| Patent application number | Description | Published |
|---|
| 20090315450 | Organic light emitting display device and method for fabricating the same - An OLED device and a method for fabricating the same are disclosed, capable of improving yield and preventing decomposition of organic layers by moisture. An organic passivation layer having excellent morphology is applied to prevent a short circuit between an anode electrode and a cathode electrode. A Ca layer is applied to remove moisture from the inside of the device, thereby increasing the lifespan of the device. Accordingly, generation of dark sports by the short circuit caused by protrusions on a poor-morphology layer can be prevented. In addition, moisture absorbent layers are formed between the passivation layers and the partitions to remove outside moisture and the moisture outgassed from the inside, that is, partitions and organic layers, thereby elongating the lifespan of the OLED device. | 12-24-2009 |
| 20100134384 | MULTI-PANEL DISPLAY DEVICE AND METHOD OF DRIVING THE SAME - A multi-panel display device and a method of driving the same, which can simplify a driving circuit for driving multiple flat panel display devices, thereby decreasing the fabrication cost and reducing noise., are disclosed. In the multi-panel display device configured of an alignment of multiple flat panel display devices for representing a single image, the multi-panel display device includes at least one image display unit configured of the multiple flat panel display devices aligned in an n×m formation (wherein m and n are integers being equal to or different from one another, and wherein m≦0 and n≦0), and at least one data converter being configured to correspond to each image display unit, dividing externally inputted video data in accordance with offset information inputted by a user, and converting the size of the divided video data, thereby providing the converted divided video data to each flat panel display device. | 06-03-2010 |
| 20100164076 | STACKED SEMICONDUCTOR PACKAGE - A semiconductor package includes a wire board, a plurality of semiconductor chips configured to be stacked over the wire board and to be electrically coupled with the wire board, and at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage. | 07-01-2010 |
| 20100164084 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits. | 07-01-2010 |
| 20100164605 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit is capable of minimizing/decreasing the increase in the inductance of a package due to a power supply network thereof. The semiconductor integrated circuit includes a first power mesh configured to supply a first power to a first internal circuit, a second power mesh configured to supply a second power to a second internal circuit, the first power and the second power being used for different purposes and being equal in DC level, and a connection unit configured to connect the first power mesh to the second power mesh. | 07-01-2010 |
| 20100247906 | HEAT-RESISTANT ADHESIVE SHEET - The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction. | 09-30-2010 |
| 20100279209 | METAL SEPARATOR PLATE FOR A FUEL CELL HAVING A COATING LAYER COMPRISING CARBON PARTICLES DISPERSED IN A BINDER RESIN, AND A PRODUCTION METHOD THEREFOR - Disclosed herein is a method of manufacturing a metallic bipolar plate for fuel cells, which can maintain good corrosion resistance and contact resistance without any side effect not only initially but also after a predetermined period of time even in an environment of severe vibration as in vehicles while allowing a continuous process to provide high productivity. The method includes (a) preparing a metal plate as a matrix of the metallic bipolar plate; (b) pickling a surface of the metal plate; (c) coating a composition comprising a binder resin, carbon particles, and a solvent on the pickled surface of the metal plate; and (d) drying the surface of the metal plate, on which the composition is coated, at a temperature less than a thermal decomposition temperature of the binder resin and greater than or equal to a boiling point of the solvent to form a coating layer on the surface of the metal plate, the coating layer having the carbon particles dispersed in a matrix of the binder resin, wherein these processes are performed as a continuous process. | 11-04-2010 |
| 20110187450 | OUTPUT CIRCUIT OF SEMICONDUCTOR APPARATUS HAVING TWO DIFFERENT TYPES OF DECOUPLING CAPACITORS - An output circuit of a semiconductor apparatus having two different types of decoupling capacitors is presented. The output circuit includes a first pad, a second pad, a main output unit and a decoupling capacitor region. The first and second pads are configured to respectively provide a power supply voltage and a ground voltage. The main output unit is coupled to the first and second pads. One end of the decoupling capacitor region is coupled to the first pad and the other end is coupled to the second pad. The decoupling capacitor region includes a first decoupling capacitor region spaced apart from a portion of the main output unit by a first distance, and a second decoupling capacitor region spaced apart from the main output unit by a second distance which is greater than the first distance. | 08-04-2011 |
