Patent application number | Description | Published |
20080264563 | Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability - A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or recyclability. An adhesive layer affixes the substrates to each other. A coating that includes a dewetting agent (DA) is interposed between the second substrate and the adhesive layer. Removal is facilitated by applying heat and/or pressure to activate the DA. Preferably, the DA thermally decomposes to form gaseous products at a predefined temperature. Heat may be applied through one or more of the substrates to drive the DA to decomposition, which forms bubbles that lift the first substrate relative to the second substrate. Optionally, the DA may be encapsulated in microspheres. For example, the DA may be silicone oil and/or an adhesive solvent encapsulated in microspheres and may be activated by applying pressure sufficient to crush the microspheres. | 10-30-2008 |
20090078918 | Methods and Structures With Fire Retardant Spheres for Implementing Enhanced Fire Protection - A method and fire retardant structures including fire retardant spheres are provided for implementing enhanced fire protection. A selected first fire retardant material is encapsulated in microspheres. The microspheres have a predefined melting temperature within a defined temperature range. The fire retardant structure is formed of the microspheres encapsulating the selected fire retardant material and included in an article being produced. In response to a fire event, the microspheres rupture or decompose releasing the encapsulated material to provide fire suppression. Alternatively, a fire retardant structure is formed of second microspheres having predefined expansion characteristics. A layer of the second microspheres is disposed between two layers of an article being produced. In response to a thermal fire event, the microspheres expand to fill the space between the layers, providing fire suppression | 03-26-2009 |
20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
20090103266 | COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF - A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one. | 04-23-2009 |
20090176082 | ELECTRICALLY CONDUCTING GASKET, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a gasket comprising a core foam; the core foam is electrically insulating having a surface electrical resistivity of greater than or equal to about 10 | 07-09-2009 |
20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
20100044095 | Via Stub Elimination - An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. This advantageously eliminates the costly and time consuming process of via stub backdrilling. | 02-25-2010 |
20100044096 | Horizontally Split Vias - A mechanism is disclosed for providing horizontally split vias are provided in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×. | 02-25-2010 |
20100212944 | Silane Coupling Agents for Printed Circuit Boards - The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling agent, and PCBs with such coupling agents. The silane coupling agent is defined by the following formula: | 08-26-2010 |
20100243716 | Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers - A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board. | 09-30-2010 |
20110058298 | Detecting and Preventing Overheating in Power Connectors - A method and apparatus directed to detecting and preventing excessive heating in power connectors is disclosed. In one embodiment, a system includes a power connector having an array of pins. A circuit board, such as a midplane of a blade server chassis, has an array of electrical vias passing through the circuit board that are arranged to receive the array of pins and at least one heat flux sensor positioned on one of the vias at the back of the midplane. The heat flux sensor is configured for generating an electrical signal in relation to an applied heat flux. A controller in communication with the heat flux sensor is configured for powering off the electrical power supply in response to the electrical signal reaching a setpoint corresponding to a selected heat flux threshold. | 03-10-2011 |
20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
20110182575 | IMPLEMENTING REDUCED SIGNAL DEGRADATION FOR FIBER OPTIC MODULES - A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed. A fluidic lens provides variable lens shape responsive to the selected voltage potential being applied to the fluidic lens, | 07-28-2011 |
20110189381 | Anti-Corrosion Conformal Coating for Metal Conductors Electrically Connecting an Electronic Component - An apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. A conformal coating overlies the metal conductors and comprises a polymer into which a phosphine compound is impregnated and/or covalently bonded. Accordingly, the conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the phosphine compound in the polymer reacts with any corrosion inducing sulfur component in the air and prevents the sulfur component from reacting with the underlying metal conductors. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide) which would otherwise deplete its availability for the target reaction. The phosphine compound may be rendered completely non-volatile by covalently bonding it directly into the polymer backbone. | 08-04-2011 |
20110214909 | Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards - An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB. | 09-08-2011 |
