| Patent application number | Description | Published |
|---|
| 20090020321 | METAL-CERAMIC SUBSTRATE - In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning, an intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate. | 01-22-2009 |
| 20090213547 | Electrical Module - The invention relates to a module with a number of electrical or electronic components or switching circuits provided on a common cooler structure flowed through by a cooling medium. The entire cooler structure is made up of at least two plate-shaped coolers, which are arranged parallel to one another in an interspaced manner and which are flowed through by the cooling medium. | 08-27-2009 |
| 20090232972 | Method for the production of a metal-ceramic substrate - Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer is applied to at least one face of a ceramic substrate or a ceramic layer by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately. | 09-17-2009 |
| 20090272417 | Process for Producing Peltier Modules, and Peltier Module - The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal sure during the production process, are formed by metallic areas. | 11-05-2009 |
| 20100186231 | Method for producing a metal-ceramic substrate for electric circuits on modules - The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type. | 07-29-2010 |
| 20100260988 | Metal-Ceramic Substrate - In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer. | 10-14-2010 |
