Jui-Hung
Jui-Hung Chang, Hsinchu City TW
Patent application number | Description | Published |
---|---|---|
20110298073 | IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME - Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region. | 12-08-2011 |
20140001590 | IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME | 01-02-2014 |
Jui-Hung Chang US
Patent application number | Description | Published |
---|---|---|
20120155854 | CAMERA MODULE AND METHOD FOR FABRICATING THE SAME - The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer. | 06-21-2012 |
Jui-Hung Chen, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20100105271 | PH Buffering Hybrid Material and the Forming Method Thereof - The present invention discloses a pH buffering hybrid material and the forming method thereof. The pH buffering hybrid material comprises a substrate, a conductive polymer layer on the substrate, and a ZnO nanorod layer produced by deposition of ZnO particles as nucleuses on the conductive polymer layer, and the ZnO particles growing into the ZnO nanorods via hydrothermal reaction. The pH buffering hybrid material has the pH turning ability and the potential of conductivity. | 04-29-2010 |
Jui-Hung Chen, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20120046390 | EPOXY RESIN COMPOSITION - An epoxy resin composition has a glass transition temperature between 20° C. and 75° C. The epoxy resin composition includes an epoxy resin, a plurality of water vapor-proof particles, and at least two kinds of amino-functional curing agents. One of the amino-functional curing agents is a polyamine-type curing agent. The weight percent of the curing agent corresponding to the epoxy resin is between 10% and 95%. | 02-23-2012 |
20150228952 | HEAT-RESISTANT POROUS SEPARATOR AND METHOD FOR MANUFACTURING THE SAME - The present disclosure provides a heat-resistant porous separator including a substrate with a porous structure and a heat-resistant resin layer disposed on one surface of the substrate. The heat-resistant resin layer is consisting of poly(n-vinylacetamide) homopolymer or poly(n-vinylacetamide)/sodium acrylate copolymer. | 08-13-2015 |
Jui-Hung Hsu, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150377942 | ELECTRONIC DEVICE AND TESTING SYSTEM - An electronic device is provided. The electronic device includes a printed circuit board (PCB), an antenna structure, a radio frequency signal transceiving circuit and a testing structure. The antenna structure is disposed on the PCB. The radio frequency signal transceiving circuit is disposed on the PCB, and is connected to the antenna structure through a conductive line. The testing structure includes a testing point and a grounding structure. The testing point is disposed on the conductive line, and the grounding structure is disposed on the PCB. | 12-31-2015 |
Jui-Hung Hsu, Changhua City TW
Patent application number | Description | Published |
---|---|---|
20120148785 | GAS-BARRIER HEAT-SEAL COMPOSITE FILMS AND VACUUM INSULATION PANELS COMPRISING THE SAME - A gas-barrier heat-seal composite film is provided. The gas-barrier heat-seal composite film includes a heat-seal layer including very low density polyethylene (VLDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE), metallocene polyethylene (mPE), metallocene linear low density polyethylene (mLLDPE), ethylene vinyl acetate (EVA) copolymer, ethylene-propylene (EP) copolymer or ethylene-propylene-butene (EPB) terpolymer, and a gas-barrier layer formed on the heat-seal layer, wherein the gas-barrier layer includes a plurality of composite layers, each including a polymer substrate and a single layer or multiple layers of metal or oxide thereof which is formed on one side or both sides of the polymer substrate, and the polymer substrate includes uniaxial-stretched or biaxial-stretched polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyimide (PI), ethylene/vinyl alcohol (EVOH) copolymer or a combination thereof. The invention also provides a vacuum insulation panel including the composite film. | 06-14-2012 |
20130156994 | LOW WATER-VAPOR PERMEABLE COMPOSITE FILM AND PACKAGING STRUCTURE - Provided is a low water-vapor permeable composite film, which includes a 3-layered co-extruded biaxial-oriented film formed of polyester films or polypropylene films including a first layer, a second layer and a third layer stacked in sequence. The first layer further includes an anti-block agent. An alternate structure including a plurality of organic protection layers and a plurality of inorganic layers are formed on the 3-layered co-extruded biaxial-oriented film. The plurality of organic protection layers and the plurality of inorganic layers are stacked alternately. The inorganic layers are formed by atom layer deposition | 06-20-2013 |