20110236985 | Early Warning Sulfur Detection Based on Change in Fluorescence Intensity of Polymer-Bound Phosphine Compound - An early warning sulfur detection system for detecting the presence of corrosive gases, especially elemental sulfur (S | 09-29-2011 |
20110239790 | PIEZOELECTRIC CHROMIC IMPACT SENSOR - An impact sensor includes a piezoelectric transducer operatively connected to a chromic device. The chromic device includes a chromic material that changes from a first color state to a second color state in response to electric power generated by the piezoelectric transducer when exposed to a given level of impact force. The chromic material is bistable so that the chromic material remains in the second color state for a significant amount of time. An impact force to which the sensor has been subjected may be quantified by observing the chromic device. In one embodiment, the chromic material is an electrochromic material, such as a viologen, that changes through a color gradient of light transmission states from the first color state to the second color state. A printed color gradient may be used to aid in quantifying the impact force. In another embodiment, the chromic device includes a thermochromic material. | 10-06-2011 |
20110261105 | INDICATION OF PRINT MEDIA QUALITY TO PRINTER USERS - A printing system for indicating print media quality to printer users includes a printing assembly configured to route print media along a pathway for printing. In an example, the system includes, but is not limited to, a thermal printer having a thermal print head for printing onto paper. The system also includes a light meter configured to detect light reflected from the print media, such as the paper. The light meter also measures a characteristic of the detected light. An indicator is coupled to the light meter, and configured to present a quality level of the print media to a user based on the measured characteristic of the detected light. | 10-27-2011 |
20120018666 | METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE - The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. | 01-26-2012 |
20120045955 | Resin Composition Eliminating Volatile Loss of Initiating Species for the Preparation of Printed Circuit Board Laminates - An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin. | 02-23-2012 |
20120105534 | INKJET PRINTING OF MICROFLUIDIC CHANNELS - A mechanism for fabricating microfluidic channels uses a three-dimensional inkjet printing unit to print the channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a hydrophobic material on a surface the substrate in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic material which hydrolyzes to form a hydrophilic material) and a photoacid generator (PAG) on the surface of the substrate in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMMA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. | 05-03-2012 |
20120111660 | IMPLEMENTING DYNAMIC NOISE ELIMINATION WITH ACOUSTIC FRAME DESIGN - A method, system and computer program product are provided for implementing dynamic noise elimination. A system frame includes a plurality of acoustical sensory devices monitoring the system for problem frequencies. The system frame includes a plurality of tubes. When the tube is open, airflow is allowed. When identified tubes are closed, quarter-wavelength attenuation is provided for a frequency in a range of frequencies, based upon a length of the tube when closed. Each of the plurality of tubes is selectively controlled to be operable open or closed at a particular length, responsive to identified problem frequencies. | 05-10-2012 |
20120122342 | IMPLEMENTING IMPEDANCE GRADIENT CONNECTOR FOR BOARD-TO-BOARD APPLICATIONS - A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs. | 05-17-2012 |
20120179388 | SYSTEM, METHOD AND PROGRAM FOR EARLY DETECTION OF FAN FAILURE BY MONITORING GREASE DEGRADATION - A system for predicting a fan failure has a sensor to detect a gas emitted from grease in the fan. A concentration level of the emitted gas is indicative of grease degradation. The system also has circuitry coupled to the sensor to compare the level of the detected gas to a predetermined level. The system also has an alert apparatus coupled to the circuitry to generate an alert after the circuitry determines that the level of the detected gas exceeds the predetermined level. | 07-12-2012 |
20120182693 | REVERSIBLY ADHESIVE THERMAL INTERFACE MATERIAL - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 07-19-2012 |
20120187046 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 07-26-2012 |
20120208380 | CONTACT RELIABILITY IN SEPARABLE ELECTRICAL INTERFACES - A separable electrical interface is provided, the interface having a circuit card having one or more electrically conductive card edge tabs. Each of the card edge tabs has a raised, curved top surface profile. The separable electrical interface also includes one or more connector contacts. Each of the one or more connector contacts has a curved surface profile. The curved surface of each of the one or more connector contacts is positioned relative to a corresponding card edge tab to selectively engage the raised curved surface of the corresponding card edge tab at the point of final contact. | 08-16-2012 |
20120211273 | VIA STUB ELIMINATION - An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. | 08-23-2012 |
20120214247 | Early Warning Sulfur Detection Based on Change in Fluorescence Intensity of Polymer-Bound Phosphine Compound - An early warning sulfur detection system for detecting the presence of corrosive gases, especially elemental sulfur (S | 08-23-2012 |
