| Patent application number | Description | Published |
|---|
| 20080228821 | METHOD AND APPARATUS FOR MANAGING A DIGITAL INVENTORY OF MULTIMEDIA FILES STORED ACROSS A DYNAMIC DISTRIBUTED NETWORK - A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption. | 09-18-2008 |
| 20080229371 | DIGITAL MULTIMEDIA NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH SPEED USER DOWNLOAD OF DIGITAL FILES - A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption. | 09-18-2008 |
| 20080229374 | VIDEO NETWORK INCLUDING METHOD AND APPARATUS FOR HIGH SPEED DISTRIBUTION OF DIGITAL FILES OVER A NETWORK - A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption. | 09-18-2008 |
| 20080247543 | METHOD AND APPARATUS FOR PROTECTING DIGITAL RIGHTS OF COPYRIGHT HOLDERS OF PUBLICLY DISTRIBUTED MULTIMEDIA FILES - A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption. | 10-09-2008 |
| 20080250120 | METHOD AND APPARATUS FOR DISTRIBUTING A MULTIMEDIA FILE TO A PUBLIC KIOSK ACROSS A NETWORK - A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption. | 10-09-2008 |
| 20080274654 | ELECTRICAL INTERCONNECTION DEVICES INCORPORATING REDUNDANT CONTACT POINTS FOR REDUCING CAPACITIVE STUBS AND IMPROVED SIGNAL INTEGRITY - An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. | 11-06-2008 |
| 20080277151 | Electronic Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 11-13-2008 |
| 20080277675 | LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER - An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material. | 11-13-2008 |
| 20080288908 | SIMULTANEOUS DESIGN OF INTEGRATED CIRCUIT AND PRINTED CIRCUIT BOARD - A printed circuit board (PCB) circuit assembly is designed utilizing software to create the best performing “total design” by selecting component layout locations, optimizing the circuit routing of the PCB copper (or other metallic) traces, and simultaneously optimizing the interconnections between a “standard” die inside an integrated circuit (IC) package and an interposer substrate of the IC package. | 11-20-2008 |
| 20080297985 | Electronic Assemblies Without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 12-04-2008 |
| 20090008140 | Electronic Assemblies Without Solder and Methods for their Manufacture - An electronic assembly | 01-08-2009 |
| 20090017264 | ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE - A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals. | 01-15-2009 |
| 20090027137 | TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF - Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore. | 01-29-2009 |
| 20090034219 | Electronic Assemblies Without Solder Having Overlapping Components - An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components | 02-05-2009 |
| 20090035454 | Assembly of Encapsulated Electronic Components to a Printed Circuit Board - Electrical components | 02-05-2009 |
| 20090041977 | System for the Manufacture of Electronic Assemblies Without Solder - The present invention provides an electronic assembly | 02-12-2009 |
| 20090056997 | Electronic Assemblies Without Solder and Methods for their Manufacture | 03-05-2009 |
| 20090091017 | Partitioned Integrated Circuit Package with Central Clock Driver - Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks. | 04-09-2009 |
| 20090093173 | High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture - An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof. | 04-09-2009 |
| 20090108416 | DIRECT-CONNECT SIGNALING SYSTEM - A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board. | 04-30-2009 |
| 20090120668 | Cabled Signaling System and Components Thereof - An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole. | 05-14-2009 |
| 20090167334 | Controlled Impedance Structures for High Density Interconnections - An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described. | 07-02-2009 |
| 20090237901 | Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for their Manufacture | 09-24-2009 |
| 20090277677 | Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture - A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components | 11-12-2009 |
| 20090278139 | LIGHT-EMITTING DIODE PACKAGE ASSEMBLY - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections. | 11-12-2009 |
| 20100096166 | Flexible Circuit Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 04-22-2010 |
| 20100112829 | Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity - An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. | 05-06-2010 |
| 20100127402 | Interconnect System without Through-Holes - Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations. | 05-27-2010 |
| 20100151704 | High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture - An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof. | 06-17-2010 |
| 20100165525 | Low Profile Discrete Electronic Components and Applications of Same - Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package. | 07-01-2010 |
| 20100221871 | Multi-Surface IC Packaging Structures and Methods for their Manufacture - An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated. | 09-02-2010 |
| 20100258952 | Interconnection of IC Chips by Flex Circuit Superstructure - Integrated circuit chips have top and bottom surfaces. The bottom surfaces comprise a plurality of IC die terminals in flip-chip assembly with fine-pitch terminals formed on the top surface of corresponding interconnection substrate. Each IC chip includes one or more through-silicon vias and/or edge wrap connectors that extend to the top surface, terminating in IC die terminals. Flexible connectors are coupled between the IC die terminals on the top surfaces of corresponding first and second integrated circuit chips. The flexible connectors are preferably controlled impedance, and may include differential pairs, including twisted pairs, coaxial pairs, and broadside pairs. Conductive vias within the interconnection substrates couple the fine-pitch terminals to corresponding next-level terminals on the bottom surface of the respective interconnection substrates. The next level terminals of the interconnection substrates are interconnected with terminals of a printed circuit board. | 10-14-2010 |
| 20100284115 | ESD Protection Utilizing Radiated Thermal Relief - An ESD device with a protection structure utilizing radiated heat dissipation to prevent or reduce thermal failures. The device includes a voltage switchable polymer | 11-11-2010 |
| 20100289130 | Method and Apparatus for Vertical Stacking of Integrated Circuit Chips - A method and apparatus for constructing a packaged integrated circuit stack | 11-18-2010 |
| 20110017704 | METHOD OF ELECTRICALLY CONNECTING A MICROELECTRONIC COMPONENT - A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to one another aligned with the portions of the etch-resistant material. A microelectronic device is provided having one of a front face or a rear face overlying first ends of the posts. Second ends of the posts remote from the first ends face away from the microelectronic device as interconnection terminals for the connection component. At least some of the posts are electrically connected to the microelectronic device. | 01-27-2011 |
| 20110065332 | Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems - An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface. | 03-17-2011 |
| 20110127080 | Electronic Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly | 06-02-2011 |
