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Jouan
Herve Jouan, Nantes FR
| Patent application number | Description | Published |
|---|---|---|
| 20110030620 | ACCESSORY FOR SUCTION DEVICE PROVIDED WITH COMB AND HAIR-CLEARING MEMBER, AND SUCTION ASSEMBLY INCLUDING THE SAME - An accessory ( | 02-10-2011 |
Mehdi Jouan, Herouville Saint Clair FR
| Patent application number | Description | Published |
|---|---|---|
| 20110145171 | CONVERTING A COMPUTATIONAL FORMULA INTO EXECUTABLE CODE - This method of converting a computational formula having been acquired in the form of a tree structure containing at least one node associated with a parameterized conditional branching operation and connected to at least a first and a second child node, the child node which is associated with the operation which is not executed and the set of nodes which have this child node as parent node being called ‘dead branch’, this method comprising:—the identification and the deletion ( | 06-16-2011 |
Michel Jouan, Rennes FR
| Patent application number | Description | Published |
|---|---|---|
| 20090129687 | Procedure and device for detecting fades in a sequence of images - The invention relates to a method for detecting a fade in a sequence of images which comprises the following steps: | 05-21-2009 |
Pierre Jouan, Cesson Sevigne FR
| Patent application number | Description | Published |
|---|---|---|
| 20080207531 | Novel Milk Protein Fractions and Use Thereof For Preventing or Treating Chronic Inflammatory Diseases - The invention concerns TGF-β-enriched milk protein fractions, a method for preparing same and use thereof for preparing a medicine and/or a food composition for preventing and/or treating chronic inflammatory diseases, and in particular psoriasis. | 08-28-2008 |
Sebastien Jouan, Crolles FR
| Patent application number | Description | Published |
|---|---|---|
| 20080272418 | Semiconductor component comprising a buried mirror - A method for forming a buried mirror in a semiconductor component includes the steps of forming a structure comprising a semiconductor layer laid on an insulating layer covering a substrate; forming one or several openings in the semiconductor layer emerging at the surface of the insulating layer; eliminating a portion of the insulating layer, whereby a recess is formed; forming a second thin insulating layer against the wall of the recess; and forming a metal layer in the recess against the second insulating layer. | 11-06-2008 |