20120217987 | NON-DESTRUCTIVE DETERMINATION OF THE MOISTURE CONTENT IN AN ELECTRONIC CIRCUIT BOARD USING COMPARISON OF CAPACITANCE MEASUREMENTS ACQUIRED FROM TEST COUPONS, AND DESIGN STRUCTURE/PROCESS THEREFOR - Two test coupons are utilized in an apparatus, method and design process/structure for determining the moisture content in an electronic circuit board (e.g., a printed circuit board (PCB) or panel). The first coupon has a laminate stack-up with voltage planes separated from each other by dielectric material. These voltage planes include etched clearances with neither plated through holes (PTHs) nor drilled holes extending therethrough. The second coupon is substantially identical to the first coupon except that each of the voltage planes of the first coupon includes PTHs extending through etched clearances corresponding to the etched clearances of the first coupon. In one embodiment, an alarm indicating unacceptably high moisture content is generated if a delta capacitance calculated as a difference between capacitance measurements acquired from the respective coupons is greater than a threshold. Preferably, the alarm notifies a user that at least one aqueous process related to PTH formation is implicated. | 08-30-2012 |
20120261064 | THERMALLY REVERSIBLE CROSSLINKED POLYMER MODIFIED PARTICLES AND METHODS FOR MAKING THE SAME - Thermal insulating materials and methods of making the thermal insulating material generally include a plurality of thermally reversible crosslinked polymer modified particles. The thermally reversible crosslinked polymer modified particles include a polymer containing a plurality of a first functional group; and a modified particle having a plurality of pendent cross-linking agents containing a second functional group, wherein the first functional group and the second functional group are complementary reactants to a reversible cross-linking reaction. | 10-18-2012 |
20120279768 | Flame Retardant Filler - A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles. | 11-08-2012 |
20120312589 | Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination - An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs. | 12-13-2012 |
20120327612 | CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads. | 12-27-2012 |
20130003295 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130003296 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130008183 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130010422 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130014977 | Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed LaminateAANM Chamberlin; Bruce JohnAACI VestalAAST NYAACO USAAGP Chamberlin; Bruce John Vestal NY USAANM Chu; Chang-MinAACI TaipeiAACO TWAAGP Chu; Chang-Min Taipei TWAANM Hu; Gao-BinAACI ShenZhenAACO CNAAGP Hu; Gao-Bin ShenZhen CNAANM Kuczynski; JosephAACI RochesterAAST MNAACO USAAGP Kuczynski; Joseph Rochester MN USAANM Tsang; Kaspar Ka ChungAACI Tung ChungAACO HKAAGP Tsang; Kaspar Ka Chung Tung Chung HK - An approach is provided in detecting plated-through hole defects in printed circuit boards (PCBs). The printed circuit board is exposed to a modified-silane solution. The modified-silane solution has a luminescent moiety and the modified-silane solution binds to exposed glass within a glass fiber layer of the printed circuit board. Plated-through hole defects are identified in the printed circuit board by detecting a luminescence at a surface location of the printed circuit board. Each surface location where the luminescence is detected corresponds to one of the plated-through hole defects. | 01-17-2013 |
20130016465 | Plated Through Hole Void Detection in Printed Circuit Boards by Detecting A pH-Sensitive ComponentAANM Chamberlin; Bruce JohnAACI VestalAAST NYAACO USAAGP Chamberlin; Bruce John Vestal NY USAANM Chu; Chang-MinAACI TaipeiAACO TWAAGP Chu; Chang-Min Taipei TWAANM Hu; Gao-BinAACI ShenZhenAACO CNAAGP Hu; Gao-Bin ShenZhen CNAANM Kuczynski; JosephAACI RochesterAAST MNAACO USAAGP Kuczynski; Joseph Rochester MN USAANM Tsang; Kaspar Ka ChungAACI Tung ChungAACO HKAAGP Tsang; Kaspar Ka Chung Tung Chung HK - An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect. | 01-17-2013 |
20130016472 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-17-2013 |
20130020716 | SYSTEM AND METHOD TO PROCESS HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN A THERMAL INTERFACE MATERIAL USED IN 3D CHIP STACKS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. | 01-24-2013 |
20130034739 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD TO ENABLE EASY REMOVAL OF ONE SUBSTRATE FROM ANOTHER FOR ENHANCED REWORKABILITY - An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and/or swells the TIM gap filler, thereby reducing the bond strength between the substrates. | 02-07-2013 |
20130045612 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 02-21-2013 |
20130052409 | PREVENTING CONDUCTIVE ANODIC FILAMENT (CAF) FORMATION BY SEALING DISCONTINUITIES IN GLASS FIBER BUNDLES - An enhanced substrate for making a printed circuit board (PCB) includes a silane applied to the ends of glass fibers in via holes. In one embodiment, during a plated through-hole (PTH) via fabrication process, glass fiber bundles exposed in a drilled through-hole are selectively sealed. For example, after the through-hole is drilled in a substrate, the substrate may be subjected to an aqueous silane bath (e.g., an organo trialkoxysilane in an aqueous solution of an acid that acts as a catalyst) to deposit a layer of silane on the exposed glass fiber bundle ends. For example, trialkoxy groups of the silane may react with exposed silanols on the glass to form a siloxane, which is further polymerized to form a silane polymer barrier layer on the exposed glass fiber ends. The barrier layer effectively seals the glass fiber bundles and eliminates the conductive anodic filament (CAF) pathway between PTH vias. | 02-28-2013 |
