxlike shape, and it is stored in the internal space of the carrier, thereby increasing the flexibility of the layout of the vehicle body. Spacings functioning as air passages are defined between the inner wall of the carrier and the secondary battery. The carrier is formed with air inlet openings for introducing an air flow into the internal space and an air outlet opening for discharging the air flow out of the internal space. The plural cells are arranged adjacent to each other with given intervals on the same plane. | 01-22-2009 |
20100033983 | Lamp device-integrated rearview mirror - A lamp device-integrated rearview mirror | 02-11-2010 |
Patent application number | Description | Published |
20080303737 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME - An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point. | 12-11-2008 |
20090015490 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME - An electronic device includes: a first molded body having a recessed cross section and made of resin; a second molded body having a recessed cross section and made of resin, the second molded body being fitted inside the first molded body; and an antenna pattern sandwiched between the first and second molded body. Among the surfaces of the first molded body, the surface on the side not adjacent to the antenna pattern constitutes an outer surface. | 01-15-2009 |
20090194326 | ELECTRONIC DEVICE, METHOD FOR HOLDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device includes: a housing; an electronic component provided inside the housing; and a holding member provided between an inner wall of the housing and the electronic component and configured to hold the electronic component. The holding member is configured to hold a first region of a major surface of the electronic component located on a first end surface side, and the holding member is configured not to hold a second region of the major surface of the electronic component located on a second end surface side opposed to the first end surface side. | 08-06-2009 |
20090296325 | CHASSIS, ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD FOR CHASSIS - A chassis includes: a flat plate portion including a first major surface and a second major surface facing the first major surface; a protruding portion provided on an outer edge of the flat plate portion and protruding in a direction crossing the first and second major surfaces; and a seal portion provided on the outer edge of the flat plate portion. | 12-03-2009 |
20140078696 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a display panel, an optical layer, an operation panel, a bonding layer, a first housing, and a second housing. The optical layer is provided on a display surface side of the display panel. The operation panel is adhered to the display panel. A peripheral portion of the operation panel protrudes sideward from the display panel. The bonding layer is provided on a side of the display panel opposite to the optical layer. The first housing includes containing and protruding portions. The protruding portion protrudes sideward from the containing portion to be adhered to the peripheral portion of the operation panel. The containing portion is adhered to the display panel. The second housing includes a bonding portion adhered to the peripheral portion of the operation panel. The second housing defines a containment space between the first and second housings. | 03-20-2014 |
20140306849 | ELECTRONIC APPARATUS - An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern. | 10-16-2014 |
Patent application number | Description | Published |
20110203513 | METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE - In a method of manufacturing a silicon carbide substrate, a defect-containing substrate made of silicon carbide is prepared. The defect-containing substrate has a front surface, a rear surface being opposite to the front surface, and a surface portion adjacent to the front surface. The detect-containing substrate includes a screw dislocation in the surface portion. The front surface of the defect-containing substrate is applied with an external force so that a crystallinity of the surface portion is reduced. After being applied with the external force, the defect-containing substrate is thermally treated so that the crystallinity of the surface portion is recovered. | 08-25-2011 |
20110204383 | SIC SEMICONDUCTOR DEVICE HAVING SCHOTTKY BARRIER DIODE AND METHOD FOR MANUFACTURING THE SAME - A SiC semiconductor device having a Schottky barrier diode includes: a substrate made of SiC and having a first conductive type, wherein the substrate includes a main surface and a rear surface; a drift layer made of SiC and having the first conductive type, wherein the drift layer is disposed on the main surface of the substrate and has an impurity concentration lower than the substrate; a Schottky electrode disposed on the drift layer and has a Schottky contact with a surface of the drift layer; and an ohmic electrode disposed on the rear surface of the substrate. The Schottky electrode directly contacts the drift layer in such a manner that a lattice of the Schottky electrode is matched with a lattice of the drift layer. | 08-25-2011 |
20110291110 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The silicon carbide semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate insulating layer, a gate electrode, a source electrode, a drain electrode, and a deep layer. The deep layer is disposed under the base region and is located to a depth deeper than the trench. The deep layer is divided into a plurality of portions in a direction that crosses a longitudinal direction of the trench. The portions include a group of portions disposed at positions corresponding to the trench and arranged at equal intervals in the longitudinal direction of the trench. The group of portions surrounds corners of a bottom of the trench. | 12-01-2011 |
20110309464 | SEMICONDUCTOR DEVICE INCLUDING CELL REGION AND PERIPHERAL REGION HAVING HIGH BREAKDOWN VOLTAGE STRUCTURE - A semiconductor device includes a semiconductor substrate and an electric field terminal part. The semiconductor substrate includes a substrate, a drift layer disposed on a surface of the substrate, and a base layer disposed on a surface of the drift layer. The semiconductor substrate is divided into a cell region in which a semiconductor element is disposed and a peripheral region that surrounds the cell region. The base region has a bottom face located on a same plane throughout the cell region and the peripheral region and provides an electric field relaxing layer located in the peripheral region. The electric field terminal part surrounds the cell region and a portion of the electric field relaxing layer and penetrates the electric field relaxing layer from a surface of the electric field relaxing layer to the drift layer. | 12-22-2011 |
20120061682 | SIC SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A SiC semiconductor device includes: a substrate, a drift layer, and a base region stacked in this order; first and second source regions and a contact layer in the base region; a trench penetrating the source and base regions; a gate electrode in the trench; an interlayer insulation film with a contact hole covering the gate electrode; a source electrode coupling with the source region and the contact layer via the contact hole; a drain electrode on the substrate; and a metal silicide film. The high concentration second source region is shallower than the low concentration first source region, and has a part covered with the interlayer insulation film, which includes a low concentration first portion near a surface and a high concentration second portion deeper than the first portion. The metal silicide film on the second part has a thickness larger than the first portion. | 03-15-2012 |
20150115286 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - An SiC semiconductor device has a p type region including a low concentration region and a high concentration region filled in a trench formed in a cell region. A p type column is provided by the low concentration region, and a p | 04-30-2015 |
20150236127 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a silicon carbide semiconductor device including a vertical switching element having a trench gate structure, with the use of a substrate having an off angle with respect to a (0001) plane or a (000-1) plane, a trench is formed from a surface of a source region to a depth reaching a drift layer through a base region so that a side wall surface of the trench faces a (11-20) plane or a (1-100) plane, and a gate oxide film is formed without performing sacrificial oxidation after formation of the trench. | 08-20-2015 |
Patent application number | Description | Published |
20120056313 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a radiator plate including a stress alleviation section, a resin sheet arranged on the radiator plate, a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars, and a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars. | 03-08-2012 |
20130265504 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a display, a rear cover, and a front mask. The rear cover is configured to cover a rear surface of the display. The front mask is configured to be exposed to an outside and includes an opening and a supporter. The opening is configured to expose a front surface of the display. The supporter is configured to support the display and includes a first portion and a second portion. The first portion is configured to face a side surface of the display. The second portion protrudes from the first portion toward the rear cover. The second portion is closer to the rear cover than the rear surface of the display. | 10-10-2013 |
20130265505 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a display, a rear cover, a supporter, and a front mask. The rear cover is configured to cover a rear surface of the display. The supporter is between the display and the rear cover. The supporter is configured to support the rear surface of the display. The front mask is exposed to an outside. The front mask includes an opening and a protrusion. The opening is configured to expose a front surface of the display. The protrusion is configured to support the display. The protrusion includes a first portion and a second portion. The first portion is configured to face a side surface of the display. The second portion is configured to face a side surface of the supporter. | 10-10-2013 |