20140295196 | COMPOSITE FILM AND MANUFACTURING METHOD OF THE SAME - A composite film and a manufacturing method of the same are provided. The composite film includes an organic multilayer film and two inorganic gas barrier layers. The organic multilayer film comprises a hydrophobic polymer layer and two hydrophilic polymer layers formed on two opposite surfaces of the hydrophobic polymer layer, respectively. The two inorganic gas barrier layers are formed on the two hydrophilic polymer layers, respectively. | 10-02-2014 |
Jui-Hung Huang, Hsinchu City TW
Patent application number | Description | Published |
---|---|---|
20110103144 | STRUCTURES AND METHODS OF TRIMMING THRESHOLD VOLTAGE OF A FLASH EEPROM MEMORY - A method of trimming FET NVM cells in Multi-Level-Cell (MLC) operation is provided. The method comprises (a) applying a first voltage and a second voltage to a control gate and a bulk of the over-programmed FET NVM cell, respectively; and (b) applying a signal to a drain of the over-programmed FET NVM cell for a time period to produce a limited threshold voltage reduction; wherein polarities of the first voltage and the second voltage are opposite to that of the signal. Thus, the charge placement in the storing material could be precisely controlled within a small range of charge state and produce a multi-bits/cell of higher digital storage density. | 05-05-2011 |
20120182811 | METHOD OF ERASING A FLASH EEPROM MEMORY - A method for erasing a flash EEPROM memory device is disclosed. The memory device has a first semiconductor region of one conductivity type formed within a second semiconductor region of an opposite conductivity type, source and drain regions formed from a semiconductor layer of the opposite conductivity type in the first semiconductor region, a well electrode formed from a semiconductor layer of the conductivity type inside the first semiconductor region, a charge storing layer electrically isolated from the first semiconductor region by a dielectric layer and having electric charge retention properties, and a control gate electrode electrically isolated from the charge storing layer by a inter layer of coupling dielectrics. The method comprises the steps of: applying a first voltage bias to both the well electrode and the second semiconductor region and a second bias to the control gate electrode for a duration of F/N tunneling; applying a third voltage bias to the well electrode and the second semiconductor region and a first zero voltage bias to the control gate electrode for a duration of traps depopulation; and, after the duration of traps depopulation, applying a fourth voltage bias to the control gate electrode and a second zero voltage bias to the well electrode and the second semiconductor region for a duration of traps assisted tunneling. | 07-19-2012 |
Jui-Hung Huang, Taipei TW
Patent application number | Description | Published |
---|---|---|
20150266064 | EMBOSSED MICROPOROUS MEMBRANE WIPES AND METHODS OF MANUFACTURE AND USE THEREOF - An embossed porous membrane wipe and/or a method of making and/or using such embossed microporous membrane wipe. The preferred embossed microporous membrane wipe includes a microporous membrane embossed alone or with a polypropylene nonwoven. The nonwoven may be a spunbond, meltblown, and/or electrospun nonwoven. The microporous membrane may include a biaxially oriented microporous membrane. The biaxially oriented microporous membrane may be made from one or more block copolymers of polyethylene and/or polypropylene. A method of using such an embossed microporous membrane, composite or laminate wipe for skin oil blotting is also provided. | 09-24-2015 |
Jui-Hung Liu, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20100156199 | HIGH POWER-DENSITY POWER GENERATING MODULE - A high power-density power generating module, comprising: a magnet unit having a plurality of adjacent magnets with opposite magnet-pole arrangement against adjacent ones, each with a magnetic north pole and a magnetic south pole; and a winding unit having a plurality of adjacent windings around the adjacent magnets; wherein the magnet unit is capable of moving relatively to the winding unit and the angle between the linking direction of the magnetic north pole and the magnetic south pole of each magnet and the winding surface of each winding is larger than 0 degree and smaller than 90 degrees. | 06-24-2010 |
Jui-Hung Shien, Taichung TW
Patent application number | Description | Published |
---|---|---|
20090246229 | Subunit vaccine of pasteurella multocida in veterinary uses - The present invention declaims the use of | 10-01-2009 |