20130057634 | INDICATION OF PRINT MEDIA QUALITY TO PRINTER USERS - A printing system for indicating print media quality to printer users includes a printing assembly configured to route print media along a pathway for printing. In an example, the system includes, but is not limited to, a thermal printer having a thermal print head for printing onto paper. The system also includes a light meter configured to detect light reflected from the print media, such as the paper. The light meter also measures a characteristic of the detected light. An indicator is coupled to the light meter, and configured to present a quality level of the print media to a user based on the measured characteristic of the detected light. | 03-07-2013 |
20130061401 | PROCESS FOR TREATING WOVEN GLASS CLOTH - A solvent wash employing a polar washing solvent is employed to effectively remove the sizing agent on a woven glass cloth, while retaining the tensile strength of the woven glass cloth. Loss of tensile strength of the woven glass cloth due to removal of a sizing agent from the woven glass cloth is compensated by simultaneous or subsequent deposition of a coupling agent on surfaces from which the sizing agent is removed. The concurrent removal of the sizing agent and deposition of the coupling agent provides an effective removal of the sizing agent while maintaining sufficient tensile strength to structurally support the woven glass cloth. Further, integration of the removal of the sizing agent and the simultaneous deposition of the coupling agent in the washing solvent in a same processing step can provide a cost-effective manufacturing method for forming a finished woven glass cloth. | 03-14-2013 |
20130089602 | ENCAPSULATED CHELATOR - An enhanced chelator includes a chelating agent and a volatile material encapsulated in a biologically benign microcapsule. The enhanced chelator possesses significantly improved shelf-life in aqueous biological buffer solutions because the chelating agent is encapsulated in the microcapsule and, therefore, separated from solution components with which the chelating agent would react. The enhanced chelator is activated at a predetermined elevated temperature defined by the boiling point of the volatile material. At this predetermined elevated temperature, the volatile material exerts a vapor pressure sufficient to rupture the microcapsule and thereby release the chelating agent from the microcapsule. In one embodiment, a manganese chelator such as ethylene glycol tetraacetic acid (EGTA) is solubilized in ethanol and encapsulated in a poly(lactic-co-glycolide) (PLGA) microsphere. Upon heating to 80° C., ethanol boils within the PLGA microsphere and undergoes several orders of magnitude volume change, thereby rupturing the PLGA microsphere and releasing EGTA. | 04-11-2013 |
20130109565 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD | 05-02-2013 |
20130127069 | MATRICES FOR RAPID ALIGNMENT OF GRAPHITIC STRUCTURES FOR STACKED CHIP COOLING APPLICATIONS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip and a second chip electrically and mechanically coupled by a grid of connectors. The chip stack includes a thermal interface material (TIM) between the first chip and the second chip. The TIM includes nanofibers aligned parallel to mating surfaces of the first and second chips, and a thermosetting polymer that when heated, will reduce the viscosity of the TIM to allow for optimal alignment of the carbon nanofibers. The method includes adding at least one thermosetting polymer to the TIM, dispersing nanofibers into the TIM, and heating the TIM until the thermosetting polymer un-crosslinks. The method further includes applying a magnetic field to align the graphite nanofibers and cooling the TIM until the thermosetting polymer re-crosslinks. | 05-23-2013 |
20130130515 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 05-23-2013 |
20130140727 | VISUAL INDICATION OF IMPROPERLY PROCESSED PLASTIC PARTS - a method comprising injection molding a plastic part from a polymer formulation comprising an injection moldable thermoplastic and an additive, wherein the additive has a decomposition temperature that establishes a maximum processing temperature for the polymer formulation. The additive will thermally decompose to generate gaseous products causing visible bubble formation in the surface of the plastic part in response to exposure to a processing temperature that exceeds the decomposition temperature of the additive. A suitable additive may be, for example, selected from oxalates, carbamic acids, carbonic acids, diazocarbonyl compounds, and combinations thereof. | 06-06-2013 |
