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Jow, TW
Ane-Li Jow, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090253473 | Wireless transceiver device and wireless headset - A wireless transceiver device includes a wireless transceiver unit, a signal transformer, an audio amplifier and a power supply device. The wireless transceiver unit is used for receiving and transmitting audio signals. The signal transformer is connected to the wireless transceiver unit and used for transforming the audio signals into digital signals or analog signals. The audio amplifier is connected to the signal transformer and used for amplifying and outputting the audio signals into a second audio output device. The power supply device supplies power to the wireless transceiver device. When the wireless transceiver device is being charged or in idle state, it can function as an audio amplifier to drive an external or built-in audio output device. | 10-08-2009 |
Jiin-Cheng Jow, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100046122 | Fault protection device - A fault protection device includes a magnetic capacitor unit and an isolation switch. The magnetic capacitor unit is capable of storing electrical energy, and has a first end and a second end. The isolation switch is capable of being switched on to electrically connect the first end of the magnetic capacitor unit to the second end of the magnetic capacitor unit for forming a short-circuit path between the first and second ends of the magnetic capacitor unit when the magnetic capacitor unit breaks down. | 02-25-2010 |
Jiin-Jiang Jow, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110031128 | Method for measuring an iodine adsorption number of carbon black, electrolytic cell, and kit for measuring an iodine adsorption number of carbon black - A method for measuring an iodine adsorption number of carbon black includes: (a) electrochemically reducing an unknown amount of iodine adsorbed by a predetermined amount of a carbon black sample; (b) measuring the electrical charge used for reducing the unknown amount of the iodine adsorbed by the carbon black sample; and (c) obtaining the iodine adsorption number from the measured electrical charge. An electrolytic cell and a kit for measuring an iodine adsorption number of carbon black are also disclosed. | 02-10-2011 |
Uei-Ming Jow, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100314233 | HIGH-FREQUENCY SWITCH IN MULTI-LAYER SUBSTRATE - A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure. | 12-16-2010 |
Uei-Ming Jow, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090015488 | HIGH DIELECTRIC ANTENNA SUBSTRATE AND ANTENNA THEREOF - A high dielectric antenna substrate includes a first dielectric layer having a first dielectric constant, and a second dielectric layer having a second dielectric constant. The second dielectric layer is formed on one surface of the first dielectric layer. The second dielectric constant is lower than the first dielectric constant. Furthermore, a first metal layer and a second metal layer are optionally formed on the same surface or two surfaces of the first dielectric layer to compose a capacitor. | 01-15-2009 |
| 20090051469 | MULTI-FUNCTIONAL COMPOSITE SUBSTRATE STRUCTURE - A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal. | 02-26-2009 |
| 20100226112 | MIRROR IMAGE SHIELDING STRUCTURE - A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented. | 09-09-2010 |
| 20100259338 | High frequency and wide band impedance matching via - A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces. | 10-14-2010 |
Uei-Ming Jow, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080231402 | INDUCTOR DEVICES - The invention relates to a high frequency inductor device with high quality factor (Q). The inductor device comprises a substrate and a gradually sized conductive coil with a plurality of windings surrounded and disposed on the substrate. The windings comprises a first conductive segment disposed on a first surface of the substrate, a second conductive segment disposed on a second surface of the substrate, a first conductive via hole connecting the first and second conductive segments, and a second conductive via hole connecting the second conductive segment to a first conductive segment of the following winding. The length of the first conductive segment is different than that of the first conductive segment of the following winding | 09-25-2008 |
| 20090183358 | EMBEDDED INDUCTOR DEVICES AND FABRICATION METHODS THEREOF - Embedded inductor devices and fabrication methods thereof. An embedded inductor device includes a substrate, a conductive coil disposed on the substrate, and a patterned high-permeability (μ | 07-23-2009 |