Jui-Hung Shien, Taichung City TW
Patent application number | Description | Published |
---|---|---|
20150307577 | CHEMOKINE-CYTOKINE FUSION PROTEINS AND THEIR APPLICATIONS - The present invention provides a fusion protein, comprising a chemokine polypeptide, which is a chemokine or a receptor binding domain thereof; and a cytokine polypeptide connected to said chemokine polypeptide, which is an interleukin, a TNF-superfamily cytokine or a receptor-binding domain thereof; wherein the chemokine polypeptide and the cytokine polypeptide have a common target cell, and the fusion protein has an improved chemokine activity as compared to the chemokine polypeptide, and an improved cytokine activity as compared to the cytokine polypeptide. | 10-29-2015 |
Jui-Hung Su, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150150365 | INTEGRAL BRUSH WITH NO GAPS BETWEEN CLEANING ASSEMBLY AND HANDLE AND MANUFACTURING PROCESS THEREOF - An integral brush is formed by performing steps of tufts arrangement, tufts insertion into mold, mold turning and closing, and injection molding, thereby forming no gaps between cleaning assembly and handle. The cleaning assembly includes at least one cleaning unit each having a plurality of tufts integrally formed with one of a plurality of bases in the handle. The tufts are spaced apart and an upper portion of each tuft is shaped to form an uneven tip. The brush can increase a contact area between the cleaning assembly and an object so as to effectively clean the object. | 06-04-2015 |
Jui-Hung Wang, Tainan City TW
Patent application number | Description | Published |
---|---|---|
20150293297 | METHOD OF MAKING A LIGHT GUIDE PLATE - A method of making a light guide plate includes: preparing a transparent substrate with a first planar surface and a perforated plate with a second planar surface and perforations; covering the transparent substrate with the perforated plate, such that the perforations expose dot-forming regions of the first planer surface and that the first and second planar surfaces are in intimate contact with each other; applying an ink onto the perforated plate; scraping across the perforated plate to form ink dots on the dot-forming regions, respectively; and removing the perforated plate from the transparent substrate. | 10-15-2015 |
Jui-Hung Weng, Miaoli County TW
Patent application number | Description | Published |
---|---|---|
20090064129 | SUSPEND AND RESUME MECHANISMS ON A FLASH MEMORY - An apparatus for providing a file to a target device comprises a communication controller and a processor. The processor acquires download status indicating that a portion of the file has been successfully programmed in nonvolatile memory of the target device, determines a resuming point of the file according to the acquired download status, and transmits a portion of the file from the determined resuming point to the target device via the communication controller. The portion of file is programmed in the nonvolatile memory of the target device. | 03-05-2009 |
Jui-Hung Yeh, Chong Li City TW
Patent application number | Description | Published |
---|---|---|
20160099393 | USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND ASSEMBLY - LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances. | 04-07-2016 |
Jui-Hung Yeh, Zhongli City TW
Patent application number | Description | Published |
---|---|---|
20120241783 | LED ARRAY - An LED array having N light-emitting diode units (N≧3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer. | 09-27-2012 |
20140054631 | LED ARRAY - An LED array having N light-emitting diode units (N≧3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer. | 02-27-2014 |
20140319574 | LED ARRAY - An LED array having N light-emitting diode units (N≧3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer. | 10-30-2014 |
20160104744 | LED ARRAY - An LED array having N light-emitting diode units (N≧3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer. | 04-14-2016 |
Jui-Hung Yen, Changhua City TW
Patent application number | Description | Published |
---|---|---|
20110080813 | METHODS FOR OVERWITE CYCLE IMPROVEMENT OF OPTICAL STORAGE MEDIUM AND RELATED MACHINE READABLE MEDIA - A method of recording data onto an optical storage medium includes: before starting recording data onto the optical storage medium from an expected link point on the optical storage medium, setting a current recording condition corresponding to the expected link point according to at least one previous recording condition corresponding to the expected link point; and controlling an operation of recording the data onto the optical storage medium according to the current recording condition. | 04-07-2011 |