20130143993 | INDICATION OF IMPROPERLY MOLDED PARTS - A method of determining that a thermoplastic was insufficiently dried before forming into a molded plastic part. The method comprises preparing a mixture of a thermoplastic polymer and an off-gassing compound, wherein the off-gassing compound is selected to release all water of hydration in response to target drying conditions specified for the thermoplastic polymer. The mixture is dried at actual drying conditions, and then heated to reduce the viscosity of the thermoplastic polymer and allow the mixture to flow. The mixture is then made to flow into a mold to form a plastic part at a molding temperature, wherein the molding temperature will cause any remaining water of hydration in the off-gas sing compound to off-gas and form surface irregularities in the plastic part. Non-limiting examples of the off-gassing compound include hydrated metal halides and ionic hydrates. | 06-06-2013 |
20130154058 | HIGH SURFACE AREA FILLER FOR USE IN CONFORMAL COATING COMPOSITIONS - A high surface area filler, a conformal coating composition, and an apparatus. The high surface area filler comprises an amorphous silicon dioxide powder and a phosphine compound bonded to the amorphous silicon dioxide powder. The conformal coating composition comprises a conformal coating and the high surface area filler. The apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. The conformal coating composition overlies the metal conductors and comprises a conformal coating and the high surface area filler. Accordingly, the conformal coating composition is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. | 06-20-2013 |
20130179996 | IIMPLEMENTING DATA THEFT PREVENTION - A method and circuit for implementing data theft prevention, and a design structure on which the subject circuit resides are provided. A polymeric resin containing microcapsules surrounds a security card. Each microcapsule contains a conductive material. The conductive material of the microcapsule provides shorting on the security card responsive to the polymer resin and the microcapsule being breached, and a data theft prevention function using the shorting by the conductive material to prevent data theft. | 07-11-2013 |
20130180271 | CONDUCTIVE DUST DECTECTION - An apparatus is provided, which includes a dust detector, a voltage source, and a controller. The dust detector includes two opposing surfaces and a conductive dust sensor. The two opposing surfaces are disposed in spaced, opposing relation to allow for the passage of airflow between the surfaces, and the conductive dust sensor is disposed at a surface of the two opposing surfaces. The voltage source is configured and controlled to establish an electrostatic field at least partially between the two opposing surfaces to facilitate directing conductive particles in the airflow passing between the two opposing surfaces towards the dust sensor. The controller monitors for a leakage current within the conductive dust sensor and determines whether the leakage current exceeds a predetermined trigger level indicative of the presence of conductive dust, and if so, automatically indicates a conductive dust warning. | 07-18-2013 |
20130187706 | TAMPER RESISTANT ELECTRONIC SYSTEM UTILIZING ACCEPTABLE TAMPER THRESHOLD COUNT - A tamper resistant electronic device includes multiple eFuses that are individually blown in each instance the electronic device is tampered with. For example an eFuse is blown when the electronic device is subjected to a temperature that causes solder reflow. Since it is anticipated that the electronic device may be tampered with in an acceptable way and/or an acceptable number of instances, functionality of the electronic device is altered or disabled only after a threshold number of eFuses are blown. In certain implementations, the threshold number is the number of anticipated acceptable tamper events. Upon a tamper event an individual eFuse is blown. If the total number of blown eFuses is less than the threshold, a next eFuse is enabled so that it may be blown upon a next tamper event. | 07-25-2013 |
20130192739 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 08-01-2013 |
20130206463 | NON-HALOGENATED FLAME RETARDANT FILLER - A non-halogenated flame retardant filler having phosphorous-modified inorganic particles imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. Phosphorous-modified silica particles, for example, may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a non-halogenated flame retardant filler comprised of phosphorous-modified silica particles. In an exemplary method of synthesizing phosphorous-modified silica particles, a vinyl-terminated phosphorous-based monomer (e.g., a phosphorous based flame retardant functionalized to contain a vinyl functional group) is reacted with vinyl functionalized silica particles (i.e., the silica particle surface is functionalized to contain a vinyl functional group). Alternatively, hydrosilated terminated silica particles may be reacted with a vinyl-terminated phosphorous-based monomer to produce phosphorous-modified silica particles. | 08-15-2013 |
20130213707 | ANTI-CORROSION CONFORMAL COATING COMPRISING MODIFIED POROUS SILICA FILLERS FOR METAL CONDUCTORS ELECTRICALLY CONNECTING AN ELECTRONIC COMPONENT - A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring. | 08-22-2013 |
20130232587 | IMPLEMENTING CARBON NANOTUBE BASED SENSORS FOR CRYPTOGRAPHIC APPLICATIONS - A method and circuit for implementing security protection with carbon nanotube based sensors for cryptographic applications, and a design structure on which the subject circuit resides are provided. A carbon nanotube layer is incorporated with a polymeric encapsulation layer of a security card. Electrical connections to the carbon nanotube layer are provided for electrical monitoring of electrical resistance of the carbon nanotube layer. | 09-05-2013 |
