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Jun Mochizuki
Jun Mochizuki, Nirasaki City JP
| Patent application number | Description | Published |
|---|---|---|
| 20110043232 | CONTACT STRUCTURE FOR INSPECTION - A plurality of metal plates and an insulating plate having a polished surface are laminated in a probe supporting plate. Through-holes into which probes are to be inserted are respectively formed in the metal plates and the insulating plate. Diameters of the through-holes are greater than diameters of the through-holes, and the through-holes pass through the probe supporting plate in a thickness direction of the probe supporting plate. Hollow portions passing through the probe supporting plate in the thickness direction of the probe supporting plate are formed in the probe supporting plate. Each of the hollow portions is formed by connecting each of holes formed in each of the metal plates and each of holes formed in the insulating plate. Diameters of holes of a metal plate that is an uppermost layer, holes of a metal plate that is a lowermost player, and holes of a metal plate that is one of intermediate layers are less than diameters of holes of metal plates 30 | 02-24-2011 |
Jun Mochizuki, Nirasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110006799 | METHOD FOR MANUFACTURING PROBE SUPPORTING PLATE, COMPUTER STORAGE MEDIUM AND PROBE SUPPORTING PLATE - A prescribed pattern is formed on a thin metal plate by photolithography. The thin metal plate is etched by using the pattern as a mask to form a plurality of through-holes having diameters greater than diameters of probes, in the thin metal plate. The etching is performed on a plurality of the thin metal plates. After the pattern is removed, the plurality of thin metal plates are laminated by conforming the through-holes of each of the thin metal plates to guide pins of a guide. The laminated plurality of thin metal plates are bonded by diffusion bonding. An insulating film is formed on surfaces of the thin metal plates and an inner surface of each of the through-holes. A film thickness of the insulating film is adjusted so that inner diameters of the through-holes whereupon the insulating film is formed match with the diameters of the probes. | 01-13-2011 |
Jun Mochizuki, Abiko-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080310891 | IMAGE FORMING APPARATUS - An image forming apparatus that adjusts an inclination angle of a supporting roller for regulating pulling of a belt member serving as an intermediate transfer belt or a recording-material supporting belt. The image forming apparatus changes a method of adjusting an inclination angle of the supporting roller in accordance with a winding angle of the belt member with respect to the supporting roller. | 12-18-2008 |
| 20090269104 | IMAGE FORMING APPARATUS - An image forming apparatus includes first and second rotatable image bearing members, a rotatable belt member which can abut on the first and second image bearing members, a drive mechanism to attach or separate the second image bearing member to or from the belt member, a rotation drive mechanism, and a controller controlling a rotational speed of the second image beating member so that the second image bearing member rotates with a predetermined circumferential speed difference with respect to the belt member at least when image formation is performed by the second image bearing member. When the second image bearing member abuts on or separates from the belt member, the controller controls the rotational speed of the second image bearing member so that a circumferential speed difference between rotational speeds of the second image bearing member and the belt member is smaller than the predetermined circumferential speed difference. | 10-29-2009 |
| 20090304411 | IMAGE FORMING APPARATUS - An image forming apparatus includes a first drive member located downstream of an image bearing member and upstream of a transfer portion and a second drive member located downstream of the transfer portion with respect to a direction of conveying a recording material on a conveyance belt member and configured to apply a driving force to the conveyance belt member. | 12-10-2009 |
| 20110182630 | IMAGE FORMING APPARATUS - An outer diameter of a transfer counter roller is made larger than that of a transfer roller to reduce an electrical discharge phenomenon and influence on a toner image. | 07-28-2011 |
Jun Mochizuki, Nirasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090146673 | Manufacturing method of probe card and the probe card - A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal. | 06-11-2009 |
Jun Mochizuki, Yamanashi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110121846 | CONTACT STRUCTURE FOR INSPECTION - A contact structure for inspection that is installed on a bottom surface of a circuit board includes a ground conductor that is grounded; an elastic contact member that is brought into contact with an inspection target object; and a conductive line that electrically connects the circuit board and the elastic contact member. Here, the elastic contact member may be provided on a bottom surface of the ground conductor that is grounded. The elastic contact member may include an insulating layer, a wiring layer, a contactor and an elastic body provided at a position corresponding to the contactor. The elastic body provides the elastic contact member with elasticity when the contactor is brought into contact with an electrode. The elastic contact member is provided in parallel with the ground conductor. The wiring layer and the ground conductor form a microstrip line. | 05-26-2011 |