| Patent application number | Description | Published |
|---|
| 20080210258 | SCRUBBER BOX AND METHODS FOR USING THE SAME - A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes. | 09-04-2008 |
| 20080216863 | METHODS AND APPARATUS FOR MONITORING THE ROTATION OF A SUBSTRATE DURING CLEANING - Systems, methods, and apparatus for monitoring rotation of a substrate during cleaning are disclosed. The invention may include a substrate cleaner adapted to support and clean a substrate; an optical source adapted to provide a light beam having a path within the substrate cleaner; and an optical sensor positioned along the path so as to receive the light beam from the optical source and adapted to detect an orientation feature on the substrate when the orientation feature traverses the path. The optical sensor includes an array of light detectors. Numerous additional aspects are disclosed. | 09-11-2008 |
| 20090004405 | Thermal Batch Reactor with Removable Susceptors - An apparatus and method for uniform heating and gas flow in a batch processing chamber are provided. The apparatus includes a quartz chamber body, removable heater blocks which surround the quartz chamber body, an inject assembly coupled to one side of the quartz chamber body, and a substrate boat having removable susceptors. In one embodiment, the boat may be configured with a plurality of susceptors to control substrate heating during batch processing. | 01-01-2009 |
| 20090025197 | METHODS AND APPARATUS FOR INSTALLING A SCRUBBER BRUSH ON A MANDREL - In a first aspect, an apparatus is provided for forming a scrubber brush assembly. The apparatus includes a mandrel adapted to be inserted into a scrubber brush so as to form a scrubber brush assembly, the mandrel having: a first end; a second end; and one or more position guides adjacent at least one of the first and second ends and adapted to position a scrubber brush on the mandrel. Numerous other aspects are provided. | 01-29-2009 |
| 20090025757 | LID FOR A SEMICONDUCTOR DEVICE PROCESSING APPARATUS AND METHODS FOR USING THE SAME - A method of reducing sticking of a door of a semiconductor device processing apparatus is provided. The method comprises providing rinsing fluid to a lid of a semiconductor devise processing chamber so as to rinse particulates therefrom; and sliding a door that is operatively coupled to the lid so as to move between a closed position wherein the door occludes an opening formed in the lid, and an open position wherein the door does not occlude the opening. Numerous other aspects are provided. | 01-29-2009 |
| 20090031511 | WAFER EDGE CLEANING - In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided. | 02-05-2009 |
| 20090031516 | METHODS AND APPARATUS FOR INSTALLING A SCRUBBER BRUSH ON A MANDREL - In a first aspect, an apparatus is provided for forming a scrubber brush assembly. The apparatus includes a mandrel adapted to be inserted into a scrubber brush so as to form a scrubber brush assembly, the mandrel having: a first end; a second end; and one or more position guides adjacent at least one of the first and second ends and adapted to position a scrubber brush on the mandrel. Numerous other aspects are provided. | 02-05-2009 |
| 20090032071 | LID FOR A SEMICONDUCTOR DEVICE PROCESSING APPARATUS AND METHODS FOR USING THE SAME - A lid for a semiconductor device processing apparatus is provided. The lid comprises a cover having an opening and a wall formed around the opening, the wall adapted to prevent fluid present on the lid from entering a body of the processing apparatus through the opening, and one or more cover edges including one or more edge walls; an outer door adapted to prevent fluid from entering the body of the processing apparatus through the opening of the cover, wherein the outer door interfaces with the wall formed around the opening and the one or more edge walls; and an inner door coupled to the outer door and adapted to prevent fluid from exiting the body of the processing apparatus through the opening of the cover. Numerous other aspects are provided. | 02-05-2009 |
| 20090044831 | WAFER EDGE CLEANING - In a first aspect, a method of cleaning an edge of a wafer is provided. The method comprises providing an edge cleaning roller having a first inclined frictional surface for cleaning an edge corner of a wafer rotating within a first plane; and causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner. Numerous other aspects are provided. | 02-19-2009 |
| 20090078198 | CHAMBER COMPONENTS WITH INCREASED PYROMETRY VISIBILITY - The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature below 500° C. One embodiment of the present invention provides an apparatus for processing semiconductor substrates. The apparatus comprises a target component comprises a material with higher emissivity than the one or more substrates. | 03-26-2009 |