20130240250 | CIRCUIT APPARATUS HAVING A ROUNDED DIFFERENTIAL PAIR TRACE - A first artwork layer having a first adaptable-mask section allows a graded amount of light to pass into an underlying first photoresist layer. Subsequent to developing the first photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least a lower portion of a rounded trace. A dielectric layer is laminated upon the lower portion and a second artwork layer having an second adaptable-mask section allows a graded amount of light to pass into a second photoresist layer. Subsequent to developing the second photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least an upper portion of a rounded trace. The photoresist and dielectric layers are removed resulting in a circuit apparatus having a rounded differential pair trace. | 09-19-2013 |
20130252456 | Securing a Field Replaceable Unit - An assembly may have first and second components. The first component may include a first electrical connector and a guide member. The second component may include a second electrical connector to couple with the first electrical connector, and a receptacle to receive the guide member in a mated position. An adhesive may be provided between the guide member and the receptacle to form a bond between the guide member and the receptacle. The bond may be reversed when the adhesive is heated above a threshold temperature. A heating element to heat the adhesive may be provided. | 09-26-2013 |
20130263736 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 10-10-2013 |
20130280417 | Hydrophobic Silane Coating for Preventing Conductive Anodic Filament (CAF) Growth in Printed Circuit Boards - An enhanced substrate for making a printed circuit board (PCB) includes a hydrophobic silane coating of a silane composition intermixed with a silane coupling agent applied to a glass fiber substrate. The silane coupling agent is applied to the surface of the substrate for coupling the substrate to a varnish coating. Applying the silane coupling agent to the surface of the substrate creates surface silanols, which are implicated in conductive anodic filament (CAF) growth. A silane composition, which reacts with the surface silanols, is applied to the surface of the substrate having the silane coupling agent applied thereto to form the hydrophobic silane coating. The surface presented by the hydrophobic silane coating/substrate is hydrophobic and essentially silanol-free. This surface is then dried, and varnish is applied thereto. Then, the substrate, hydrophobic silane coating and varnish are subjected to curing conditions to define the PCB. | 10-24-2013 |
20130291369 | FLEXIBLE-TO-RIGID TUBING - A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIL) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat. | 11-07-2013 |
20130324639 | Self-Healing Material with Orthogonally Functional Capsules - A self-healing capsule may contain a self-healing agent, a polymer shell encapsulating the self-healing agent, and at least one functional group orthogonal to the surface of the polymer shell. This self-healing capsule may be covalently bonded into a polymeric material by the orthogonal functional group. The self-healing capsules may be formed through microencapsulation. | 12-05-2013 |
20130333199 | FLUORESCENT COMPOUNDS FOR DETECTING USE OF PROPER PLASTIC MOLDING TEMPERATURES - A method comprising injection molding a plastic part from a polymer formulation comprising an injection moldable thermoplastic and a fluorescent compound, wherein the fluorescent compound has a decomposition temperature that establishes a maximum processing temperature for the polymer formulation. The fluorescent compound will thermally decompose to generate gaseous products causing visible bubble formation in the surface of the plastic part in response to exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound. If the plastic part was processed without exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound, then any fluorescent compound within the plastic part will cause the plastic part to fluoresce in response to exposure to black light. A suitable fluorescent compound may be, for example, selected from oxalates, carbamic acids, carbonic acids, diazocarbonyl compounds, and combinations thereof. A preferred fluorescent compound is bis(2,4,6-trichlorophenyl)oxalate. | 12-19-2013 |
20130337273 | THERMAL INTERFACE MATERIAL (TIM) WITH THERMALLY CONDUCTIVE INTEGRATED RELEASE LAYER - A thermal interface material (TIM) includes a modified release layer having an organosilane-coated surface covalently bound to a TIM formulation layer. The modified release layer may be formed by applying an organosilane (e.g., vinyltriethoxysilane) to the surface of a thermally conductive release layer (e.g., aluminum foil). The organosilane reacts with hydroxyl groups on the surface of the thermally conductive release layer. The TIM formulation layer may be formed by applying a TIM formulation (e.g., a graphite TIM formulation) containing an unsaturated monomer (e.g., methyl acrylate) to the organosilane-coated surface of the modified release layer, and then curing the TIM formulation so that the unsaturated monomer of the TIM formulation reacts with the organosilane-coated surface of the modified release layer. | 12-19-2013 |
20130338280 | Flame Retardant Material with Orthogonally Functional Capsules - A flame retardant capsule may contain a flame retardant, a polymer shell encapsulating the flame retardant, and at least one functional group orthogonal to the surface of the polymer shell. This flame retardant capsule may be covalently bonded into a polymeric material by the orthogonal functional group. The flame retardant capsules may be formed through microencapsulation. | 12-19-2013 |
