| Patent application number | Description | Published |
|---|
| 20080231385 | Oscillator Based on Piezoresistive Resonators - An oscillator circuit has a first and a second piezoresistive resonator ( | 09-25-2008 |
| 20090026882 | OSCILLATOR BASED ON PIEZORESISTIVE RESONATORS - An oscillator circuit is described comprising a piezoresistive resonator and a phase changing devices. Oscillator circuits with piezoresistive resonators do have the advantage that they can perform self-sustaining oscillation without additional active devices as e.g. transistors since they can be used as amplifiers. Phase changing devices as capacitors, coils and further piezoresistive resonator are used in order to compensate the π/2 phase shift of the piezoresistive resonator. | 01-29-2009 |
| 20090057792 | CHARGE BIASED MEM RESONATOR - A resonator has a vibrating element ( | 03-05-2009 |
| 20090211885 | ELECTRONIC DEVICE - The electronic device comprising a micro-electromechanical systems (MEMS) element at a first side of a substrate ( | 08-27-2009 |
| 20100001615 | Reduction of Air Damping in MEMS Device - A micro-electromechanical device has a substrate ( | 01-07-2010 |
| 20100202254 | CMUTS WITH A HIGH-K DIELECTRIC - A capacitive ultrasound transducer includes a first electrode, a second electrode, and a third electrode, the third electrode including a central region disposed in collapsibly spaced relation with the first electrode, and a peripheral region disposed outward of the central region and disposed in collapsibly spaced relation with the second electrode. The transducer further includes a layer of a high dielectric constant material disposed between the third electrode and the first electrode, and between the third electrode and the second electrode. The transducer may be operable in a collapsed mode wherein the peripheral region of the third electrode oscillates relative to the second electrode, and the central region of the third electrode is fully collapsed with respect to the first electrode such that the dielectric layer is sandwiched therebetween. Piezoelectric actuation, such as d31 and d33 mode piezoelectric actuation, may further be included. A medical imaging system includes an array of such capacitive ultrasound transducers disposed on a common substrate. | 08-12-2010 |
| 20110127625 | RESONATOR - A resonator comprising a beam formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator, wherein the ratio of the cross sectional area of the first material to the cross sectional area of the second material varies along the length of the beam, the cross sectional areas being measured substantially perpendicularly to the beam. | 06-02-2011 |
| 20110175178 | MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE - A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed. | 07-21-2011 |