| 20090209112 | MILLISECOND ANNEALING (DSA) EDGE PROTECTION - A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate. | 08-20-2009 |
| 20090314762 | Multi-Zone Resistive Heater - Apparatus, reactors, and methods for heating substrates are disclosed. The apparatus comprises a stage comprising a body and a surface having an area to support a substrate, a shaft coupled to the stage, a first heating element disposed within a central region of the body of the stage, and at least second and third heating elements disposed within the body of the stage, the at least second and third heating elements each partially surrounding the first heating element and wherein the at least second and third heating elements are circumferentially adjacent to each other. | 12-24-2009 |
| 20100021273 | CONCRETE VACUUM CHAMBER - The present invention embodies processing systems and vacuum chambers equipped to process substrates for flat panel displays, solar cells, or other electronic devices. The processing system and/or the vacuum chambers as well as their components and supporting structure are constructed of less costly materials and in a more energy efficient manner than that of current large area substrate processing systems. In one embodiment, the processing system chamber bodies and their supporting structures are constructed of reinforced concrete. In one embodiment, system processing chambers include a vacuum tight lining disposed inside reinforced concrete chamber bodies. | 01-28-2010 |
| 20100078041 | BRUSH BOX CLEANER MODULE WITH FORCE CONTROL - Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry. | 04-01-2010 |
| 20100117309 | SEALING APPARATUS FOR A PROCESS CHAMBER - A sealing apparatus is provided herein. In some embodiments, the sealing apparatus includes an annular body including a first portion having a circular cross-section and a second portion extending radially outward from the first portion, wherein the second portion has a rectangular cross-section. In some embodiments, a sealing apparatus includes a body configured to be retained in a recess of a first surface; an arm extending from the body away from the first surface and configured to provide a force when deflected towards the body by a second surface to form a seal between the first surface and the second surface. | 05-13-2010 |
| 20100173495 | SUBSTRATE PROCESSING APPARATUS USING A BATCH PROCESSING CHAMBER - Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system (e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects due to exposure to a contaminating environment. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence that are performed on the cluster tool. In another embodiment, two or more batch chambers are used to process multiple substrates using one or more of the disproportionately long processing steps in a processing sequence. Aspects of the invention also include an apparatus and method for delivering a precursor to a processing chamber so that a repeatable ALD or CVD deposition process can be performed. | 07-08-2010 |
| 20100273334 | MILLISECOND ANNEALING (DSA) EDGE PROTECTION - A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate. | 10-28-2010 |
| 20100305884 | METHODS FOR DETERMINING THE QUANTITY OF PRECURSOR IN AN AMPOULE - Methods of determining an amount of precursor in an ampoule have been provided herein. In some embodiments, a method for determining an amount of solid precursor in an ampoule may include determining a first pressure in an ampoule having a first volume partially filled with a solid precursor; flowing an amount of a first gas into the ampoule to establish a second pressure in the ampoule; determining a remaining portion of the first volume based on a relationship between the first pressure, the second pressure, and the amount of the first gas flowed into the ampoule; and determining the amount of solid precursor in the ampoule based on the first volume and the remaining portion of the first volume. | 12-02-2010 |
| 20110000433 | PLASMA, UV AND ION/NEUTRAL ASSISTED ALD OR CVD IN A BATCH TOOL - A batch processing chamber includes a chamber housing, a substrate boat for containing a batch of substrates in a process region, and an excitation assembly for exciting species of a processing gas. The excitation assembly is positioned within the chamber housing and may include plasma, UV, or ion assistance. | 01-06-2011 |
| 20110041764 | BATCH PROCESSING PLATFORM FOR ALD AND CVD - A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table. | 02-24-2011 |
| 20110154590 | WAFER EDGE CLEANING - In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided. | 06-30-2011 |