20140000955 | Conformal Coating Capable of Scavenging a Corrosive Agent | 01-02-2014 |
20140034375 | PREVENTING THE FORMATION OF CONDUCTIVE ANODIC FILAMENTS IN A PRINTED CIRCUIT BOARD - A conductive via and method of forming a conductive via in a multilayer printed circuit board are disclosed. A hole is drilled into a printed circuit board that is reinforced with glass fibers, wherein the hole extends between two conductive elements on different layers of the printed circuit board and cuts through a portion of the glass fibers. A tungsten nitride layer is then deposited on the walls of the hole, wherein the tungsten nitride layer has a thickness between 1.5 nanometers and 20 nanometers. A copper layer is deposited over the tungsten nitride layer, wherein the copper and tungsten nitride form a conductive via that provides an electrically conductive pathway between the two conductive elements, and wherein the tungsten nitride layer isolates the copper layer from the glass fibers. | 02-06-2014 |
20140035278 | IIMPLEMENTING INTERFACE FREE HOSE-TO-BARB CONNECTION - A method and structures are provided for implementing hose-to-barb connections for water cooling hoses. The water cooling hose is assembled with a barbed fitting to create an interface free joint between a hose material and the barbed fitting. The hose material contains microcapsules which contain a catalyst and/or a combination of microcapsules which contain monomer and catalyst in separate microcapsules that promote polymerization when ruptured. The hose material contains functional groups that can be polymerized with a functionality that is contained on the hose surface. This process creates a secure interface free covalent bond, thus preventing leaks from occurring. | 02-06-2014 |
20140041908 | FLAME RETARDANT FILLERS PREPARED FROM BRIDGED POLYSILSESQUIOXANES - A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler. | 02-13-2014 |
20140070393 | HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip | 03-13-2014 |
20140072777 | THERMALLY CROSS-LINKABLE PHOTO-HYDROLYZABLE INKJET PRINTABLE POLYMERS FOR MICROFLUIDIC CHANNELS - Thermally cross-linkable photo-hydrolyzable inkjet printable polymers are used to print microfluidic channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a mixture of hydrophobic polymer and cross-linking agent in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic polymer which hydrolyzes to form a hydrophilic material), cross-linking agent, and a photoacid generator (PAG) in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMAA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. The cross-linking agent (e.g., triallyl isocyanurate TAIC) forms covalent cross-links between the two polymer phases. | 03-13-2014 |
20140076524 | MULTILAYER HOSE WITH LEAK PREVENTATIVE INTERFACIAL LAYER CONTAINING SUPER ABSORBENT POLYMER (SAP) - A multilayer hose is provided with a leak preventative interfacial layer that includes a super absorbent polymer (SAP) interposed between an inner layer and an outer layer. In one embodiment, the inner and outer layers are made of ethylene propylene diene monomer (M-class) (EPDM) rubber, and the interfacial layer is covalently bonded to the inner layer (and, optionally, to the outer layer) via a curing reaction between the EPDM rubber of at least the inner layer and a vinyl functionalized reaction product of alginic acid and acryloyl chloride of the interfacial layer. In addition, a reinforcement layer (e.g., textile filaments braided, knitted, or spirally wound onto the interfacial layer) is disposed between the inner and outer layers. In some embodiments, one or more SAP-equipped multilayer hoses interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of an apparatus that removes heat from electronic components. | 03-20-2014 |
20140143881 | IMPLEMENTING CONDUCTIVE MICROCAPSULE RUPTURE TO GENERATE A TAMPER EVENT FOR DATA THEFT PREVENTION - A method and circuit for implementing conductive microcapsule rupture to generate a tamper event for data theft prevention, and a design structure on which the subject circuit resides are provided. A polymeric resin containing microcapsules surrounds a security card and a tamper sensor device provided with the securing card. Each microcapsule contains a conductive material. The conductive material of the microcapsule disperses onto the tamper sensor device on the security card responsive to the microcapsule being ruptured to create a change in resistance, reducing the resistance of a security mesh of the tamper sensor device. The microcapsules are more sensitive to pressure than a tamper mesh of the tamper sensor device and therefore rupture first, creating the change in resistance when dispersed onto the tamper sensor device. The resistance change is detected by the tamper sensor device and the security card is disabled to prevent data theft. | 05-22-2014 |
20140145094 | CARBON NANOTUBES WITH FLUORESCENT SURFACTANT - A fluorescent material may include a medium, carbon nanotubes dispersed in the medium, and a fluorescent surfactant. The fluorescent surfactant may be adsorbed to a surface of some of the carbon nanotubes in a concentration sufficient to make the material fluoresce in the presence of radiation. The material may be applied to a material and tested for fluorescence, electrical conductivity, or carbon nanotube structure. | 05-29-2014 |
