| Patent application number | Description | Published |
|---|
| 20080264563 | Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability - A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or recyclability. An adhesive layer affixes the substrates to each other. A coating that includes a dewetting agent (DA) is interposed between the second substrate and the adhesive layer. Removal is facilitated by applying heat and/or pressure to activate the DA. Preferably, the DA thermally decomposes to form gaseous products at a predefined temperature. Heat may be applied through one or more of the substrates to drive the DA to decomposition, which forms bubbles that lift the first substrate relative to the second substrate. Optionally, the DA may be encapsulated in microspheres. For example, the DA may be silicone oil and/or an adhesive solvent encapsulated in microspheres and may be activated by applying pressure sufficient to crush the microspheres. | 10-30-2008 |
| 20090078918 | Methods and Structures With Fire Retardant Spheres for Implementing Enhanced Fire Protection - A method and fire retardant structures including fire retardant spheres are provided for implementing enhanced fire protection. A selected first fire retardant material is encapsulated in microspheres. The microspheres have a predefined melting temperature within a defined temperature range. The fire retardant structure is formed of the microspheres encapsulating the selected fire retardant material and included in an article being produced. In response to a fire event, the microspheres rupture or decompose releasing the encapsulated material to provide fire suppression. Alternatively, a fire retardant structure is formed of second microspheres having predefined expansion characteristics. A layer of the second microspheres is disposed between two layers of an article being produced. In response to a thermal fire event, the microspheres expand to fill the space between the layers, providing fire suppression | 03-26-2009 |
| 20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
| 20090103266 | COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF - A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one. | 04-23-2009 |
| 20090176082 | ELECTRICALLY CONDUCTING GASKET, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is a gasket comprising a core foam; the core foam is electrically insulating having a surface electrical resistivity of greater than or equal to about 10 | 07-09-2009 |
| 20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
| 20100044095 | Via Stub Elimination - An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. This advantageously eliminates the costly and time consuming process of via stub backdrilling. | 02-25-2010 |
| 20100044096 | Horizontally Split Vias - A mechanism is disclosed for providing horizontally split vias are provided in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×. | 02-25-2010 |
| 20100212944 | Silane Coupling Agents for Printed Circuit Boards - The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling agent, and PCBs with such coupling agents. The silane coupling agent is defined by the following formula: | 08-26-2010 |
| 20100243716 | Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers - A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board. | 09-30-2010 |
| 20110058298 | Detecting and Preventing Overheating in Power Connectors - A method and apparatus directed to detecting and preventing excessive heating in power connectors is disclosed. In one embodiment, a system includes a power connector having an array of pins. A circuit board, such as a midplane of a blade server chassis, has an array of electrical vias passing through the circuit board that are arranged to receive the array of pins and at least one heat flux sensor positioned on one of the vias at the back of the midplane. The heat flux sensor is configured for generating an electrical signal in relation to an applied heat flux. A controller in communication with the heat flux sensor is configured for powering off the electrical power supply in response to the electrical signal reaching a setpoint corresponding to a selected heat flux threshold. | 03-10-2011 |
| 20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
