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Jun Kawai
Jun Kawai, Anjo-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20080283845 | Silicon carbide semiconductor device having high channel mobility and method for manufacturing the same - A silicon carbide semiconductor device having a MOS structure includes: a substrate; a channel area in the substrate; a first impurity area; a second impurity area; a gate insulating film on the channel area; and a gate on the gate insulating film. The channel area provides an electric current path. The channel area and the gate insulating film have an interface therebetween. The interface includes a dangling bond, which is terminated by a hydrogen atom or a hydroxyl. The interface has a hydrogen concentration equal to or larger than 2.6×10 | 11-20-2008 |
| 20110092063 | Method of manufacturing silicon carbide semiconductor device - In a method of manufacturing a silicon carbide semiconductor device, a semiconductor substrate made of silicon carbide and having first and second opposing surfaces is prepared. The second surface of the semiconductor substrate is processed so that a surface roughness of the second surface is less than or equal to 10 nm and a value of (100%-reflectance-transmittance) at a wavelength of a laser light is greater than or equal to 80%. A metal layer is formed on the second surface of the semiconductor substrate after the processing the second surface. The metal layer is irradiated with the laser light and thereby an ohmic electrode is formed on the second surface. | 04-21-2011 |
Jun Kawai, Saitama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100092210 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an apparatus body that includes an image forming unit forming an image; a switching mechanism that switches a state of members between a contacting state and a non-contacting state, the members related to image formation by the image forming unit in the apparatus body; a covering unit that is supported in the apparatus body so as to be freely opened and closed, and that covers a part of the apparatus body when being closed; and a connection unit that is provided to the covering unit, that is not connected to the switching mechanism when the covering unit is opened while being connected to the switching member when the covering unit is closed, and that causes the switching mechanism to operate in conjunction with an operation by an operator any one of to open and to close the covering unit. | 04-15-2010 |
| 20110064455 | HOUSING DEVICE AND IMAGE-FORMING APPARATUS - A housing device includes: a housing that has an opening and defines a containment space for containing an object inserted through the opening; a guide member that has a longitudinal direction aligned with a direction of insertion of the object with respect to the housing and guides the object when the object is inserted into the containment space; a support structure that supports the guide member to be moveable with respect to the housing in the longitudinal direction; and a cover that opens and closes the opening, wherein when the cover closes the opening, the cover supports the object such that the object is spaced apart from the guide member. | 03-17-2011 |
| 20110064458 | Image-Forming Apparatus - An image-forming apparatus includes: a housing; a first cover attached to the housing; a belt-shaped intermediate transfer body; a rotating member; a support member that contacts an inner surface of the intermediate transfer body at a position opposed to the rotating member to form an image transfer portion where an image is transferred from the intermediate transfer body onto a recording medium; a first supporting unit provided to the housing to support a first end of the support member, a positioning mechanism that determines a position of the first cover relative to the housing when the first cover is closed; and a second supporting unit provided to the first cover to support a second end of the support member, such that a pressure generated between the support member and the rotating member is increased when the first cover is closed than when the first cover is opened. | 03-17-2011 |
Jun Kawai, Saitama JP
| Patent application number | Description | Published |
|---|---|---|
| 20090245850 | IMAGE EXPOSURE APPARATUS, CLEANING DEVICE OF IMAGE EXPOSURE APPARATUS, AND IMAGE FORMING APPARATUS - An image exposure apparatus is provided and includes: an optical unit that emits light to form an exposure image on a photosensitive material; a casing that houses the optical unit and that has an image exposure window through which the light is allowed to pass for forming the exposure image; a transparent dustproof member at the image exposure window; and a shutter member switched between a shield position for covering a region above the dustproof member, which serves as a passage region of a cleaning member for cleaning a surface of the dustproof member, and an open position for allowing the light to pass through the dustproof member to form an exposure image on a surface of the photosensitive material. When the shutter member is located at the shield position, at least a part of the shutter member goes into the passage region of the cleaning member. | 10-01-2009 |
| 20100104312 | POWER FEEDING MECHANISM AND IMAGE FORMING APPARATUS - A power feeding mechanism includes: a power-fed body placed in an apparatus main body, the power-fed body into which power is fed at least when the power-fed body is used; a placement portion where the power-fed body provided in the apparatus main body is placed; a power feed member provided in the apparatus main body and configured to move between a noncontact position and a contact position, the power feed member at the contact position that feeds power into the power-fed body from the apparatus main body; and a move unit that moves the power feed member to at least the two positions. At the noncontact position, the power feed member is noncontact in electric with the power-fed body being placed in the placement portion. At the contact position, the power feed member is contact in electric with the power-fed body being placed in the placement portion. | 04-29-2010 |
Jun Kawai, Otsu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090264865 | INSERTION ASSISTING TOOL FOR CATHETER, CATHETER ASSEMBLY, AND CATHETER SET - An insertion assisting tool inserted into a catheter and positioned ahead of the catheter is provided so as to assist an insertion of the catheter. The insertion assisting tool includes: a distal end portion whose end is tapered and which has a guide wire lumen opening at a tip end and a proximal end of the distal end portion; and a shaft extending from a part of a proximal-end surface of the distal end portion to a proximal end of the insertion assisting tool. | 10-22-2009 |
Jun Kawai, Anjo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110207321 | SEMICONDUCTOR DEVICE MANUFACTURIING METHOD - A method for manufacturing a semiconductor device including a semiconductor substrate composed of silicon carbide, an upper surface electrode which contacts an upper surface of the substrate, and a lower surface electrode which contacts a lower surface of the substrate, the method including steps of: (a) forming an upper surface structure on the upper surface side of the substrate, and (b) forming a lower surface structure on the lower surface side of the substrate. The step (a) comprises steps of: (a1) depositing an upper surface electrode material layer on the upper surface of the substrate, the upper surface electrode material layer being a raw material layer of the upper surface electrode, and (a2) annealing the upper surface electrode material layer. The step (b) comprises steps of: (b1) depositing a lower surface electrode material layer on the lower surface of the substrate, the lower surface electrode material layer being a raw material layer of the lower surface electrode, and (b2) annealing the lower surface electrode material layer with a laser to make an ohmic contact between the lower surface electrode and the substrate. | 08-25-2011 |