20140191841 | CONFORMAL COATING TO SCAVENGE ELEMENTAL SULFUR - A corrosion-resistant apparatus may contain an electronic component having a first metal and a polymer coating covering the electronic component. The polymer coating includes polymer chains with unsaturated groups to scavenge sulfur and an anionic initiator dispersed in the polymer coating to convert cyclic elemental sulfur to linear polysulfide. | 07-10-2014 |
20140194616 | FLAME RETARDANT CELLULOSE ACETATE - Flame retardant cellulose acetate is prepared comprising cellulose acetate flakes and an organophosphate compound bonded to the cellulose acetate flakes. Accordingly, the bonded phosphate-functional group provides the cellulose acetate flakes with pendant phosphate ester functionality. Numerous phosphate derivatives can be envisaged that will accomplish the intended task. | 07-10-2014 |
20140194617 | FLAME RETARDANT CELLULOSE - Flame retardant cellulose is prepared comprising cellulose fibers and an organophosphate compound bonded to the cellulose fibers. Accordingly, the bonded phosphate-functional group provides the cellulose fibers with pendant phosphate ester functionality. Numerous phosphate derivatives can be envisaged that will accomplish the intended task. | 07-10-2014 |
20140202573 | IMPLEMENTING PRE-TREATMENT OF WATER COOLING HOSES TO INCREASE RELIABILITY - Pre-treated water cooling hoses and a method for implementing pretreatment of water cooling hoses for increased reliability are provided. Pretreatment of the water cooling hoses includes attaching the water cooling hose to a water cooling system, filling the water cooling system with a high concentration corrosion inhibitor solution, and running the system for an extended time to saturate the attached hose with the high concentration corrosion inhibitor. | 07-24-2014 |
20140205232 | IMPLEMENTING EMBEDDED HYBRID ELECTRICAL-OPTICAL PCB CONSTRUCT - Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer. | 07-24-2014 |
20140210068 | HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN ETCHED SILICON WAFER TROUGHS FOR ENHANCED THERMAL PERFORMANCE - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad. | 07-31-2014 |
20140210136 | BINDING BISPHENOL A IN A POLYCARBONATE CONTAINER - Embodiments of the disclosure provide a method for removing residual BPA from a residual BPA-containing substance and a method for making a container with residual BPA removed. The method may consist of preparing a stabilization reagent, wherein water is removed from the stabilization reagent. The method may also include preparing the residual BPA-containing substance. The method may also include reacting the residual BPA-containing substance in a melt condensation process with the stabilization reagent, wherein the stabilization reagent is non-toxic. | 07-31-2014 |
20140217574 | COMPOSITES COMPRISED OF ALIGNED CARBON FIBERS IN CHAIN-ALIGNED POLYMER BINDER - A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The method includes adding a thermosetting polymer to the thermal interface material, dispersing a plurality of nanofibers into the thermal interface material, and un-crosslinking the thermosetting polymer in the thermal interface material. The method further includes extruding the thermal interface material through a die to orient the conductive axis of the nanofibers and polymer chains in the desired direction, and re-crosslinking the thermosetting polymer in the thermal interface material. The chip stack includes a first chip with circuitry on a first side, a second chip coupled to the first chip by a grid of connectors, and a thermal interface material pad between the chips. The thermal interface includes nanofibers and a polymer that allows for optimal alignment of the nanofibers and polymer chains. | 08-07-2014 |
20140242349 | METHOD AND SYSTEM FOR ALLIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE - The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface. | 08-28-2014 |
20140262192 | THERMALLY REVERSIBLE THERMAL INTERFACE MATERIALS WITH IMPROVED MOISTURE RESISTANCE - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 09-18-2014 |
20140273614 | ELECTRICAL CONNECTORS WITH ENCAPSULATED CORROSION INHIBITOR - According to embodiments of the invention, an electrical connector structure with an encapsulated corrosion inhibitor may be provided. The structure may include a first electrical connector having a first contact surface. The structure may also include an encapsulated corrosion inhibitor applied to at least a portion of the first contact surface. | 09-18-2014 |
20150030402 | IMPLEMENTING REDUCED DRILL SMEAR - A method is provided for implementing reduction of drill smear in drilling a multilayer substrate such as a rigid printed circuit board or flex to minimize or eliminate the need to remove drill smear and for improved via and interconnect reliability. An inert liquid is applied to the multilayer substrate and a drill bit prior to and during the drill process to cool and lubricate the multilayer substrate and the drill bit to reduce drill smear. | 01-29-2015 |
20150048154 | DETECTING WATER INTRUSION IN ELECTRONIC DEVICES - A device includes a device casing and a water-soluble circuit located within the device casing. An identification code is encoded on the circuit. The identification code is associated with the device. | 02-19-2015 |
20150061712 | IMPLEMENTING LOW TEMPERATURE WAFER TEST - A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed. | 03-05-2015 |